1
Bamdad Bahar, Alex R Hobson, Jeffrey A Kolde, David Zuckerbrod: Ultra-thin integral composite membrane. W L Gore & Associates, Victor M Genco Jr Esq, August 20, 1996: US05547551 (167 worldwide citation)

An ultra-thin composite membrane is provided which includes a base material and an ion exchange resin. The base material is a membrane which is defined by a thickness of less than 1 mil (0.025 mm) and a microstructure characterized by nodes interconnected by fibrils, or a microstructure characterize ...


2
David A Hanson: Method for reducing via inductance in an electronic assembly and article. W L Gore & Associates, Victor M Genco Jr, February 8, 2000: US06021564 (153 worldwide citation)

A method of making a low inductance conductive via in a laminated substrate by providing a first conductive layer. A first dielectric layer is formed on the first conductive layer. A second conductive layer is formed on the first dielectric layer. A first conductive path is formed in the first condu ...


3
Bamdad Bahar, Alex R Hobson, Jeffrey A Kolde: Integral composite membrane. W L Gore & Associates, Victor M Genco Jr, February 4, 1997: US05599614 (112 worldwide citation)

A composite membrane is provided which includes a base material and an ion exchange resin. The base material has a microstructure characterized by nodes interconnected by fibrils, or a microstructure characterized by fibrils with no nodes present. The ion exchange resin substantially impregnates the ...


4
John J Budnaitis, Jimmy Leong: Method of wafer level burn-in. W L Gore & Associates, Victor M Genco Jr, April 20, 1999: US05896038 (103 worldwide citation)

The present invention relates to a system and method for performing reliability screening on semi-conductor wafers and particularly to a highly planar burn in apparatus and method for uses including wafer level burn-in (WLBI), diced die burn-in (DDBI), and packaged die burn-in (PDBI). The burn-in sy ...


5
William G Hardie, Craig R Theorin, Edward L Kozlowski Jr, Herbert G Van Deusen: Multiple differential pair cable. W L Gore & Associates, Victor M Genco Jr, November 12, 1996: US05574250 (101 worldwide citation)

A quad or dual differential pair cable for bi-directional high speed differential signal transmission has a first differential pair of conductors and a second differential pair of conductors. The conductors extend in substantially parallel relation to one another and are electrically insulated from ...


6
James R Hanrahan: Thermally conductive polytrafluoroethylene article. Gore Enterprise Holdings, Victor M Genco Jr, August 31, 1999: US05945217 (95 worldwide citation)

A thermally conductive composite article is provided having a PTFE material or a PTFE matrix material which has disposed therein thermally conductive particles, and a phase change material.


7
David B Noddin: Semiconductor flip chip package. W L Gore & Associates, Victor M Genco Jr, January 25, 2000: US06018196 (93 worldwide citation)

A semiconductor flip chip package is provided having a semiconductor flip chip integrated circuit device and a laminated substrate. The laminated substrate has a conductive core and at least one lamina formed on the core layer. Each lamina has a dielectric layer and a conductive layer. The dielectri ...


8
William G Hardie, Craig R Theorin: Twin-ax cable. W L Gore & Associates, David J Johns, Victor M Genco Jr, January 9, 1996: US05483020 (92 worldwide citation)

A twin axial or parallel pair cable for high data rate differential signal transmission with extremely low skew. The cable has first and second plated electrical conductors which extend in substantially parallel relation to one another. Preferably the conductors are surrounded by first and second fo ...


9
Vijaysekhar Jayaraman, David J Welch: VCSEL-based multi-wavelength transmitter and receiver modules for serial and parallel optical links. W L Gore & Associates, Victor M Genco Jr, June 22, 1999: US05914976 (85 worldwide citation)

An optoelectronic module includes one or more VCSEL transmitters and/or photodetectors coincidentally aligned along a common central longitudinal axis. Differing wavelengths of light can be received and transmitted by the optoelectronic module optically coupled to a single optical fiber or in a free ...


10
David B Noddin: Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias. W L Gore & Associates, Victor M Genco Jr, August 15, 2000: US06103992 (79 worldwide citation)

A method for forming a through-via in a laminated substrate by laser drilling the through-via in a laminated substrate from a top exposed surface of the substrate to a bottom exposed surface of the substrate using a plurality of laser pulses that are trepanned in a first predetermined pattern. Each ...