1
Nathaniel Brese Angelo Lamola
Angelo A Lamola, Nathaniel E Brese: Electronic device manufacture. Rohm and Haas Electronic Material, S Matthew Cairns, Rohm and Haas Electronic Material, July 27, 2006: US20060167174-A1

Compositions suitable for use as underfill materials in an integrated circuit assembly are provided. Also provided are methods of preparing integrated circuit assemblies containing certain underfill materials as well as electronic devices containing such integrated circuit assemblies.


2
Eb Eshun
Coolbaugh Douglas D, Eshun Ebenezer E, Hook Terence B, Rassel Robert M, Sprogis Edmund J, Stamper Anthony K, Murphy William J: Heat sink, resistor, and cooling method for resistor (heat sink for integrated circuit devices). Internatl Business Mach Corp &Lt IBM&Gt, July 27, 2006: JP2006-196894

PROBLEM TO BE SOLVED: To provide a resistor that has a heat sink with excellent heat conduction.SOLUTION: This heat sink includes a conduction path that has a high-thermal conductivity metal and other thermal conductors. In order that an electrical resistor may not be short-circuited to earth by thi ...


3
Brian Goodall
Edmund Elce, Takashi Hirano, Jeffrey C Krotine, Larry F Rhodes, Brian L Goodall, SaiKumar Jayaraman, W Chris McDougall, Shenliang Sun: Photosensitive compositions based on polycyclic polymers. Sumitomo Bakelite Company, The Webb Law Firm PC, July 27, 2006: US20060167197-A1

A copolymer composition including a copolymer having repeat units of structural formula I: where X is selected from —CH2—, —CH2—CH2— and O; m is an integer from 0 to 5; and each occurrence of R1-R4 are independently selected from H; C1 to C25 linear, branched, and cyclic alkyl, aryl, aralkyl, alkary ...


4
David Sherrer
David W Sherrer, John J Fisher: Coaxial waveguide microstructures and methods of formation thereof. Rohm and Haas Electronic Materials, Jonathan D Baskin, Rohm and Haas Electronic Material, July 27, 2006: US20060164190-A1

Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor ...


5
Erwin Meinders
Erwin Rinaldo Meinders, Celine Catherine Sarah Nicole: Cooling assembly comprising micro-jets. Koninklijke Philips Electronics, Philips Electronics North America Corporation, Intellectual Property & Standards, July 27, 2006: US20060164805-A1

The present invention relates to a cooling assembly (100) for cooling a heat source (2), in particular electronic components 7, with a coolant (C). To achieve a high coolant efficiency enabling the cooling of high heat fluxes, and in order to avoid the occurrence of free circulation areas in the coo ...


6
Erwin Meinders
Martijn Henri Richard Lankhorst, Femke Karina De Theije, Erwin Rinaldo Meinders, Ronald Martin Wolf: Electric device comprising phase change material. Koninklijke Philips Electronics Nc, Philips Electronics North America Corporation, Intellectual Property & Standards, July 27, 2006: US20060163554-A1

The electric device (1, 100) comprises a resistor (36, 250) comprising a phase change material which is able to be in a first phase and in a second phase. The resistor (36, 250) has an electrical resistance which has a first value when the phase change material is in the first phase and a second val ...


7
Bahman Qawami
Chang Robert C, Qawami Bahman, Sabet Sharghi Farshid: Internal maintenance schedule request for non-volatile memory system. Sandisk, July 26, 2006: EP1683027-A2

Methods and apparatus for enabling updates to data structures to be scheduled are disclosed. According to one aspect of the present invention, a method for operating a memory system with a non-volatile memory that includes a plurality of physical blocks and a plurality of data structures including a ...


8
Ulrich Klostermann
Daniel Christopher Worledge, Ulrich Klostermann: Techniques for reducing Neel coupling in toggle switching semiconductor devices. International Business Machines Corporation, Infineon Technologies North America, Ryan Mason & Lewis, July 25, 2006: US07081658 (1 worldwide citation)

The present invention provides techniques for data storage. In one aspect of the invention, a semiconductor device is provided. The semiconductor device comprises at least one free layer and at least one fixed layer, with at least one barrier layer therebetween. At least one pinned magnetic layer is ...


9
Benoit Sevigny
Benoit Sevigny: Image processing. Autodesk, Staas & Halsey, July 25, 2006: US07081898 (12 worldwide citation)

Apparatus is provided to color-suppress a source frame that is composed of a plurality of pixels, each pixel being represented by three components defining a position within a color space. The source frame, comprising a foreground image against a background of a substantially uniform backing color, ...


10
Belgacem Haba Belgacem (Bel) Haba
Thomas F Fox, Sayeh Khalili, Belgacem Haba, David Nguyen, Richard Warmke, Xingchao Yuan: Stacked semiconductor module. Morgan Lewis & Bockius Rambus, July 20, 2006: US20060160271-A1

The semiconductor module is provided that includes a semiconductor housing and a plurality of integrated circuit dice positioned within the housing. The semiconductor module also includes a programmable memory device positioned within the housing and electrically coupled to the plurality of integrat ...



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