1
Ronald M Finnila: Process of manufacturing a three dimensional integrated circuit from stacked SOI wafers using a temporary silicon substrate. Hughes Aircraft Company, W C Schubert, W K Denson Low, June 20, 1995: US05426072 (238 worldwide citation)

A method of providing a first and a second Silicon-on-Insulator (SOI) wafer, wherein each SOI wafer includes a silicon layer separated from a bulk silicon substrate by a layer of dielectric material, typically SiO2. Next, at least one electrical feedthrough is formed in each of the silicon layers an ...


2
Michael D Jack, Michael Ray, Richard H Wyles: Integrated IR, visible and NIR sensor and methods of fabricating same. Raytheon Company, W C Schubert, G H Lenzen Jr, September 15, 1998: US05808350 (205 worldwide citation)

An imaging device (10) has a plurality of unit cells that contribute to forming an image of a scene. The imaging device includes a layer of semiconductor material (16), for example silicon, that has low noise photogate charge-mode readout circuitry (20, 21, 26, 28) (e.g., CCD or CMOS readout circuit ...


3
Anthony Ledger, Michael Power: Transparent optical chuck incorporating optical monitoring. Hughes Aircraft Company, W C Schubert, K W Denson Low, May 7, 1996: US05515167 (140 worldwide citation)

A transparent chuck is used to force a semiconductor wafer to take a prescribed shape. Any gap which is formed between the chuck and the wafer can be imaged through the transparent chuck. An interferometer is used to illuminate the gap with a narrow band illumination to create interference fringes i ...


4
Ronald L Williams, Joe B Tyra: Apparatus and method for protecting metal bumped integrated circuit chips during processing and for providing mechanical support to interconnected chips. Hughes Aircraft Company, W C Schubert, W K Denson Low, June 4, 1996: US05523628 (138 worldwide citation)

A method and apparatus for protecting metal bumped chips during processing and for providing mechanical support to interconnected chips. A protective adhesive stop is affixed to a metal bumped chip so that the height of the stop is at least as high as the metal bump. The stop protects the metal bump ...


5
Samuel F Pellicori, Aram M Mika: Wedge-filter spectrometer. Santa Barbara Research Center, W C Schubert, W K Denson Low, September 18, 1990: US04957371 (122 worldwide citation)

A wedge-filter spectrometer 1 comprises means 10 for spectrally dispersing an incident radiation beam comprising a first plurality of layers of high (H) index of refraction material and a second plurality of layers of low (L) index of refraction material, individual ones of the H and the L layers ov ...


6
James L Gates: Method of making a 3-dimensional circuit assembly having electrical contacts that extend through the IC layer. Hughes Aircraft Company, W C Schubert, W K Denson Low, February 6, 1996: US05489554 (85 worldwide citation)

A 3-dimensional circuit assembly includes a lower substrate, a first integrated circuit (IC) layer that is adhered to and electrically insulated from the substrate, electrical contacts for the IC layer, and separate electrical contacts for the substrate that extend through and are insulated from the ...


7
Chet R Williams: Preventative maintenance and diagonstic system. Raytheon Company, W C Schubert, G H Lenzen Jr, May 19, 1998: US05754451 (80 worldwide citation)

A maintenance system for a machine (12) controlled by a programmable logic controller (14) having a memory (20) which stores input data received from the machine (12) and output data communicated to the machine (12). The maintenance system includes a computer (33) interfaced to the memory to be non- ...


8
Jerald F Pinter: Method for forming deep conductive feedthroughs. Hughes Aircraft Company, W C Schubert, W K Denson Low, June 21, 1994: US05322816 (77 worldwide citation)

An interconnect layer (40) for interposing between two active circuit layers of a multi-chip module (50). The interconnect layer includes a layer of silicon (14) having first surface and second surfaces. A first layer of dielectric material (16) is disposed over the first surface and a second layer ...


9
Eric F Schulte: Two terminal multi-band infrared radiation detector. Santa Barbara Research Center, W C Schubert, W K Denson Low, May 12, 1992: US05113076 (69 worldwide citation)

A radiation detector 10 includes a first heterojunction 14A and a second heterojunction 16A electrically coupled together in series between a first electrical contact 18 and a second electrical contact 20. The detector comprises at least a three regions or layers including a first layer 12 having a ...


10
Paul R Norton: Integrated IR and visible detector. Santa Barbara Research Center, W C Schubert, W K Denson Low, December 13, 1994: US05373182 (67 worldwide citation)

A radiation detector (1) includes a multi-layered substrate (2,10) having a first major surface, which is a radiation receiving surface, and a second major surface disposed opposite to the first major surface. A first detector is formed adjacent to the first major surface, the first detector being r ...