1
Patrick J Hood, David Ernest Havens: Structural and optical applications for shape memory polymers (SMP). Cornerstone Research Group, Wegman Hessler & Vanderburg, January 17, 2006: US06986855 (81 worldwide citation)

The methods of manufacturing molds from shape memory materials and molds made thereby, in accordance with the present invention, provide numerous advantages for molding castable composite parts. The initial mold cost is low enough to accommodate economical production of as few as a single part incor ...


2
John J Egan III, Christopher L Demler: Integrated paper pulp and process machinery having integrated drive and control and methods of use thereof. Kadant Black Clawson, Wegman Hessler & Vanderburg, September 9, 2003: US06617720 (69 worldwide citation)

The invention pertains to equipment and methods in which the rotatable drive member of a variable speed motor, such as a switched reluctance motor, carries a rotatable pulp processing element (


3
Eugene Y Ivanov, Harry W Conard: Low temperature sputter target bonding method and target assemblies produced thereby. Tosoh SMD, Wegman Hessler & Vanderburg, June 15, 2004: US06749103 (45 worldwide citation)

A low temperature target and backing plate bonding process and assemblies made thereby. A plurality of projections are formed in the harder member of the assembly. The assembly is bonded by conventional techniques around the peripheral assembly boundaries. The assembly is then pressure consolidated ...


4
Ronald D Kurp: Ready to use spackle/repair product containing dryness indicator. DAP Products, Wegman Hessler & Vanderburg, March 11, 2003: US06531528 (40 worldwide citation)

A ready to use patch repair product is disclosed that includes a color change indicator therein. After the product has dried the color changes to signal that, if desired, the worker can perform other operations such as painting, sanding, etc on the surface. In one aspect of the invention, a substant ...


5
Eugene Y Ivanov: Low temperature sputter target/backing plate method and assembly. Tosoh SMD, Wegman Hessler & Vanderburg, December 12, 2006: US07146703 (35 worldwide citation)

A sputtering target and a backing plate are diffusion-bonded with or without an insert or inserts interposed there-between so as to have a solid phase diffusion-bonded interface. The sputtering target substantially maintains its metallurgical characteristic and properties even though it has been dif ...


6
Hao Zhang, Jeff Hart, Ann Bolcavage: Diffusion bonding of copper sputtering targets to backing plates using nickel alloy interlayers. Tosoh SMD, Wegman Hessler & Vanderburg, September 16, 2003: US06619537 (35 worldwide citation)

A sputter target assembly including a high purity copper sputter target diffusion bonded to a backing plate, preferably composed of either aluminum, aluminum alloy, aluminum matrix composite materials, copper, or copper alloy, and a Ni-alloy interlayer, preferably composed of Ni—V, Ni—Ti, Ni—Cr, or ...


7
Glenn D Perrine: Ultrasonic weld pattern for adsorbent containing package. Flow Dry Technology, Wegman Hessler & Vanderburg, December 28, 2004: US06835257 (35 worldwide citation)

Method of preparing an adsorbent containing package and package made thereby. The method comprises providing a mounting surface of the package and heat fusing the mounting surface via ultrasonic welding to provide a multiplicity of depressed hard seal portions and relief surfaces on the mounting sur ...


8
Ann Bolcavage, Jeff Hart: Diffusion bonding of high purity metals and metal alloys to aluminum backing plates using nickel or nickel alloy interlayers. Tosoh SMD, Wegman Hessler & Vanderburg, June 17, 2003: US06579431 (25 worldwide citation)

An improved method for joining mating surfaces of a metallic sputter target and a backing plate of aluminum, aluminum alloy or aluminum matrix composite material to form a sputter target/backing plate assembly comprises the steps of roughening the mating surface of either the sputter target or the b ...


9
Eugene Y Ivanov, Harry W Conard: Method of assembling target and backing plates. Tosoh SMD, Wegman Hessler & Vanderburg, April 27, 2004: US06725522 (25 worldwide citation)

A low temperature target and backing plate bonding process and assemblies made thereby. A plurality of male projections (


10
Kevin Krieger: Wall panel system. Marlite, Wegman Hessler & Vanderburg, April 10, 2012: US08151533 (22 worldwide citation)

A modular wall system (10) includes a number of decorative panels that are received in an extruded panel frame (22). The panel frames (22) are positioned by connecting them to a wall rail (16) that is attached to the building. The wall rail (16) and the panel frame (22) each have a groove (52, 62) t ...



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