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Sanjay Chaturvedi
Sanjay Chaturvedi, Jingguang Chen, Michael Bruce Clark, Anne Mae Gaffney: PVD supported mixed metal oxide catalyst. Rohm And Haas Company, December 25, 2003: US20030236163-A1

A supported catalyst comprising a mixed metal oxide is useful for the vapor phase oxidation of an alkane or a mixture of an alkane and an alkene to an unsaturated carboxylic acid and for the vapor phase ammoxidation of an alkane or a mixture of an alkane and an alkene to an unsaturated nitrile.


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Craig Allen
Jeffrey Scott Gibson, Craig Allen Rodgers, Erik Stephen Lake: Adjustable magnetic trip assembly for circuit breaker. Eaton Corporation, John A Kastelic, Martin J Moran, December 23, 2003: US06667675 (1 worldwide citation)

An adjustable magnetic trip unit for a circuit breaker includes a torsion spring which applies a bias force to the plunger of a trip solenoid. The torsion spring is mounted on a driven bevel gear and wound by an adjustment knob coupled to a driving bevel gear to adjust the current at which the solen ...


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Xavier Baie
Brent A Anderson, Xavier Baie, Randy W Mann, Edward J Nowak, Jed H Rankin: High mobility transistors in SOI and method for forming. Schmeiser Olsen Watts, December 18, 2003: US20030232467-A1

The present invention provides a device design and method for forming Field Effect Transistors (FETs) that have improved performance without negative impacts to device density. The present invention forms high-gain p-channel transistors by forming them on silicon islands where hole mobility has been ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Konstantine Karavakis: Components with releasable leads. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 16, 2003: US06664484 (17 worldwide citation)

A connection component for making connections to a microelectronic element is made by providing leads on a surface of a polymeric layer and etching the polymeric layer to partially detach the leads from the polymeric layer, leaving a portion of each lead releasably connected to the polymeric layer b ...


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Belgacem Haba Belgacem (Bel) Haba
John W Smith, Belgacem Haba: Semiconductor chip package with interconnect structure. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 16, 2003: US06664621 (8 worldwide citation)

An active microelectronic element such as a semiconductor chip or wafer is bonded to an interconnect element having substantially the same coefficient of thermal expansion as the active element using small, rigid bonds, desirably made by a solid-phase bonding technique, which accommodate numerous cl ...


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Deodatta Shenai-Khatkhate
Deodatta V Shenai Khatkhate, Michael B Power, Artashes Amamchyan: Trialkyl Group VA metal compounds. Shipley Company L L C, S Matthew Cairns, December 9, 2003: US06660874 (4 worldwide citation)

Disclosed are methods of preparing trialkyl Group VA metal compounds in high yield and high purity. Such trialkyl Group VA metal compounds are substantially free of oxygenated impurities, ethereal solvents and metallic impurities.


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Belgacem Haba Belgacem (Bel) Haba
Joseph C Fjelstad, Para K Segaram, Belgacem Haba: Direct-connect signaling system. Shemwell Gregory & Courtney, December 4, 2003: US20030222282-A1

A direct-connect signaling system including a printed circuit board and first and second integrated circuit packages disposed on the printed circuit board. A plurality of electric signal conductors extend between the first and second integrated circuit packages suspended above the printed circuit bo ...


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Belgacem Haba Belgacem (Bel) Haba
Donald V Perino, Belgacem Haba, Sayeh Khalili: Multiple channel modules and bus systems using same. Rambus, Pennie & Edmonds, December 2, 2003: US06657871 (38 worldwide citation)

Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.



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