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Shunpei Yamazaki, Hongyong Zhang, Yasuhiko Takamura: Semiconductor device and method for forming the same. Semiconductor Energy Laboratory, Gerald J Ferguson Jr, Sixbey Friedman Leedom & Ferguson, November 21, 1995: US05468987 (102 worldwide citation)

In a thin-film insulated gate type field effect transistor having a metal gate in which the surface of the gate electrode is subjected to anodic oxidation, a silicon nitride film is provided so as to be interposed between the gate eiectrode and the gate insulating film to prevent invasion of movable ...


63
Takanori Maruichi, Naoki Kamaya, Toshiyuki Yamauchi: Video camera. Sony Corporation, William S Frommer, Alvin Sinderbrand, November 21, 1995: US05469211 (100 worldwide citation)

A video camera has a body with a rear surface at which a battery unit is normally mounted, a remote control receiver has front and rear surfaces respectively mating with the rear and front surfaces of the camera body and battery unit, respectively, interengageable coupling devices at the front and r ...


64
Klaas J Zwart: Pack-off tool. Bell Seltzer Park & Gibson, November 21, 1995: US05467822 (98 worldwide citation)

A pack-off tool comprises a main tubular body including an expandable sealing element located between two non-expandable ring members and being mounted on a mandrel and in sealing engagement therewith at axially spaced locations. The tubular body is axially compressible into a radially extended conf ...


65
Stuart E Greer: Method for forming a temporary attachment between a semiconductor die and a substrate using a metal paste comprising spherical modules. Motorola, Minh Hien N Clark, November 21, 1995: US05468655 (96 worldwide citation)

A nodular metal paste (42) is used to temporarily attach the bumps (34) on a semiconductor die (32) to a substrate (38). The spherical nodules (44) composing the metal paste are dispensed onto contact pads (40) on the substrate, and then heated until they partially melt. The partial liquid region pe ...


66
Seetharama C Deevi, Mohammad R Hajaligol, Pamela D Lieberman, Walter A Nichols, Michael L Watkins: Heater having a multiple-layer ceramic substrate and method of fabrication. Philip Morris Incorporated, Kevin B Osborne, James E Schardt, Charles E B Glenn, November 21, 1995: US05468936 (95 worldwide citation)

A heater having a multiple-layer ceramic substrate and a method for fabricating the heater are provided. The heater consists-of a plurality of ceramic layers which are laminated to form a single ceramic substrate. A plurality of resistive heating elements are deposited onto the multiple-layer cerami ...


67
Arvin D Danielson, Dennis A Durbin: Pocket size data capture unit with processor and shell modules. Norand Corporation, Suiter & Associates, November 21, 1995: US05468947 (94 worldwide citation)

A hand-held processing system wherein a peripheral module may receive therein a computer processor basic module of standardized construction, with a user-immune real-time multi-tasking operating system. Advantageously the peripheral module or computer processor module may include a touch screen or o ...


68
Tempaku Junya: Data storage device with enhanced data security. Samsung Electronics, Robert A Westerlund, Stephen R Whitt, Charles R Donohue, November 21, 1995: US05469564 (93 worldwide citation)

A data storage device having the capability of preventing unauthorized access to data stored therein, including a memory, e.g., a flash EEPROM, having a first portion for storing a plurality of internal passwords and a second portion for storing address data, e.g., encoded password addresses and sta ...


69
Stephen V Dennis: Resource-oriented printer system and method of operation. Microsoft Corporation, Seed and Berry, November 21, 1995: US05469533 (92 worldwide citation)

A host computer and printer and method of operation in which the data file describing a document is examined by a resource assembler which determines which resources are required from the host computer to print the document. The resource assembler translates the document into a set of render primiti ...


70
Masatoshi Namekawa, Yoshiteru Ibuki, Norio Iguchi, Masatoshi Okuno: Solder ball supply device. Citizen Watch, Miyota, Kanesaka & Takeuchi, November 21, 1995: US05467913 (91 worldwide citation)

A solder ball supply device comprising flux supply means 200 which supplies flux at the same time to input and output terminals on substrate 1 prior to supply of solder balls, and solder ball supply means 300 which takes out a number of solder balls from discharger 350 in which solder balls are held ...



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