David Sherrer
David W Sherrer, Noel Heiks, Dan Steinberg: Inductive magnetic recording head having inclined magnetic read/write pole and method of making same. Shipley Company L L C, Brown Rudnick Berlack Israels, December 31, 2002: US06501619 (31 worldwide citation)

A thin film magnetic read/write head which has a return pole and a read/write pole adjacent to the return pole. The return pole has a vertical sidewall which has a predetermined height and is perpendicular to a substrate. An insulating layer is disposed on the sidewall between the return pole and re ...

David Sherrer
Dan A Steinberg, David W Sherrer, Mindaugas F Dautartas, Arden Jeantilus: Optical assembly for coupling with integrated optical devices and method for making. Haleos, December 26, 2002: US20020196998-A1

An optical assembly which allows for passive alignment of the various elements is described. A substrate with a cut out portion and an upper surface is utilized as a mount for an optical array and an imaging assembly. The optical array, which preferably includes a plurality of optical fibers is posi ...

Benjamin Mattes
Wen Lu, Benjamin R Mattes, Andrei G Fadeev, Baohua Qi: Stable conjugated polymer electrochromic devices incorporating ionic liquids. Samuel M Freund, December 19, 2002: US20020191270-A1

Electrochemical synthesis of conjugated polymers in ionic liquids, achievement of electroactivity and electrochroism of conjugated polymers in ionic liquids, and the use of the resulting conjugated polymers for the fabrication of electrochromic devices incorporating ionic liquids as electrolytes are ...

Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Lidless socket and method of making same. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 17, 2002: US06493932 (6 worldwide citation)

A method of using a socket to electrically interconnect a microelectronic assembly having electrically conductive joining units and a substrate having electrically conductive contacts includes providing a socket having a plurality of apertures with deflectable, resilient lip regions, and positioning ...

Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Hamid Eslampour, Konstantine Karavakis: Components with releasable leads. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 17, 2002: US06495462 (15 worldwide citation)

A microelectronic component is made by providing a starting structure having a dielectric layer and leads on a surface of the dielectric layer. Ends of the leads are connected to contacts on a microelectronic element, such as the contacts on a semiconductor chip or wafer. The dielectric layer is the ...

Katherina Babich
Katherina Babich, Alessandro Calleqari, Stephen Alan Cohen, Alfred Grill, Christophr Vincent Jahnes, Vishnubhai Vitthalbhai Patel, Sampath Purushothaman, Katherine Lynn Saenger: Stabilization of fluorine-containing low-k dielectrics in a metal/insulator wiring structure by ultraviolet irradiation. International Business Machines Corporation, Scully Scott Murphy & Presser, December 12, 2002: US20020185741-A1

A method for providing regions of substantially lower fluorine content in a fluorine containing dielectric is described incorporating exposing a region to ultraviolet radiation and annealing at an elevated temperature to remove partially disrupted fluorine from the region. The invention overcomes th ...

Deodatta Shenai-Khatkhate
Deodatta V Shenai Khatkhate, Michael B Power, Artashes Amamchyan: Trialkyl Group VA metal compounds. Shipley Company, Edwards & Angell, Dike Bronstein Roberts & Cushman IP Group, December 12, 2002: US20020188145-A1

Disclosed are methods of preparing trialkyl Group VA metal compounds in high yield and high purity. Such trialkyl Group VA metal compounds are substantially free of oxygenated impurities, ethereal solvents and metallic impurities.

Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Klaus Jurgen Wolter: Microelectronic joining processes with bonding material application. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 10, 2002: US06492251 (41 worldwide citation)

A microelectronic element is provided with small meniscus-shaped solder masses, and these masses are connected to deformable connecting elements such as flexible leads. The connections can be made under vacuum in a chamber or in a space enclosed in part by a flexible film. Atmospheric pressure on th ...

Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Forming microelectronic connection components by electrophoretic deposition. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 10, 2002: US06492201 (78 worldwide citation)

An electrically conductive article such as a sheet having holes therein is coated with a dielectric polymer using a multi-stage electrophoretic deposition process. A coating of uncured polymer is deposited electrophoretically and then cured. After the first polymer is cured, the part is subject to a ...

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