1
Cornelis T Veenendaal: Piezoelectric pressure sensing apparatus for integrated circuit testing stations. Tektronix, Jay K Malkin, William S Lovell, June 16, 1987: US04673839 (118 worldwide citation)

A pressure sensing apparatus for use in an integrated circuit testing station is disclosed. The testing station includes a probe, a support structure, and lift means for moving an integrated circuit upward toward the probe. The invention specifically consists of a pressure pad secured to the support ...


2
Kimberly R Gleason, Eric W Strid, Robert T Flegal, Angus J McCamant: Wafer probes. TriQuint Semiconductor, John Smith Hill, William S Lovell, August 1, 1989: US04853627 (105 worldwide citation)

A wafer probe comprises a support member having an end region which is shaped to permit the end region to be brought into close proximity with a component under test. An amplifier is mounted on the support member at its end region. A conductive probe element is attached to the amplifier and is elect ...


3
Dale R Rath: Pressure control apparatus for use in an integrated circuit testing station. Tektronix, William S Lovell, Jay K Malkin, July 19, 1988: US04758785 (104 worldwide citation)

An apparatus for controlling the pressure exerted on a probe in an integrated circuit testing station is disclosed. The apparatus is mounted to a support structure within the station directly above the probe. The testing station further includes a motorized lift system for moving an integrated circu ...


4
Sohrab Vossoughi: Adjustable support. Anthro Corporation, William S Lovell, John P Dellett, November 8, 1988: US04783036 (84 worldwide citation)

An adjustable support allows a computer terminal or display device to be conveniently positioned above a desk. The support includes a platform for holding the terminal and a pivotally connected linkage assembly comprising proximal and distal arms for vertically and horizontally positioning the platf ...


5
Dee H Byrd Jr, Michael H Williams: Method for the thermal characterization of semiconductor packaging systems. Tektronix, Jay K Malkin, William S Lovell, March 29, 1988: US04734641 (61 worldwide citation)

A method for determining the thermal characteristics of a semiconductor packaging system is provided which uses a platinum resistor test unit. The platinum resistor is preferably sized to approximate the dimensions of the semiconductor device for which the package was designed, and is installed with ...


6
Kenneth R Smith, Kent H Johnston, George S LaRue, Robert A Mueller, Steven A Tabor: Method of packaging integrated circuit chips, and integrated circuit package. Tektronix, William S Lovell, John D Winkelman, John Smith Hill, December 9, 1986: US04628406 (57 worldwide citation)

An integrated circuit package comprises at least two integrated circuit chips each having a plurality of contact pads arranged in a first pattern on the interconnect face of the chip, and an elastic sheet-form interconnect member. The interconnect member has at least two main face areas, associated ...


7
Stewart S Taylor: Tristate output circuit with selectable output impedance. TriQuint Semiconductor, William S Lovell, Daniel J Bedell, Peter J Meza, February 28, 1989: US04808853 (56 worldwide citation)

A tristate output circuit includes a pair of transistors having sources connected to a switchable current source and drains separately coupled to a voltage source through separate resistors and switching transistors. When the current source and switching transistors are on, the circuit operates in a ...


8
William A Vetanen, Kimberly R Gleason, Irene G Beers: Self-aligned recessed gate process. Triquint Semiconductors, William S Lovell, Alexander C Johnson Jr, John D Winkelman, April 7, 1987: US04656076 (54 worldwide citation)

An integrated circuit gate process and structure are disclosed which provide a self-aligned, recessed gate enhancement-mode GaAsFET. The process includes making self-aligned implants prior to gate metallization, with an intermediate step of applying patches of plasma- and chemical-etch resistant die ...


9
Bozidar Janko, Kenneth R Smith: Multiple lead probe for integrated circuits in wafer form. Tektronix, William S Lovell, John Smith Hill, January 2, 1990: US04891585 (49 worldwide citation)

A probe assembly for use in testing an integrated circuit embodied in an integrated circuit chip in wafer form, comprises a stiff support member formed with an aperture, and a membrane. Both the support member and the membrane comprise dielectric material and portions of conductive material supporte ...


10
Tran Thong: Electronic probe having automatic readout of identification and status. Tektronix, William S Lovell, John Smith Hill, Robert S Hulse, June 9, 1987: US04672306 (47 worldwide citation)

An electronic probe assembly provides previously recorded data as to probe identification and optimum compensation tuning of the probe to a connected "intelligent" test and measurement device so that proper test procedures may be confirmed, either by display of such data or by the generation of erro ...