Isaiah Oladeji
Robert Y S Huang, Scott Jessen, Subramanian Karthikeyan, Joshua Jia Li, Isaiah O Oladeji, Kurt Geroge Steiner, Joseph Ashley Taylor: Mask layer and dual damascene interconnect structure in a semiconductor device. James H Beusse Esquire, Beusse Brownlee Bowdoin & Wolter Pa, June 26, 2003: US20030119305-A1

A mask layer having four mask films used in the fabrication of an interconnect structure of a semiconductor device. The first mask film and the third mask film have substantially equal etch rates. The second mask film and the fourth have substantially equal etch rates film, and different from that o ...

Ravi Laxman
Chongying Xu, Thomas H Baum, Alexander S Borovik, Ziyun Wang, James TY Lin, Scott Battle, Ravi K Laxman: Method for removal of impurities in cyclic siloxanes useful as precursors for low dielectric constant thin films. Intellectual Property Technology Law, June 26, 2003: US20030116421-A1 (1 worldwide citation)

A process for reducing the level(s) of water and/or other impurities from cyclosiloxanes by either azeotropic distillation, or by contacting the cyclosiloxane compositions with an adsorbent bed material. The purified cyclosiloxane material is useful for forming low-dielectric constant thin films hav ...

Brian Goodall
Andrew Bell, Larry F Rhodes, Brian L Goodall, John C Fondran: In mold addition polymerization of norbornene-type monomers using group 10 metal complexes. The BF Goodrich Company, Nestor W Shust, Hudak & Shunk Co LPA, June 26, 2003: US20030120006-A1

A catalyst system and a process for the bulk addition polymerization or of polycyclic olefins, such as norbornene, methylnorbornene, ethylnorbornene, butylnorbornene or hexylnorbornene, 1,2,3,4,4a,5,8,8a-octahydro-1,4:5,8-dimethanonapthalene, 5,5-(1,2-ethanediyl)bisbicyclo[2.2.1]hept-2-ene, and 1,4, ...

Jaime Braverman
Jaime Braverman, Arthur E Garavaglia, Ali Yahiaoui, Robert C Diluccio: Feminine care product with discrete areas of a skin wellness additive. Kimberly-Clark Worldwide, Stephen E Bondura, Dority & Manning Attorneys at Law PA, June 19, 2003: US20030114812-A1

A feminine care absorbent article includes an outer cover and an absorbent structure in superposed relation to the outer cover and defining a bodyfacing surface. A lotion formulation is deposited on the bodyfacing surface in discrete locations targeted for specific regions of the wearer's body.

David Sherrer
David W Sherrer, John Fisher: Optical switch assembly with flex plate and method for making. Haleos, June 12, 2003: US20030108272-A1 (3 worldwide citation)

An optical switch and method for assembling are described. Optical arrays are mounted on a flex plate with an interface between them. The direction of certain forces on the flex plate allows coupling/decoupling of the optical arrays. The flex plate includes an area which exhibits a different flex pr ...

Ravi Laxman
Patrick A Van Cleemput, Ravi Kumar Laxman, Jen Shu, Michelle T Schulberg, Bunsen Nie: Dielectric films with low dielectric constants. Beyer Weaver & Thomas, June 10, 2003: US06576345 (47 worldwide citation)

Thin films possessing low dielectric constants (e.g., dielectric constants below 3.0) are formed on integrated circuits or other substrates. Caged-siloxane precursors are linked in such a way as to form dielectric layers, which exhibit low dielectric constants by virtue of their silicon dioxide-like ...

Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Methods of making anisotropic conductive elements for use in microelectronic packaging. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 5, 2003: US20030102154-A1

A layer of an anisotropic material has a pair of substantially flat oppositely-directed major faces, a vertical direction extending between the faces and horizontal directions transverse to the vertical direction, the layer including a dielectric material and a plurality of conductive particles in t ...

Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Microelectronic packaging methods and components. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 3, 2003: US06572781 (3 worldwide citation)

A sheet including lead regions with conductors and a main region surrounding the lead regions is formed on the front surface of a microelectronic element such as a wafer, or assembled thereto, so that the conductors are connected to contacts on the microelectronic element. After the sheet is in plac ...