1
Timothy L Jackson, Tim E Murphy: Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereof. MicronTechnology, TraskBritt PC, November 8, 2005: US06962867 (430 worldwide citation)

An apparatus and method of rerouting redistribution lines from an active surface of a semiconductor substrate to a back surface thereof and assembling and packaging individual and multiple semiconductor dice with such rerouted redistribution lines formed thereon. The semiconductor substrate includes ...


2
Timothy L Jackson, Tim E Murphy: Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods. Micron Technology, TraskBritt PC, April 8, 2008: US07355273 (296 worldwide citation)

An apparatus and method of rerouting redistribution lines from an active surface of a semiconductor substrate to a back surface thereof and assembling and packaging individual and multiple semiconductor dice with such rerouted redistribution lines formed thereon. The semiconductor substrate includes ...


3
Tongbi Jiang, Setho Sing Fee, Tay Wuu Yean, Lim Thiam Chye: Semiconductor device assemblies and packages including multiple semiconductor devices and methods. Micron Technology, TraskBritt PC, June 14, 2005: US06906415 (127 worldwide citation)

A multidie semiconductor device (MDSCD) package includes a generally planar interposer comprising a substrate with a central receptacle, upper surface conductors, and outer connectors on the lower surface of the interposer. Conductive vias connect upper surface conductors with outer connectors. One ...


4
Thomas H Kinsley, Kevin M Kilbuck: Memory stacking system and method. Micron Technology, TraskBritt PC, September 11, 2007: US07269042 (88 worldwide citation)

A method of forming a stacked memory module from a plurality of memory devices is provided. Each of the plurality of memory devices is modified to include a logic block for decoding a plurality of chip select signals. A first high density memory module is also provided that includes the modified mem ...


5
Charles E Larson: Folded interposer. Micron Technology, TraskBritt PC, April 26, 2005: US06884653 (86 worldwide citation)

A folded interposer used to achieve a high density semiconductor package is disclosed. The folded interposer is comprised of a thin, flexible material that can be folded around one or multiple semiconductor dice in a serpentine fashion. The semiconductor dice are then attached to a substrate through ...


6
Setho Sing Fee, Lim Thiam Chye: Quad flat no lead (QFN) grid array package, method of making and memory module and computer system including same. Micron Technology, TraskBritt PC, November 22, 2005: US06967125 (67 worldwide citation)

A quad flat no-lead (QFN) grid array semiconductor package and method for making the same is disclosed. The package includes a semiconductor die and a lead frame having a plurality of conductive elements patterned in a grid-type array. A plurality of bond pads on the semiconductor die is coupled to ...


7
Guohua Chen, Scott D Lautenbach, Keith E Dionne, Scott D Jordan, Steve A Berry, Craig I Rodenberger, Rupal Ayer: Osmotic delivery system, osmotic delivery system semipermeable body assembly, and method for controlling delivery rate of beneficial agents from osmotic delivery systems. ALZA Corporation, TraskBritt PC, August 2, 2005: US06923800 (54 worldwide citation)

Osmotic delivery system semipermeable body assemblies that control the delivery rate of a beneficial agent from an osmotic delivery system incorporating one of the semipermeable body assemblies are provided. A semipermeable body assembly or plug includes a semipermeable body which is positionable in ...


8
Scott Jay Gilbert: Osmotic delivery device having a two-way valve and a dynamically self-adjusting flow channel. Alza Corporation, TraskBritt PC, March 21, 2006: US07014636 (54 worldwide citation)

An implantable osmotically driven delivery system having a dynamic, two-way valve and a self-adjusting, variable geometry fluid flow channel. As pressure within the agent delivery system increases, the fluid channel narrows, thereby restricting flow. At exceptionally high pressures, the valve can be ...


9
Ford B Grigg, William J Reeder: Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask. Micron Technology, TraskBritt PC, January 10, 2006: US06984545 (46 worldwide citation)

A solder mask includes an opening through which intermediate conductive elements may be positioned between bond pads of a semiconductor die exposed through an aligned opening in a carrier substrate to which the solder mask is secured and corresponding contact areas of the carrier substrate. An assem ...


10
Walter L Moden: Flip-chip adaptor package for bare die. Micron Technology, TraskBritt PC, February 12, 2008: US07329945 (38 worldwide citation)

A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead placement arrangement. The board comprises a printed circuit board including first elements, such as mi ...