Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Richard E Perego, David Nguyen, Billy W Garrett, Ely Tsern, Craig E Hampel, Wai Yeung Yip: Multiple channel modules and bus systems using same. Rambus, Hunton & Williams Rambus, June 30, 2005: US20050142950-A1

Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.

Nathaniel Brese
Nathaniel E Brese, Michael P Toben: Electronic devices and methods of forming electronic devices. Rohm and Haas Electronic Materials, Edwards & Angell, June 30, 2005: US20050139644-A1

Disclosed are methods of forming an electronic device. The methods involve (a) providing a substrate and a component to be bonded to the substrate, wherein the component is chosen from an electronic component, an optical component, a device lid, and a combination thereof; (b) applying solder paste t ...

Belgacem Haba Belgacem (Bel) Haba
David B Tuckerman, Richard Dewitt Crisp, Belgacem Haba, Giles Humpston, Jae M Park: Package element and packaged chip having severable electrically conductive ties. Tessera, Lerner David Litenberg Krumholz & Mentlik, June 30, 2005: US20050139984-A1

According to one aspect of the invention, a capped chip is provided which includes a chip having a front surface, a back surface opposite the front surface and a plurality of bond pads exposed at at least one of the front and back surfaces. A cap is joined to the chip, the cap overlying one of the f ...

Sandeep Tyagi
Sandeep Tyagi, Deval Gupta, Raja Krishnamurthy, Rajashekhar Shiddappa Totad, Satish Kumar Gaggar: Resin compositions with fluoropolymer filler combinations. General Electric Company, Henry H Gibson, GE Plastics, June 30, 2005: US20050143508-A1

A thermoplastic resin composition is disclosed which comprises a matrix polymer, and a combination of a fluoropolymer that can be at least partially encapsulated by an encapsulating polymer, and a filler. Methods for making the thermoplastic resin composition and articles made of such compositions a ...

Jens Nagel
Carlos I McEvilly, Manjirnath A Chatterjee, Jin Guo, Jens Nagel, Rudolf Schusteritsch, Marie E White: Method and system for user-definable fun messaging. Marshall Gerstein & Borun, June 30, 2005: US20050143102-A1

A method and apparatus are used for encoding (310) and decoding (408) a message encoded with at least one entertainment component after receiving the message contents from a sender. Instructions from the sender are used for selecting (304) the encoding method for the message content to provide the e ...

Nathaniel Brese
Nathaniel E Brese, Michael P Toben: Methods of forming solder areas on electronic components and electronic components having solder areas. Rohm and Haas Electronic Materials, Edwards & Angell, June 23, 2005: US20050133572-A1

Disclosed are methods of forming solder areas on electronic components. The methods involve: (a) providing a substrate having one or more contact pads; and (b) applying a solder paste over the contact pads. The solder paste includes a carrier vehicle and a metal component having metal particles. The ...

Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Belgacem Haba: System and method for increasing the ball pitch of an electronic circuit package. Tessera, Stevens Law Group, June 23, 2005: US20050133891-A1

The invention provides an electronic package comprising a die bonded to a substrate, where the die has a fine pitch and the substrate has a coarse pitch. The dies and the substrate each have a plurality of individual lead frame interconnect arrays, with one end of an interconnect bonded to the die a ...

Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz: System and method for increasing the number of IO-s on a ball grid package by wire bond stacking of same size packages through apertures. Tessera, Stevens Law Group, June 23, 2005: US20050133899-A1

A multi-layer electronic package having polymeric tape layers, where at least one of the polymeric tape layers has a via, through hole, or aperture therein to pass wiring between the layers. This enables a balance of package size, adhesive thickness, chip access, inventory management, package width, ...

Sanjay Chaturvedi
Leonard Edward Bogan, Fernando AP Cavalcanti, Nitin Chadda, Sanjay Chaturvedi, Anne Mae Gaffney, Scott Han, Peter D Klugherz, Daniel Martenak, Mark Anthony Silvano, Elsie Mae Vickery, Donald L Zolotorofe: Process for the selective (AMM)oxidation of lower molecular weight alkanes and alkenes. Rohm And Haas Company, June 23, 2005: US20050137415-A1

An improved process for the production of unsaturated carboxylic acids and unsaturated nitrites from their corresponding C3 to C5 alkanes, or mixtures of C3 to C5 alkanes and alkenes, that involves a multi-stage reaction system which employs both separation of the oxidation product from one or more ...

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