1
Hazama Katsuki: Disk-shaped storage medium and its accommodation case. Nippon Steel, January 21, 2000: JP2000-021128 (123 worldwide citation)

PROBLEM TO BE SOLVED: To easily and securely grasping the sales condition of a product (a disk-shaped storage medium) and the product management such as antitheft without troubling a person, and, furthermore, to transfer various information for guaranteeing not only the information on the product ma ...


2
Nakamichi Masumi, Murao Aritake: Inductor, resonance circuit using the same, matching circuit, antenna circuit, and oscillation circuit. Sharp, January 21, 2000: JP2000-021639 (123 worldwide citation)

PROBLEM TO BE SOLVED: To provide an inductor, a resonance circuit using a inductor, matching circuit, and an active antenna circuit which has various functions despite its small-size and light-weight. SOLUTION: A closed magnetic circuit 1-1 with high magnetic permeability is wound with coils 1-2, 1- ...


3
Watanabe Kunihiro, Tsuru Teruhisa, Kaminami Seiji, Suesada Takeshi, Dakeya Yujiro: Chip antenna and radio device mounted with it. Murata Mfg, January 21, 2000: JP2000-022421 (121 worldwide citation)

PROBLEM TO BE SOLVED: To provide a small sized chip antenna with a wide band width and to provide a radio device that mounts the chip antenna. SOLUTION: The chip antenna 10 is provided with a rectangular solid base 11 having a mount side 111 and a feeding terminal 12 and a ground terminal 13 are pla ...


4
Motoki Kensaku, Okahisa Takuji, Matsumoto Naoki: Gan single crystal substrate and its manufacture. Sumitomo Electric, January 21, 2000: JP2000-022212 (60 worldwide citation)

PROBLEM TO BE SOLVED: To provide a GaN single crystal substrate which is wide in area and is little in warp and can be independent. SOLUTION: A mask which has a zigzag window and a stripe window is made on a GaAs (111) substrate, and a GaN buffer layer is made at low temperature by HVPE(hydride vapo ...


5
Sugiura Risa, Ishikawa Masayuki, Nunogami Shinya, Onomura Masaaki, Yamamoto Masahiro: Nitride semiconductor element, light emitting element and their manufacture. Toshiba, January 21, 2000: JP2000-021789 (53 worldwide citation)

PROBLEM TO BE SOLVED: To reduce the crystal defect density of dislocations, laminate defects, defective tubular holes, etc., by forming a desired element structure on a nitride compd. semiconductor layer involving a first region having vertically extending through-dislocations and second region rele ...


6
Shirakawa Hiroshi: Reaction product measuring device. Nok, January 21, 2000: JP2000-019147 (53 worldwide citation)

PROBLEM TO BE SOLVED: To accurately identify a large number of object detecting parts by providing an identification part discretely divided for identifying the object detecting parts, and a connector for recognizing it. SOLUTION: A common terminal part 105 and a terminal part 104 connected to carbo ...


7
Tezuka Tsutomu: Semiconductor device and its manufacture. Toshiba, January 21, 2000: JP2000-021783 (51 worldwide citation)

PROBLEM TO BE SOLVED: To provide a buffer layer having a low transition density and thin enough to plan a high speed and low power consumption device by forming the buffer layer on a second semiconductor layer and forming on the buffer layer a strain semiconductor layer having a different lattice co ...


8
Kato Munehiro, Sano Michihiro, Harada Mitsunori: Light emitting diode. Stanley Electric, January 21, 2000: JP2000-022222 (42 worldwide citation)

PROBLEM TO BE SOLVED: To make a uniform wavelength conversion and prevent a color unevenness caused by a difference between conversion efficiencies, by a method wherein a wavelength conversion element in which a thickness and a density of a wavelength conversion substance have previously been set to ...


9
Minato Shoichi: Digital camera. Minolta, January 21, 2000: JP2000-023002 (40 worldwide citation)

PROBLEM TO BE SOLVED: To reduce the total size in a non-photographing mode and to improve portability of a digital camera which uses an interchangeable lens for photographing. SOLUTION: A moving means 506 which moves back and forth a photographing lens 301 along its optical axis is added to a digita ...


10
Watanabe Shigeyoshi, Nagaoka Masami, Kameyama Atsushi, Yoshihara Kunio: Semiconductor device. Toshiba, January 21, 2000: JP2000-020665 (29 worldwide citation)

PROBLEM TO BE SOLVED: To provide a semiconductor device which is freely deformable, can be attached to merchandise of an arbitrary shape, is low in unit cost, does not require recovery after use and can prevent the erroneous operation of a circuit. SOLUTION: An LSI chip 12 formed into a thin film si ...



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