61
Urano Kouichi, Ochiai Hiroko: Method of forming gusset and knitwear comprising gusset formed. Shima Seiki Manufacturing, May 31, 2004: KR1020047004627

A method of forming a gusset in an armpit portion in a process of forming an arm hole with the diameter of a cylindrical element gradually reduced from the arm pit toward the shoulder while joining the sleeve and the body of a knitwear together, the method comprising the steps of: a) knitting the kn ...


62
Bombardelli Ezio, Fontana Gabriele, Battaglia Arturo, Guerrini Andrea, Baldelli Ereonora: A process for the preparation of the 14beta-hydroxy-baccatin iii-1,14- carbonate. Indena, May 31, 2004: KR1020047004622

A process for the preparation of 14β-hydroxy-baccatin III-1,14- carbonate useful for the preparation of novel taxane derivatives with antitumor activity.


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Bombardelli Ezio, Fontana Gabriele, Gelmi Maria Luisa, Pocar Donato: A process for the preparation of the 14beta-hydroxy-baccatin iii-1,14- carbonate. Indena, May 31, 2004: KR1020047004621

A process for the preparation of 14β-hydroxy-baccatin III-1,14- carbonate useful for the preparation of novel taxane derivatives with antitumor activity.


64
Winn Martin, Boyd Steven A, Hutchins Charles W, Jae Hwan Soo, Tasker Andrew S, Vongeldern Thomas W, Kester Jeffrey A, Sorensen Bryan K: Endothelin antagonists. Abbott Laboratories, May 31, 2004: KR1020047004682

A compound of formula (I) or a pharmaceutically acceptable salt thereof is disclosed, as well as processes for and intermediates in the preparation thereof, and a method of antagonizing endothelin.


65
Yoshimura Atsushi: Semiconductor device and semiconductor device manufacturing method. Kabushiki Kaisha Toshiba, May 31, 2004: KR1020047004575

A semiconductor device manufacturing method comprising the steps of preparing a first substrate (10) including an integrated circuit chip (12), a first connection terminal electrically connected to a terminal of the integrated circuit chip, and a first connection portion (16a, 17a) spaced from the f ...


66
Akao Masahide, Yamaoka Michiyuki, Masuda Masayoshi: Cellular telephone. Sanyo Electric, Sanyo Telecommunications, May 31, 2004: KR1020047004585

A cellular telephone (100) searching for a destination base station in accordance with a soft handoff instruction and a hard handoff instruction accepts a soft handoff instruction or a hard handoff instruction which may contain a search window width specification from the base station. When the hard ...


67
Korfhage Kurt Matthew, Maul Michael David, Meade Alexander Douglas, Stickler Tom E, Wang Liqun Larry: Dynamic end seal for image forming apparatus. Lexmark International, May 31, 2004: KR1020047004593

An end seal (100) for use in an electrophotographic image forming apparatus uses an array (150) of ridges (or grooves) (152) to urge toner inwardly so as to help prevent toner escape. The end seal works in conjunction with a cleaning blade (90). The end seal includes a blade pocket (130) for mating ...


68
Hsu Henry H: Method for treating hepatitis c virus infection in treatment failure patients. Intermune, May 31, 2004: KR1020047004602

The present invention provides methods for treating individuals having a hepatitis C virus (HCV) infection, which individuals have failed to respond to therapy with an IFN-a other than consensus interferon (CIFN), or who, following cessation of therapy with an IFN-a other than CIFN, have suffered re ...


69
Iikubo Yuichi, Owens Stephen, Cohn Mitchel, Brandstadter Stephan M, Hedrick Vicki E, Boggs Janet K, Chengpingchien John, Sacarias Julie: Materials and methods for the production and purification of chlorofluorocarbons and hydrofluorocarbons. Great Lakes Chemical Corporation, May 31, 2004: KR1020047004601

Methods and materials are provided for the production of essentially isomerically pure perhalogenated and partially halogenated compounds. One embodiment of the present invention provides a process for the production of essentially isomerically pure CFC-2l6aa. Other embodiments include processes for ...


70
Ueno Ryuichi: Phenolic resin, epoxy resin, processes for production thereof and epoxy resin composition. Nippon Petrochemicals Company, May 31, 2004: KR1020047004595

Phenolic and epoxy resins useful as encapsulation material for semiconductor devices, which are improved in flow properties and moldability and can give cured articles excellent in heat resistance. Specifically, a phenolic resin containing a compound (A) of the general formula (1) and a compound (B) ...