1
Jeffrey P Baker, Duong T La, Randy A Coverstone: Thermal ink jet pen body construction having improved ink storage and feed capability. Hewlett Packard Company, William J Bethurum, September 13, 1988: US04771295 (450 worldwide citation)

The novel pen body construction described herein includes multiple ink storage compartments communicating with a multi-orifice printhead, and these compartments are adapted to receive sections of ink-storage foam. Preferably, this foam is a reticulated polyurethane foam of controlled porosity and ca ...


2
John R Tuttle: Electrically powered postage stamp or mailing or shipping label operative with radio frequency (RF) communication. Micron Technology, William J Bethurum, Robert J Stern, March 5, 1996: US05497140 (227 worldwide citation)

The present application describes an electronically powered postage stamp or mailing label and including a radio frequency identification (RFID) device and system mounted between the opposing and facing major surfaces thereof. The RFID device and system includes an integrated circuit transceiver chi ...


3
Rickey D Hughes, James T Reese: Proximity responsive capacitance sensitive method, system, and associated electrical circuitry for use in controlling mechanical and electro-mechanical equipment. Saf T Margin, William J Bethurum, January 14, 1992: US05081406 (172 worldwide citation)

A method and system and associated circuitry for controlling and stopping the motion of dangerous moving parts such as power saw blades substantially instantaneously in response to body or human capacitance produced by an operator coming with a predetermined critical distance from the moving part. T ...


4
Alfred I Tsung Pan: Monolithic thermal ink jet printhead with integral nozzle and ink feed. Hewlett Packard Company, William J Bethurum, January 16, 1990: US04894664 (167 worldwide citation)

A monolithic thermal ink jet printhead is presented. This monolithic structure makes page-width array thermal ink jet printheads possible. The monolithic structure can be manufactured by standard integrated circuit and printed circuit processing techniques. A nickel-plating process constructs a nozz ...


5
Samuel A Johnson: Lamp bulb with integrated bulb control circuitry and method of manufacture. Beacon Light Products, William J Bethurum, June 30, 1992: US05126634 (161 worldwide citation)

An incandescent light bulb or the like and process for manufacturing same wherein an electronic control module (ECM) is installed, such as by press fitting into a dielectric insulating material at the socket end of the bulb, after the high temperature bulb fabrication steps have been completed. In t ...


6
Ross R Allen: Multitone ink jet printer and method of operation. Hewlett Packard Company, William J Bethurum, May 24, 1988: US04746935 (144 worldwide citation)

This patent application discloses a method and apparatus useful for eight-level halftone thermal ink jet printing by printing with droplets of ink with volumes weighted in a binary sequence. Three (3) binary-weighted drop generators which are fired in sequence are useful in an eight-level, four colo ...


7
Bruce Cowger, Robert Beeson: Ink jet pen having improved ink storage and distribution capabilities. Hewlett Packard Company, William J Bethurum, December 27, 1988: US04794409 (141 worldwide citation)

An ink jet pen (or other similar fluid delivery system) wherein primary and secondary ink reservoirs and an ink jet printhead are all interconnected by way of a porous ink-transfer member. The ink will pass directly from the primary ink reservoir to the printhead under a normal or predetermined rang ...


8
Chris C Yu: Acoustical method and system for detecting and controlling chemical-mechanical polishing (CMP) depths into layers of conductors, semiconductors, and dielectric materials. Micron Technology, William J Bethurum, June 29, 1993: US05222329 (137 worldwide citation)

A method and system for controlling the depth of removal by polishing of a selected material on a supporting underlayer where it is desired to terminate removal of the selected material, such as tungsten, at the material-underlayer interface. In accordance with this novel method and system, the sele ...


9
Samuel A Johnson: Thermal ink jet common-slotted ink feed printhead. Hewlett Packard Company, William J Bethurum, July 28, 1987: US04683481 (132 worldwide citation)

In a thin film resistor substrate for a thermal ink jet printhead, there is provided an elongated ink feed slot for supplying ink to a plurality of heater resistors on the substrate. Ink flows from this slot vertically through the substrate and then laterally along predetermined ink flow paths in an ...


10
Hugh L Garvin, Amnon Yariv, Sasson Somekh: Process for fabricating small geometry semiconductive devices including integrated components. Hughes Aircraft Company, William J Bethurum, W H MacAllister, September 20, 1977: US04049944 (127 worldwide citation)

Disclosed is a process for fabricating small geometry electronic devices, including a variety of integrated optical devices. The process includes the steps of holographically exposing a resist masking layer to a plurality of optical interference patterns in order to develop a masking pattern on the ...