1
Timothy Jay Dell, Mark William Kellogg, Bruce Gerard Hazelzet: SIMM/DIMM memory module. International Business Machines, Francis J Thornton, Robert A Walsh, Thornton & Thornton, August 29, 2000: US06111757 (145 worldwide citation)

A memory module configured such that it can be operated as a first memory module such as a (Single In-line Memory Module) SIMM or as a second memory module such as a (Dual In-linc Memory Module) DIMM module without requiring external switching circuitry. This is accomplished by providing a memory mo ...


2
Raymond James Bunkofske: Method and apparatus for coating a semiconductor wafer. International Business Machine, David R Thornton, Thornton & Thornton, January 6, 1998: US05705223 (108 worldwide citation)

These desirable results and other objects of the present invention are realized and provided by depositing coating material on a front surface of a rotating wafer to spread a thin film over this surface while directing a light positive pressure of clean gas over the backside of the spinning wafer to ...


3
Toshiki Hirano, Atsuo Kimura, Shinichiro Mori: Semi-conductor chip test probe and process for manufacturing the probe. International Business Machines, William D Sabo, Mark F Chadurjian, Thornton & Thornton, March 3, 1998: US05723347 (100 worldwide citation)

This discloses a probe structure which does not rely on cantilevered wire and which has controlled contact pressure between the probe contacts and the I/O pads on a semi-conductor chip and which comprises a plurality of conductive contact electrodes, electrically coupled to respective leads, formed, ...


4
Thomas G Ference, Wayne J Howell: Ultra fine probe contacts. International Business Machines Corporation, Francis J Thornton, Robert A Walsh, Thornton & Thornton, July 20, 1999: US05926029 (98 worldwide citation)

This discloses a probe structure which does not rely on cantilevered wire and which has improved and controlled contact pressure between the probe tip contacts and the I/O pads on a semiconductor chip and which comprises a plurality of conductive contact electrodes, electrically coupled to respectiv ...


5
Toshiki Hirano, Atsuo Kimura, Shinichiro Mori: Semi-conductor chip test probe. International Business Machines, William D Sabo, Thornton & Thornton, April 29, 1997: US05625298 (66 worldwide citation)

This discloses a probe structure which does not rely on cantilevered wire and which has improved and controlled contact pressure between the probe contacts and the I/O pads on a semi-conductor chip and which comprises a plurality of conductive contact electrodes, electrically coupled to respective l ...


6
Richard Charles Dodge, Kenneth Haskell Earl, Gary D Grise, Douglas R Guild, Karl D Loughner, Jerzy Maria Zalesinski: Integrated heat exchanger for memory module. International Business Machines, David R Thornton, Robert A Walsh, Thornton & Thornton, February 15, 2000: US06025992 (64 worldwide citation)

A circuit card unit comprising a memory card and attached heat exchanger comprising a thin, flexible, laminated strip of foil clad plastic, or wire mesh, affixed in thermally conductive contact to each card module and extended therefrom to facilitate removal of heat from the modules. In some embodim ...


7
Peter A Burke, Eric H Freeman, Gilbert H Ross: Chemical-mechanical polishing tool with end point measurement station. International Business Machines, William D Sabo, Thornton & Thornton, February 20, 1996: US05492594 (63 worldwide citation)

This is a wafer polishing and planarizing tool in which there is incorporated a separate measuring station and means for moving the wafer and immersing the wafer into the measuring station without removing it from the polishing head. The wafer being treated is quickly, reliably and periodically chec ...


8
Akashi Satoh, Hideto Niijima: Data search and compression device and method for searching and compressing repeating data. International Business Machines, Mark Chadurjian, Thornton & Thornton, September 5, 1995: US05448733 (44 worldwide citation)

This is a variable length data search apparatus which uses a latch, added to each word of a cell array. In this apparatus, the search operation is self controlled by using the previous matching signals stored in the latches. A character string (ABCA), from a data string (BABCABB . . . ), is stored, ...


9
Claude Louis Bertin, Wayne John Howell, William Robert Patrick Tonti, Jerzy Maria Zalesnski: Integrated high-performance decoupling capacitor. International Business Machines, Robert A Walsh, Thornton & Thornton, September 22, 1998: US05811868 (40 worldwide citation)

An integrated high-performance decoupling capacitor, formed on a semiconductor chip, using the substrate of the chip itself in conjunction with a metallic deposit formed on the presently unused chip back surface and electrically connected to the active chip circuit to result in a significant and ver ...


10
Anthony M Palagonia: Semiconductor chip high density packaging. International Business Machines, Eugene Shkurko, Thornton & Thornton, February 18, 1997: US05604377 (36 worldwide citation)

A packaging scheme for a stack of semiconductor chips that is light weight and has better cooling and mechanical and electrical protection than that hitherto provided for. The stack of semiconductor chips are connected to a wiring interface. Separating each of the chips from any adjacent chip is a s ...