1
Keith F Beckham, Anne E Kolman, Kathleen M McGuire, Karl J Puttlitz, Horatio Quinones: Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making. International Business Machines Corporation, Wolmar J Stoffel, August 5, 1986: US04604644 (284 worldwide citation)

An improved solder interconnection for forming I/O connections between an integrated semiconductor device and a support substrate having a plurality of solder connections arranged in an area array joining a set of I/O's on a flat surface of the semiconductor device to a corresponding set of solder w ...


2
Chen Chung Hsu: Three-dimensional multichip package and methods of fabricating. United Microelectronics Corporation, George O Saile, Wolmar J Stoffel, January 10, 1995: US05380681 (259 worldwide citation)

A process for fabricating a three-dimensional multi-chip array package wherein master semiconductor substrate is formed having a peripheral inner row of contact pads and a peripheral outer row of terminal pads. A plurality of subordinate semiconductor substrates are formed provided with a peripheral ...


3
Heng S Huang: Process for producing non-volatile memory devices having closely spaced buried bit lines and non-overlapping code implant areas. United Microelectronics Corporation, George O Saile, Wolmar J Stoffel, January 3, 1995: US05378649 (207 worldwide citation)

This inventions provides a method to form metal lines with smaller line pitches than is possible using the conventional photolithographic single coating process. This invention provides for a double photolithographic process where the surface is coated, exposed and developed twice to form two sets o ...


4
Garry M Benarr, Terry A Burns, William J Walker: Pinless connector interposer and method for making the same. International Business Machines Corporation, Wolmar J Stoffel, October 22, 1985: US04548451 (137 worldwide citation)

A pinless connector interposer for making densely populated, inexpensive, simple, reliable, self-wiping connections between components used in semiconductor packaging such as semiconductor carrying substrates, flexible and rigid printed circuit boards and cards. The connector interposer comprises an ...


5
Irving Feinberg, Jack L Langdon: Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices. International Business Machines Corporation, Wolmar J Stoffel, January 13, 1981: US04245273 (130 worldwide citation)

A package for mounting, interconnecting, and cooling a large number of integrated circuit semiconductor devices having a sintered multilayer ceramic substrate provided with an internal metallurgy network made up of voltage planes, X and Y signal planes, and fan-out planes, with I/O pins on the botto ...


6
Alex Bitaillou, Jean Masson, Jean Marie Lemoine: Method of bonding connecting pins to the eyelets of conductors formed on a ceramic substrate. International Business Machines Corporation, Wolmar J Stoffel, July 31, 1984: US04462534 (90 worldwide citation)

This method of bonding the heads of connecting pins previously inserted in a ceramic substrate to the eyelets of conductors formed on the top surface of said substrate comprises the steps of: applying a droplet of flux to the head of each pin; applying a solder ball to the head of each pin where it ...


7
Joseph L Horvath: Thermal conduction element for semiconductor devices. International Business Machines Corporation, Wolmar J Stoffel, November 15, 1983: US04415025 (81 worldwide citation)

A disk shaped thermal bridge element for use in a semiconductor package to conduct heat from a device to a cold plate, which disk element has a bulged shape with a first set of inwardly extending slots and a second set of outwardly extending slots emanating from the center of the disk.


8
Herbert P Byrnes, Richard Wahl: Contact probe assembly having rotatable contacting probe elements. International Business Machines Corporation, Wolmar J Stoffel, December 27, 1983: US04423376 (70 worldwide citation)

An electrical probe assembly with rotatable probe elements for establishing electrical contact to pad surfaces having a plurality of elongated probe elements formed of a conductive flexible material, each having a length many times its diameter, spaced upper and lower flat support elements having ap ...


9
Joseph M Harvilchuck, Joseph S Logan, William C Metzger, Paul M Schaible: Reactive ion etching of aluminum. International Business Machines Corporation, Wolmar J Stoffel, November 30, 1976: US03994793 (67 worldwide citation)

A process for etching aluminum wherein a masked layer of aluminum, supported on a substrate, is exposed to a plasma formed by imposing an RF voltage across at least two spaced electrodes in an ambient including a gas selected from the group consisting of CCl.sub.4, Cl.sub.2, Br.sub.2, HCl. The resul ...


10
Laura B Zielinski: Process for forming passivated metal interconnection system with a planar surface. International Business Machines Corporation, Wolmar J Stoffel, October 12, 1976: US03985597 (63 worldwide citation)

A process for forming an embedded interconnection metallurgy system on a substrate by (1) forming a first layer of an organic thermosetting polymerized resin material on the substrate, (2) forming a second overlying layer of a material that is soluble in a solvent that does not appreciably affect th ...