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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Richard E Perego, David Nguyen, Billy W Garrett, Ely Tsern, Craig E Hampel, Wai Yeung Yip: Multiple channel modules and bus systems using same. Rambus, Hunton & Williams Rambus, June 30, 2005: US20050142950-A1

Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.


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Nathaniel Brese
Nathaniel E Brese, Michael P Toben: Electronic devices and methods of forming electronic devices. Rohm and Haas Electronic Materials, Edwards & Angell, June 30, 2005: US20050139644-A1

Disclosed are methods of forming an electronic device. The methods involve (a) providing a substrate and a component to be bonded to the substrate, wherein the component is chosen from an electronic component, an optical component, a device lid, and a combination thereof; (b) applying solder paste t ...


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Belgacem Haba Belgacem (Bel) Haba
David B Tuckerman, Richard Dewitt Crisp, Belgacem Haba, Giles Humpston, Jae M Park: Package element and packaged chip having severable electrically conductive ties. Tessera, Lerner David Litenberg Krumholz & Mentlik, June 30, 2005: US20050139984-A1

According to one aspect of the invention, a capped chip is provided which includes a chip having a front surface, a back surface opposite the front surface and a plurality of bond pads exposed at at least one of the front and back surfaces. A cap is joined to the chip, the cap overlying one of the f ...


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Sandeep Tyagi
Sandeep Tyagi, Deval Gupta, Raja Krishnamurthy, Rajashekhar Shiddappa Totad, Satish Kumar Gaggar: Resin compositions with fluoropolymer filler combinations. General Electric Company, Henry H Gibson, GE Plastics, June 30, 2005: US20050143508-A1

A thermoplastic resin composition is disclosed which comprises a matrix polymer, and a combination of a fluoropolymer that can be at least partially encapsulated by an encapsulating polymer, and a filler. Methods for making the thermoplastic resin composition and articles made of such compositions a ...


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Jens Nagel
Carlos I McEvilly, Manjirnath A Chatterjee, Jin Guo, Jens Nagel, Rudolf Schusteritsch, Marie E White: Method and system for user-definable fun messaging. Marshall Gerstein & Borun, June 30, 2005: US20050143102-A1

A method and apparatus are used for encoding (310) and decoding (408) a message encoded with at least one entertainment component after receiving the message contents from a sender. Instructions from the sender are used for selecting (304) the encoding method for the message content to provide the e ...


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Nathaniel Brese
Nathaniel E Brese, Michael P Toben: Methods of forming solder areas on electronic components and electronic components having solder areas. Rohm and Haas Electronic Materials, Edwards & Angell, June 23, 2005: US20050133572-A1

Disclosed are methods of forming solder areas on electronic components. The methods involve: (a) providing a substrate having one or more contact pads; and (b) applying a solder paste over the contact pads. The solder paste includes a carrier vehicle and a metal component having metal particles. The ...


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Belgacem Haba Belgacem (Bel) Haba
Masud Beroz, Belgacem Haba: System and method for increasing the ball pitch of an electronic circuit package. Tessera, Stevens Law Group, June 23, 2005: US20050133891-A1

The invention provides an electronic package comprising a die bonded to a substrate, where the die has a fine pitch and the substrate has a coarse pitch. The dies and the substrate each have a plurality of individual lead frame interconnect arrays, with one end of an interconnect bonded to the die a ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz: System and method for increasing the number of IO-s on a ball grid package by wire bond stacking of same size packages through apertures. Tessera, Stevens Law Group, June 23, 2005: US20050133899-A1

A multi-layer electronic package having polymeric tape layers, where at least one of the polymeric tape layers has a via, through hole, or aperture therein to pass wiring between the layers. This enables a balance of package size, adhesive thickness, chip access, inventory management, package width, ...


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Eric First, M.D.
First Eric R: Botulinum toxin therapy for skin disorders. Allergan, First Eric R, DONOVAN Stephen, June 23, 2005: WO/2005/056050 (2 worldwide citation)

Methods for treating skin disorders by local administration of a Clostridial toxin, such as a botulinum toxin, to a patient with a skin disorder, such as a wart, corn, callus or bunion.



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