Higgins Irving John, Mccann James Michael, Davis Graham, Hill Hugh Allen Oliver, Zwanziger Ron, Treidl Bernhard Ludwig, Birket Nigel Norman, Plotkin Elliot Verne: Sensor electrode systems.. Genetics Int, December 12, 1984: EP0127958-A2 (828 worldwide citation)

This specification discloses sensor electrodes, and their combination with reference electrodes; the manufacture of such electrodes; apparatus utilising such electrodes; and electrical circuitry into which such electrodes can be incorporated, specifically the establishment of certain design criteria ...


Corenman James E, New William Jr, Yelderman Mark, Goodman David E: Sensor having cutaneous conformance.. Nellcor, December 12, 1984: EP0127947-A2 (145 worldwide citation)

A sensor for trans-illumination of a blood perfused portion of flesh to measure light extinction during transillumination is disclosed. The sensor is preferably mounted on a fingertip but any digit or blood perfused portion of flesh will work. The sensor includes a first end for disposition on one s ...

Smith Gale E, Summers Max D: Method for producing a recombinant baculovirus expression vector.. Texas A & M Univ Sys, December 12, 1984: EP0127839-A2 (140 worldwide citation)

A method for producing a recombinant baculovirus expression vector, capable of expressing a selected gene in a host insect cell, is disclosed. The method involves cleaving baculovirus DNA to produce a DNA fragment comprising a polyhedrin gene or portion thereof, including a polyhedrin promoter. A re ...

Cotrel Yves Paul Charles Alexa: Spinal fixation device.. Sofamor, December 12, 1984: EP0128058-A1 (113 worldwide citation)

Dispositif pour l'étaiement du rachis étant caractérisé en ce que la tige (20) est de section constante sur toute sa longueur et présente des aspérités de surface (21) et en ce que les organes d'ancrage (24) sont pourvus de moyens de pression (25) coopérant avec ladite tige (20). Le dispositif selon ...

Ewen John Alexander, Welborn Howard Curtis Jr: Process and catalyst for producing reactor blend polyolefins.. Exxon Research Engineering Co, December 12, 1984: EP0128046-A1 (93 worldwide citation)

Polyolefin reactor blends obtained by polymerization of ethylene and higher alpha-olefins in the presence of a catalyst system comprising two or more metallocenes and alumoxane.

Gregory Walter Adelman: Aminomethyl oxooxazolidinyl benzene derivatives useful as antibacterial agents.. Du Pont, December 12, 1984: EP0127902-A2 (68 worldwide citation)

Novel aminomethyl oxooxazolidinyl benzene derivatives, including the sulfides, sulfoxides, sulfones and sulfonamides, such as (I)-N-[3-[4- (methylsulfonyl) phenyl] -2-oxooxazolidin -5- ylmethyl] carbamic acid, methyl ester possess useful antibacterial activity.

Monnier Jean Pierre: Respirator with automatic ventilation correction.. Air Liquide, December 12, 1984: EP0127905-A2 (66 worldwide citation)

L'invention concerne un respirateur muni de circuits d'alimentation (10) et d'utilisation (30), d'un accumulateur de gaz respirable (40) d'un distributeur (20) et d'un dispositif de commande à action cyclique (50). Le respirateur selon l'invention comporte un circuit auxiliaire d'adduction (60) de g ...

Goosen Mattheus Florentius Alb, O& 039, Shea Geraldine Margaret, Sun Anthony Mein Fang: Microencapsulation of living tissue and cells.. Connaught Lab, December 12, 1984: EP0127989-A2 (47 worldwide citation)

Living tissue or cells, for example, islets of Langerhans, are microencapsulated for implantation in the body for long term treatment of diabetes or other disease requiring organ transplantation. The microcapsules take the form of a biocompatible semi-permeable hydrogel membrane based on polylysine ...

Heslop Christopher John, Wright Steven John, Hines Robert Edgar: Method of producing a via in a semiconductor device.. British Telecomm, December 12, 1984: EP0127946-A1 (44 worldwide citation)

A method of producing a via in the fabrication of a semiconductor wafer is disclosed. Vias are used in semiconductor wafer fabrication as a means of providing electrical connexions between different layers of the wafer. The walls of known vias are difficult to coat reliably with metal because, parti ...