1
Howard W Anderson, Michael T Moore: Hydrazone containing charge transport element and photoconductive process of using same. International Business Machines Corporation, Thomas W O Rourke, William N Hogg, Robert E Harris, April 24, 1979: US04150987 (193 worldwide citation)

A process for electrophotographic reproduction, and a layered electrophotographic plate having a conventional charge generation layer and a p-type hydrazone containing charge transport layer, in which the surface of the charge transport layer is selectively discharged by actinic radiation as a resul ...


2
Donald E Doyle, George A Hellwarth, Jack L Quanstrom: Data flow component for processor and microprocessor systems. International Business Machines Corporation, D Kendall Cooper, William N Hogg, J Jancin Jr, November 29, 1983: US04418383 (154 worldwide citation)

A Large Scale Integration (LSI) data flow component is described for use as a building block, the component being capable of use singly or in combination to provide data flow paths and functions of different data widths for a processor or microprocessor. A component with an eight-bit data flow is de ...


3
Timothy J Dell, Marc R Faucher, Bruce G Hazelzet, Dale Edward Pontius: Stackable memory card. International Business Machines Corporation, William N Hogg, October 5, 1999: US05963464 (129 worldwide citation)

A memory card design which allows for stackable memory cards so that a computer system's memory capabilities can be expanded by connecting a first memory card to sockets of the computer system's motherboard and then stacking subsequent memory cards on top of this first memory card. The memory card d ...


4
John Gow 3rd, Richard W Noth: High performance versatile thermally enhanced IC chip mounting. International Business Machines Corporation, William N Hogg, Francis J Thornton, August 11, 1992: US05138430 (125 worldwide citation)

According to the present invention, an improved chip and leadframe package assembly and method of making the same is provided. The package assembly is comprised of a metal leadframe having a chip bond pedestal centrally located and a plurality of discrete leads surrounding the pedestal. An I/C (inte ...


5
R Dean Adams, Edmond S Cooley, Patrick R Hansen: On-chip test circuit for evaluating an on-chip signal using an external test signal. International Business Machines Corporation, William N Hogg, December 19, 2000: US06163862 (122 worldwide citation)

An on-chip test circuit for evaluating on-chip signals for a semiconductor memory chip includes an on-chip signal associated with a memory circuit on the chip; said on-chip signal having a signal characteristic to be evaluated; an input circuit for receiving an off-chip test signal; and a test circu ...


6
Nader Amini, Patrick M Bland, Bechara F Boury, Richard G Hofmann, Terence J Lohman: System direct memory access (DMA) support logic for PCI based computer system. International Business Machines Corporation, Robert S Babayi, William N Hogg, September 12, 1995: US05450551 (103 worldwide citation)

A direct memory access (DMA) support mechanism is provided for use in a computer system which comprises (i) a central processing unit (CPU) connected to system memory by a first system bus, and a second system bus connected to the CPU; (ii) a host bridge connecting the second system bus to a periphe ...


7
Kenneth Fallon, Miguel A Jimarez, Ross W Keesler, John M Lauffer, Roy H Magnuson, Voya R Markovich, Irv Memis, Jim P Paoletti, Marybeth Perrino, John A Welsh, William E Wilson: Two signal one power plane circuit board. International Business Machines Corporation, William N Hogg, March 20, 2001: US06204453 (98 worldwide citation)

A method of forming a printed circuit board or circuit card is provided with a metal layer which serves as a power plane sandwiched between a pair of photoimageable dielectric layers. Photoformed metal filled vias and photoformed plated through holes are in the photopatternable material, and signal ...


8
Timothy J Dell, Bruce G Hazelzet, Mark W Kellogg: On-board scrubbing of soft errors memory module. International Business Machines Corporation, William N Hogg, February 19, 2002: US06349390 (93 worldwide citation)

A memory module for attachment to a computer system having a memory bus and a method of using the memory module for error correction by scrubbing soft errors on-board the module is provided. The module includes a printed circuit card with memory storage chips on the card to store data bits and assoc ...


9
Ross W Keesler, Voya R Markovich, Jim P Paoletti, Marybeth Perrino, William E Wilson: Composite laminate circuit structure and method of forming the same. International Business Machines Corporation, William N Hogg, January 16, 2001: US06175087 (92 worldwide citation)

A method forming a composite laminate structure includes providing first and second circuit board element each having circuitry on at least one face thereof and plated through holes. A voltage plane element is provided having at least one voltage plane having opposite faces with layers of partially ...


10
Timothy Jay Dell, Mark William Kellogg: Dynamic configuration of memory module using modified presence detect data. International Business Machines Corporation, William N Hogg, January 9, 2001: US06173382 (91 worldwide citation)

A memory module includes a plurality of memory chips on the module; first logic for configuring the memory module to operate in a selectable mode; second logic for storing initial presence detect (PD) data; and third logic for storing modified PD data that corresponds to a requested mode of operatio ...