1
David Sherrer
David W Sherrer, Larry J Rasnake, John J Fisher: Device package and methods for the fabrication and testing thereof. Rohm and Haas Electronic Materials, Rohm And Haas Electronic Materials, February 22, 2007: US20070040268-A1

Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the ...


2
Charles Szmanda
James W Thackeray, Gerald B Wayton, Charles R Szmanda: Coating compositions for use with an overcoated photoresist. Rohm and Haas Electronic Materials, Rohm And Haas Electronic Materials, February 22, 2007: US20070042289-A1

Underlying coating compositions are provided for use with an overcoated photoresist composition. In one aspect, the coating composition can be crosslinked and comprise one or more components that contain one or more acid-labile groups and/or one or more base-reactive groups that are reactive followi ...


3
Eb Eshun
Anil K Chinthakindi, Douglas D Coolbaugh, John M Cotte, Ebenezer E Eshun, Zhong Xiang He, Anthony K Stamper, Eric J White: Integrated beol thin film resistor. International Business Machines Corporation, Ibm Microelectronics, February 22, 2007: US20070040239-A1

In the course of forming a resistor in the back end of an integrated circuit, an intermediate dielectric layer is deposited and a trench etched through it and into a lower dielectric layer by a controllable amount, so that the top of a resistor layer deposited in the trench is close in height to the ...


4
Matthias Bauer
Matthias Bauer: Deposition of silicon germanium on silicon-on-insulator structures and bulk substrates. Knobbe Martens Olson & Bear, February 22, 2007: US20070042572-A1

Methods are provided for producing SiGe-on-insulator structures and for forming strain-relaxed SiGe layers on silicon while minimizing defects. Amorphous SiGe layers are deposited by CVD from trisilane and GeH4. The amorphous SiGe layers are recrystallized over silicon by melt or solid phase epitaxy ...


5
yuan xing Lee
Yuan Xing Lee: Methods and systems for automatically characterizing non-linearities of a read-back signal of a recording system. Wagner Murabito & Hao, February 22, 2007: US20070041115-A1

A method for automatically characterizing non-linearities of a perpendicular read-back signal of a recording system is disclosed. The method includes using dibit extraction to obtain a read-back signal having a main pulse and a plurality of echoes where the read-back signal exhibits a baseline shift ...


6
yuan xing Lee
Shaohua Yang, Richard Leo Galbraith, Ksenija Lakovic, Yuan Xing Lee, Travis Oenning, Jongseung Park, Hideki Sawaguchi, Bruce A Wilson: Decoding techniques for correcting errors using soft information. Hitachi Global Technologies Netherlands, Steven J Cahill, February 22, 2007: US20070044006-A1

Two levels of error correction decoding are performed using first and second level decoders. A composite code formed by combining an inner component code and an outer component code can be used to decode the data and correct any errors. Performing two level decoding using a composite code allows the ...


7
yuan xing Lee
Shaohua Yang, Mario Blaum, Richard Leo Galbraith, Ksenija Lakovic, Yuan Xing Lee, Travis Oenning, Jongseung Park, Hideki Sawaguchi: Reduced complexity error correction encoding techniques. Hitachi Global Technologies Netherlands, Steven J Cahill, February 22, 2007: US20070043997-A1

An error correction encoder inserts redundant parity information into a data stream to improve system reliability. The encoder can generate the redundant parity information using a composite code. Dummy bits are inserted into the data stream in locations reserved for parity information generated by ...


8
Baarman David W, Stien Nathan P, Bachman Wesley J, Lord John James: Inductive power supply, remote device powered by inductive power supply and method for operating same. Access Business Group International, Baarman David W, Stien Nathan P, Bachman Wesley J, Lord John James, WOOD J Ray, February 22, 2007: WO/2007/020583 (106 worldwide citation)

An inductive power supply (9) includes a transceiver (28) for sending information between the remote device (11) and the inductive power supply. The remote device determines the actual voltage and then sends a command to the inductive power supply to change the operating frequency if the actual volt ...


9
Ohashi Tsutomu: Wireless tag ic circuit holding body, tag tape roll, and wireless tag cartridge. Brother, February 22, 2007: JP2007-048126 (95 worldwide citation)

PROBLEM TO BE SOLVED: To facilitate the fitting work when connecting an IC circuit part to an antenna side and completing a wireless tag circuit element, and increase productivity in the manufacturing process.SOLUTION: The wireless tag IC circuit holding body H comprises a base film 101b, antenna el ...


10
Schaller Laurent: Spinal tissue distraction devices. Benvenue Medical, Schaller Laurent, MCFARRON Gary W, February 22, 2007: WO/2007/022194 (67 worldwide citation)

Spinal tissue distraction devices (136) that include an elongated member which has a pre- deployed configuration for insertion between tissue layers and a deployed configuration in which the elongated member, by change of configuration, forms a helical or spiral support structure (141) for separatin ...