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Abys Joseph A, Kadija Igor V, Kudrak Edward J: Integrated circuit devices with solderable lead frame. American Telephone And Telegraph Company, September 11, 1994: TW230274 (4 worldwide citation)

A packaged device with a lead frame, a lead frame and an article ?of manufacture comprising a base metal, a layer of nickel on the ?base metal, and a protective composite of metal layers on the ?nickel. The composite includes, in succession from the nickel ?layer, a layer of palladium or soft gold s ...


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