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Eb Eshun
Coolbaugh Douglas D, Eshun Ebenezer E, Feilchenfeld Natalie, Gautsch Michael L, He Zhong Xiang, Moon Matthew D, Ramachandran Vidhya, Waterhouse Barbara: Formation of metal-insulator metal capacitor using a hardmask. International Business Machines Corporation, Coolbaugh Douglas D, Eshun Ebenezer E, Feilchenfeld Natalie, Gautsch Michael L, He Zhong Xiang, Moon Matthew D, Ramachandran Vidhya, Waterhouse Barbara, CANALE Anthony J, December 22, 2005: WO/2005/122245

Disclosed is a method of fabricating a metal-insulator-metal (MIM) capacitor. In this method, a dielectric layer (102, 106) is formed above a lower conductor layer (100) and an upper conductor layer (104, 108) is formed above the dielectric layer. The invention then forms an etch stop layer (200) ab ...


2
Belgacem Haba Belgacem (Bel) Haba
Teck Gyu Kang, Michael Estrella, Jae M Park, Kenneth Robert Thompson, Craig S Mitchell, Belgacem Haba: Image sensor package and fabrication method. Tessera, LERNER DAVID et al, Tessera, December 22, 2005: US20050279916-A1

An image sensor package is disclosed that reduces the overall size of known image sensor packages. The image sensor package includes an image sensor and image sensor controller that are arranged on a substrate so that the surfaces of the image sensor and image sensor controller are directly adjacent ...


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Chris Blackburn
John A Beatty, Christopher W Blackburn, Rory L Block, Chih Hui Jan, Terry D Warkentin: Method and apparatus for a gaming network architecture. Schwegman Lundberg Woessner & Kluth, December 22, 2005: US20050282628-A1

Embodiments of the invention relate generally to wagering games and, more particularly, to a gaming network linked to a plurality of gaming machines. The gaming network has a plurality of servers dedicated to providing a shared game to a plurality of gaming terminals. The shared game may be either c ...


5
Eugene Fitzgerald
David M Isaacson, Gianni Taraschi, Eugene A Fitzgerald: Semiconductor devices having bonded interfaces and methods for making the same. Massachusetts Institute of Technology, Jamie H Rose, Wolf Greenfield & Sacks PC, December 22, 2005: US20050280081-A1

A semiconductor-based structure includes first, second, and intermediate layers, with the intermediate layer bonded directly to the first layer, and in contact with the second layer. Parallel to the bonded interface, the lattice spacing of the second layer is different than the lattice spacing of th ...


6
Eugene Fitzgerald
David M Isaacson, Eugene A Fitzgerald: Strained silicon-on-silicon by wafer bonding and layer transfer. Jamie H Rose, Wolf Greenfield & Sacks PC, December 22, 2005: US20050280026-A1

A semiconductor-based structure includes first and second layers bonded directly to each other at an interface. Parallel to the interface, the lattice spacing of the second layer is different than the lattice spacing of the first layer. The first and second layers are each formed of essentially the ...


7
Marcos Laraia
Jose Marcos Laraia, Masahisa Niwa, Robert P Moehrke, Jose G Taveira: Reactive sensor modules using pade approximant based compensation and providing module-sourced excitation. MacPherson Kwok Chen & Heid, December 22, 2005: US20050283330-A1

Reactive sensors typically exhibit nonlinear response to the combination of an excitational signal (e.g., sinusoidally oscillating signal) and a physical parameter under measure (e.g., position of magnetic core member). Such sensors are typically sensitive to temperature variation. Systems and metho ...


8
Eugene Fitzgerald
Saurabh Gupta, Minjoo Larry Lee, Eugene A Fitzgerald: Strained tri-channel layer for semiconductor-based electronic devices. Jamie H Rose, Wolf Greenfield & Sacks PC, December 22, 2005: US20050279992-A1

A semiconductor-based structure includes a substrate layer, a compressively strained semiconductor layer adjacent to the substrate layer to provide a channel for a component, and a tensilely strained semiconductor layer disposed between the substrate layer and the compressively strained semiconducto ...


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Nuzzo Ralph G, Rogers John A, Menard Etienne, Lee Keon Jae, Khang Dahl Young, Sun Yugang, Meitl Matthew, Zhu Zhengtao: Methods and devices for fabricating and assembling printable semiconductor elements. The Board Of Trustees Of The University Of Illinois, Nuzzo Ralph G, Rogers John A, Menard Etienne, Lee Keon Jae, Khang Dahl Young, Sun Yugang, Meitl Matthew, Zhu Zhengtao, BARONE Stephen B, December 22, 2005: WO/2005/122285 (143 worldwide citation)

The invention provides methods and devices for fabricating printable semiconductor elements (555) and assembling printable semiconductor elements onto substrate surfaces (330). The present invention also provides stretchable semiconductor structures (760).


10
Kamisaka Koichi: Communication type recording medium. Hitachi Maxell, December 22, 2005: JP2005-352858 (127 worldwide citation)

PROBLEM TO BE SOLVED: To provide a communication type recording medium such as a noncontact IC card or an RFID system that increases a communication range.SOLUTION: A first wiring 110 formed on one side of a base forms: (1) a first coil pattern 111 formed at the end of the first wiring while facing ...



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