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David Sherrer
David W Sherrer, Gregory A Ten Eyck, Dan A Steinberg, Neal Ricks: Single mask technique for making positive and negative micromachined features on a substrate. Shipley Company L L C, Jonathan D Baskin, September 30, 2003: US06627096 (17 worldwide citation)

Methods for making a micromachined device (e.g. an microoptical submount) having positive features (extending up from a device surface) and negative features (extending into the device surface). The present techniques locate the postive feature and negative features according to a single mask step. ...


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Deodatta Shenai-Khatkhate
Deodatta Vinayak Shenai Khatkhate, Michael Brendan Power, Artashes Amamchyan, Ronald L DiCarlo: Alkyl Group VA metal compounds. Shipley Company, Edwards & Angell, Dike Bronstein Roberts & Cushman IP Group, September 25, 2003: US20030181746-A1

Disclosed are methods of preparing monoalkyl Group VA metal dihalide compounds in high yield and high purity by the reaction of a Group VA metal trihalide with an organo lithium reagent or a compound of the formula RnM1X3n , where R is an alkyl, M1 is a Group IIIA metal, X is a halogen and n is an i ...


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Deodatta Shenai-Khatkhate
Deodatta Vinayak Shenai Khatkhate, Ronald L DiCarlo: Organoindium compounds. Shipley Company, Edwards & Angell, Dike Bronstein Roberts & Cushman IP Group, September 25, 2003: US20030181745-A1

Disclosed are trialkylindium compounds containing two bulky alkyl groups that are liquids or easily liquefiable solids and have sufficient vapor pressure for use in vapor deposition processes, as well as methods of depositing indium containing films using such compounds.


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Brian Goodall
Larry Funderburk Rhodes, Andrew Bell, R Ravikiran, John C Fondran, Saikumar Jayaraman, Brian Leslie Goodall, Richard A Mimna, John Henry Lipian: Polymerized cycloolefins using transition metal catalyst and end products thereof. Hudak Shunk & Farine Co Lpa, September 25, 2003: US20030181607-A1

Methods for the addition polymerization of cycloolefins using a cationic Group 10 metal complex and a weakly coordinating anion of the formula: [(R)zM(L)x(L)y]b[WCA]d wherein [(R)zM(L)x(L)y] is a cation complex where M represents a Group 10 transition metal; R represents an anionic hydrocarbyl conta ...


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Sanjay Chaturvedi
Sanjay Chaturvedi, Anne Mae Gaffney, Scott Han, Michele Doreen Heffner, Ruozhi Song: Halogen promoted multi-metal oxide catalyst. Rohm and Haas Company, September 23, 2003: US06624111 (10 worldwide citation)

A catalyst comprising a promoted mixed metal oxide is useful for the vapor phase oxidation of an alkane or a mixture of an alkane and an alkene to an unsaturated carboxylic acid and for the vapor phase ammoxidation of an alkane or a mixture of an alkane and an alkene to an unsaturated nitrile.


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Xavier Baie
Brent A Anderson, Xavier Baie, Randy W Mann, Edward J Nowak, Jed H Rankin: High mobility transistors in SOI and method for forming. International Business Machines Corporation, Mark F Chadurjian, Schmeiser Olsen & Watts, September 23, 2003: US06624478 (25 worldwide citation)

The present invention provides a device design and method for forming Field Effect Transistors (FETs) that have improved performance without negative impacts to device density. The present invention forms high-gain p-channel transistors by forming them on silicon islands where hole mobility has been ...


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Sanjay Chaturvedi
Sanjay Chaturvedi, Anne Mae Gaffney, Scott Han, Michele Doreen Heffner, Ruozhi Song: Halogen promoted multi-metal oxide catalyst. Rohm And Haas Company, September 18, 2003: US20030176734-A1

A catalyst comprising a promoted mixed metal oxide is useful for the vapor phase oxidation of an alkane or a mixture of an alkane and an alkene to an unsaturated carboxylic acid and for the vapor phase ammoxidation of an alkane or a mixture of an alkane and an alkene to an unsaturated nitrile.


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Belgacem Haba Belgacem (Bel) Haba
Michael Warner, Philip Damberg, John B Riley, David Gibson, Young Gon Kim, Belgacem Haba, Vernon Solberg: Methods of making microelectronic assemblies including folded substrates. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 11, 2003: US20030168725-A1 (1 worldwide citation)

A stacked microelectronic assembly comprises a plurality of subassemblies including folded substrates and at least one microelectronic element. The subassemblies are stacked substantially vertically.


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David Sherrer
Dan A Steinberg, David W Sherrer, Mindaugas F Daurtartas, Robert G Schinazi: Fiber array with V-groove chip and mount. Maria M Ellseeva Esq, Brown Rudnick Berlack Isreals, September 11, 2003: US20030169994-A1

A molded mount of non-crystalline polymer material is configured to have a channel for retaining a silicon chip having a plurality of juxtaposed V-groove formed in a top surface between right and left side portions, thereof, a recessed area being provided in the channel behind the chip for accommoda ...



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