1
David Greenlaw: Three-dimensional integrated semiconductor devices. Advanced Micro Devices, Williams Morgan & Amerson P C, September 13, 2005: US06943067 (283 worldwide citation)

The present invention describes a process for three-dimensional integration of semiconductor devices and a resulting device. The process combines low temperature wafer bonding methods with backside/substrate contact processing methods, preferably with silicon on insulator devices. The present invent ...


2
Warren Farnworth, Larry Kinsman, Walter Moden: Method and apparatus for a semiconductor package for vertical surface mounting. Micron Technology, Williams Morgan & Amerson P C, September 18, 2001: US06291894 (175 worldwide citation)

A method for packaging a semiconductor device includes connecting a plurality of wire leads to a corresponding plurality of electrical connection pads on the semiconductor device, covering at least a portion of the semiconductor device and at least a portion of each of the wire leads with an encapsu ...


3
Joseph Andrew Chinn, Jack R Frautschi, Richard E Phillips Jr: Prosthetic heart valve with surface modification. Carbomedics, Williams Morgan & Amerson P C, July 20, 2004: US06764509 (146 worldwide citation)

Biocompatible prostheses, specifically, biocompatible heart valves, are described having incorporated therein an effective amount of coating applied thereto to render the valve resistant to in vivo pathologic thrombus formation and in vivo pathologic mineralization. Preferably, the coating is derive ...


4
William Joseph Gauvin, Harold Jones, Edward James Taranto: Method and apparatus for modifying copies of remotely stored documents using a web browser. Digital Equipment Corporation, Williams Morgan & Amerson P C, November 23, 1999: US05991760 (129 worldwide citation)

A local client computer includes a local hypertext server, a local application program, and a downloader for downloading a copy of a remote network document (local copy), that is accessible by the local application program, onto the client computer. When connected to the network, a downloader is exe ...


5
John G Pellerin, Thomas Werner: Method of making dual damascene conductive interconnections and integrated circuit device comprising same. Advanced Micro Devices, Williams Morgan & Amerson P C, May 8, 2001: US06228758 (121 worldwide citation)

A method of forming conductive interconnections on an integrated circuit device and an integrated circuit device comprising the same is disclosed. The method is comprised of forming first and second layers of dielectric materials that are selectively etchable with respect to one another. The method ...


6
Tao Liu, Satish Kumar: Supercapacitor having electrode material comprising single-wall carbon nanotubes and process for making the same. Georgia Tech Research Corporation, Williams Morgan & Amerson P C, June 13, 2006: US07061749 (118 worldwide citation)

The present invention relates to a supercapacitor, also known as an electrical double-layer capacitor or ultracapacitor, having electrode material comprising single-wall carbon nanotubes. The carbon nanotubes can be derivatized with functional groups. The electrode material is made by preparing a po ...


7
Gregory N Christie, Peter T Westen, Stephen O Lemay, Jens Alfke: Method and apparatus for displaying information during an instant messaging session. Apple, Williams Morgan & Amerson P C, February 23, 2010: US07669134 (115 worldwide citation)

A method and an apparatus are provided for controlling a graphical user interface to display information related to a communication session. Information relating to data produced by a first participant to the communication session is displayed on a first display unit, wherein the information produce ...


8
Douglas Bonser, Anthony J Toprac, Matthew Purdy, John R Behnke, James H Hussey Jr: Method and apparatus for control of critical dimension using feedback etch control. Advanced Micro Devices, Williams Morgan & Amerson P C, June 12, 2001: US06245581 (113 worldwide citation)

The present invention provides for a method and an apparatus for controlling critical dimensions. At least one run of semiconductor devices is processed. A critical dimension measurement is performed upon at least one of the processed semiconductor device. An analysis of the critical dimension measu ...


9
Frank Wirbeleit, Manfred Horstmann, Christian Hobert: Self-biasing transistor structure and an SRAM cell having less than six transistors. Advanced Micro Devices, Williams Morgan & Amerson P C, October 28, 2008: US07442971 (108 worldwide citation)

By providing a self-biasing semiconductor switch, an SRAM cell having a reduced number of individual active components may be realized. In particular embodiments, the self-biasing semiconductor device may be provided in the form of a double channel field effect transistor that allows the formation o ...


10
Tyler J Gomm, Ross E Dermott: Controlling a delay lock loop circuit. Micron Technology, Williams Morgan & Amerson P C, April 27, 2004: US06728163 (108 worldwide citation)

A method and apparatus is provided for performing a filter control of a delay lock loop circuit. A coarse delay and/or a fine delay are implemented upon a reference signal based upon a phase shift between the reference signal and a feedback signal. A synchronized output signal is generated based upo ...