1
Donald B Doherty, Robert J Gove, Mark L Burton, Rodney D Miller: Pulse width modulation for spatial light modulator with split reset addressing. Texas Instruments Incorporated, Julie L Reed, Richard L Donaldson, William E Hiller, March 5, 1996: US05497172 (318 worldwide citation)

A method of implementing pulse-width modulated image display systems (10, 20) with a spatial light modulator (SLM) (15) configured for split-reset addressing. Display frame periods are divided into time slices. Each frame of data is divided into bit-planes, each bit-plane having one bit of data for ...


2
James M Florence, William E Nelson, Vadlammanti Venkateswar, James St Clair, Dirk Broddin, Serge M F Tavernier: Process and architecture for digital micromirror printer. Texas Instruments Incorporated, Agfa Gevaert, Julie L Reed, James C Kesterson, William E Hiller, October 24, 1995: US05461411 (296 worldwide citation)

Techniques for achieving high resolution, high-speed gray scale printing with binary spatial light modulators. A spatial light modulator array is divided into subarrays, and the subarrays are illuminated at various levels (510, 512, 514, 516) of a modulated light source. Additionally, each pixel (52 ...


3
Mehrdad M Moslehi: Multi-zone plasma processing method and apparatus. Texas Instruments Incorporated, Stanton C Braden, Richard L Donaldson, William E Hiller, October 12, 1993: US05252178 (290 worldwide citation)

A multi-zone multi-electrode plasma processing method for uniform plasma processing and effective in-situ fabrication reactor process chamber (10) cleaning during a plasma deposition or etch process first comprises the steps of flowing plasma deposition or etch gases into the process chamber (10) in ...


4
Samuel R Shortes, Thomas C Penn: Method for removing photoresist layer from substrate by ozone treatment. Texas Instruments Incorporated, William E Hiller, Melvin Sharp, James T Comfort, July 27, 1982: US04341592 (258 worldwide citation)

Method and apparatus for removing a photoresist layer from a substrate surface of different material, such as a semiconductor slice, in the fabrication of an electronic structure, involving exposure of the photoresist layer to an ozone-containing gaseous atmosphere in a reaction zone of a reactor. T ...


5
Mehrdad M Moslehi: Low-temperature in-situ dry cleaning process for semiconductor wafers. Texas Instruments Incorporated, Douglas A Sorensen, Richard L Donaldson, William E Hiller, February 18, 1992: US05089441 (233 worldwide citation)

A low-temperature (650.degree. C. to 800.degree. C.) in-situ dry cleaning process (FIG. 2) for removing native oxide (and other contaminants) from a semiconductor surface can be used with either multi-wafer or single-wafer semiconductor device manufacturing reactors. A wafer is contacted with a dry ...


6
Michael A Piliavin, Jeffrey B Sampsell, Perry A Penz: Perimeter seal reinforcement holes for plastic LCDs. Texas Instruments Incorporated, William E Hiller, James T Comfort, Melvin Sharp, November 13, 1984: US04482213 (230 worldwide citation)

To increase the perimeter seal strength of plastic LCDs, reinforcement holes are formed in the plastic substrate at the maximum stress points. These holes, which are not in contact with any active area of the device, are filled with glue, so that each pair of holes in the upper and lower substrates ...


7
Tsen Hwang Lin, Falvey Malarcher, Jeffrey B Sampsell: Optical signal free-space conversion board. Texas Instruments Incorporated, Dana L Burton, Richard L Donaldson, William E Hiller, March 22, 1994: US05296950 (223 worldwide citation)

This is a board to transport and convert optical outgoing free-space signals from a spatial light modulator which comprises: at least one detector to process the outgoing free-space signal; at least one signal transmitter to process the outgoing free-space signal; and at least one outgoing optical s ...


8
Mehrdad M Moslehi: Low-temperature in-situ dry cleaning process for semiconductor wafer. Texas Instruments Incorporated, Jacqueline J Garner, Richard L Donaldson, William E Hiller, April 4, 1995: US05403434 (222 worldwide citation)

A low-temperature (350.degree. C. to 750.degree. C.) in-situ dry cleaning process for removing native oxide (and other contaminants) from a semiconductor wafer surface, that can be used with either batch or single-wafer semiconductor device manufacturing reactors. A wafer is contacted with a dry cle ...


9
Thomas J Bannon, Stephen J Ford, Vappala J Joseph, Edward R Perez, Robert W Peterson, Diana M Sparacin, Satish M Thatte, Craig W Thompson, Chung C Wang, David L Wells: System and method for database management supporting object-oriented programming. Texas Instruments Incorporated, Richard A Stoltz, Richard L Donaldson, William E Hiller, March 22, 1994: US05297279 (213 worldwide citation)

A system and method for database management for providing support for long-term storage and retrieval of objects created by application programs written at least in part in object-oriented programming languages consists of a plurality of software modules. These modules provide data definition langua ...


10
Richard A Elder, Arthur M Wilson, Susan V Bagen, Juanita G Miller: Method for fabrication of probe card for testing of semiconductor devices. Texas Instruments Incorporated, Gary C Honeycutt, Richard L Donaldson, William E Hiller, July 6, 1993: US05225037 (191 worldwide citation)

A flexible polyimide film is used to support an array of precisely located contact bumps which are used to probe die on a wafer of semiconductor circuits, or an unmounted integrated circuit die, several integrated circuits, or hybrid devices. By utilizing a standard I/O contact pattern for the flexi ...