Maricela Morales
Peter Trefonas: Photoresist compositions comprising blends of ionic and non-ionic photoacid generators. Shipley Company, Edwards & Angell, Dike Bronstein Roberts & Cushman IP Group, November 22, 2001: US20010044072-A1

The invention provides new photoresist compositions that contain a resin binder and a blend of non-ionic and ionic PAGS. Preferred resists of the invention preferably are imaged with 248 nm and/or 193 nm exposure wavelengths to provide highly resolved small dimension features.

Terao Yoshitaka, Komatsu Takashi, Go Seikan: Plasma display and its manufacturing method. Samsung Yokohama Research Institute, November 22, 2001: JP2001-325888 (167 worldwide citation)

PROBLEM TO BE SOLVED: To provide a plasma display and a manufacturing method thereof without requiring a calcination process for forming partition walls, and capable of applying a screen printing method for forming electrodes and dielectric layers.SOLUTION: In the plasma display, each of partition w ...

Kimura Hajime: Electronic device and driving method therefor. Semiconductor Energy Lab, November 22, 2001: JP2001-324958 (86 worldwide citation)

PROBLEM TO BE SOLVED: To improve the problems starting with a lack of brightness caused by a decrease in a duty ratio (the ratio of the emitting period to the non- emitting period) by using a new driving method and circuit in an electronic device.SOLUTION: This method and circuit are characterized i ...

Hosono Koji, Nakamura Hiroshi, Takeuchi Takeshi, Imamiya Kenichi: Non-volatile semiconductor memory. Toshiba, November 22, 2001: JP2001-325796 (49 worldwide citation)

PROBLEM TO BE SOLVED: To provide an EEPROM having a write-in/read-out circuit in which a cache function and a multi-level logic operation function can be realized in optimum conditions.SOLUTION: A rewriting/read-out circuit 140 is connected selectively to a memory cell array, while the circuit has a ...

Sekiya Kazuma, Tateiwa Satoshi: Split method of brittle substrate. Disco Abrasive Syst, November 22, 2001: JP2001-326194 (48 worldwide citation)

PROBLEM TO BE SOLVED: To provide the split method of a brittle substrate, which enables accurate and reliable slicing of the brittle substrate without exerting damages on chip regions on the substrate, when the substrate is sliced with a laser beam.SOLUTION: The split method of a brittle substrate, ...

Kimura Naoto: Manufacturing method of semiconductor device. Nec Kyushu, November 22, 2001: JP2001-326236 (48 worldwide citation)

PROBLEM TO BE SOLVED: To prevent the warpage of a semiconductor device caused by synthetic resin sealing.SOLUTION: On a chip substrate 2 made of a synthetic resin, a plurality of semiconductor chips 4 are mutually bonded and fixed at intervals. On the chip substrate 2 around at least each semiconduc ...

Fujimoto Yoshioki, Nakazato Takashi, Iwasa Kenji: Refrigerator. Sanyo Electric, November 22, 2001: JP2001-324258 (38 worldwide citation)

PROBLEM TO BE SOLVED: To provide a refrigerator having a structure capable of easily exchanging an information display or an information terminal.SOLUTION: A refrigerator 1 having at least either of a door 2 and a drawer, which enables contents to be put therein or taken out therefrom, comprises an ...

Watanabe Tetsuya, Toyoshima Mitsunobu: Method for utilizing computer resource and system for the same. Toyo Eng, November 22, 2001: JP2001-325041 (38 worldwide citation)

PROBLEM TO BE SOLVED: To open and resell surplus parts of the information processing capabilities of a computer connected to a network to a third person, and to allow a user to easily use computer resources, as necessary.SOLUTION: A request from a user 3 for calculation processing is accepted (step ...

Takei Masashi, Tonomura Takuya: Metal colloid solution, conductive ink, conductive coating and conductive coating forming base film. Bando Chem, November 22, 2001: JP2001-325831 (36 worldwide citation)

PROBLEM TO BE SOLVED: To provide a metal colloid solution having proper dispersing stability even with an increase in metal content, a conductive ink prepared by using the metal colloidal solution, a conductive coating having an improved conductivity, and a conductive coating forming a base film.SOL ...

Ashiwake Noriyuki, Kawamura Keizo: Cooling device for electronic equipment. Hitachi, November 22, 2001: JP2001-326311 (32 worldwide citation)

PROBLEM TO BE SOLVED: To relax the limit amount of heat that can be taken by an evaporator in the cooling device of electronic equipment in a system for performing forced flow cooling by mounting the evaporator of a refrigerating machine to a module directly.SOLUTION: A channel in the evaporator is ...