1
Warren M Farnworth, Alan G Wood, David R Hembree: Method for fabricating semiconductor components and interconnects with contacts on opposing sides. Stephen A Gratton, The Law Office Of Steve Gratton, May 1, 2003: US20030080408-A1 (2 worldwide citation)

A method for fabricating semiconductor components and interconnects includes the steps of providing a substrate, such as a semiconductor die, forming external contacts on opposing sides of the substrate by laser drilling vias through the substrate, and forming conductive members in the vias. The con ...


2
Victor Tan Cher Khng, Lee Kian Chai: Semiconductor package having substrate with multi-layer metal bumps. Stephen A Gratton, The Law Office Of Steve Gratton, June 26, 2003: US20030116866-A1 (1 worldwide citation)

A semiconductor package includes a substrate formed of a board material, a semiconductor die bonded to the substrate, and an encapsulant on the die. The package also includes an array of external contacts formed as multi layered metal bumps that include a base layer, a bump layer, and a non-oxidizin ...


3
Mike Connell, Tongbi Jiang: Semiconductor package with circuit side polymer layer and wafer level fabrication method. Stephen A Gratton, The Law Office Of Steve Gratton, January 15, 2004: US20040009631-A1 (1 worldwide citation)

A semiconductor package includes a substrate, a die attached and wire bonded to the substrate, and a die encapsulant encapsulating the die. The die includes a circuit side having a pattern of die contacts, planarized wire bonding contacts bonded to the die contacts, and a planarized polymer layer on ...


4
David R Hembree, Jorge L de Varona: Semiconductor component having redistribution conductors and bumped contacts on selected portions thereof. Stephen A Gratton, The Law Office Of Steve Gratton, May 13, 2004: US20040089954-A1 (1 worldwide citation)

A bumped semiconductor component includes bumped contacts, a semiconductor die having die contacts, and a redistribution circuit having conductors for establishing electrical communication between the die contacts and the bumped contacts. The redistribution circuit also includes test contacts in ele ...


5
David R Hembree, Jorge L de Varona: Bumped semiconductor component having test pads, and method and system for testing bumped semiconductor components. Stephen A Gratton, The Law Office Of Steve Gratton, August 23, 2001: US20010015439-A1 (1 worldwide citation)

A bumped semiconductor component includes bumped contacts, a semiconductor die having die contacts, and a redistribution circuit having conductors for establishing electrical communication between the die contacts and the bumped contacts. The redistribution circuit also includes test contacts in ele ...


6
Salman Akram, Warren M Farnworth, David R Hembree: Test system with mechanical alignment for semiconductor chip scale packages and dice. Stephen A Gratton, The Law Office Of Steve Gratton, May 3, 2001: US20010000646-A1

A test system for testing semiconductor components, such as bumped dice and chip scale packages, is provided. The test system includes a base for retaining one or more components, and an interconnect for making temporary electrical connections with the components. The test system also includes an al ...


7
Salman Akram, Warren M Farnworth, Michael E Hess, David R Hembree: Test system having alignment member for aligning semiconductor components. Stephen A Gratton, The Law Office Of Steve Gratton, May 3, 2001: US20010000650-A1

A test system for testing semiconductor components includes an interconnect having contacts for making temporary electrical connections with terminal contacts on the components. The interconnect contacts can be configured to electrically engage planar terminal contacts (e.g., bond pads, test pads) o ...


8
Warren M Farnworth, Salman Akram, James M Wark, Derek Gochnour: Test carrier with variable force applying mechanism for testing semiconductor components. Stephen A Gratton, The Law Office Of Steve Gratton, April 19, 2001: US20010000295-A1

A semiconductor carrier for testing semiconductor components, such as bare dice and chip scale packages, and a method for testing components using the carrier, are provided. The carrier includes a base, an interconnect for making temporary electrical connections with the component, and a force apply ...


9
David A Zimlich, David A Cathey: Field emission display having circuit for preventing emission to grid. Stephen A Gratton, The Law Office Of Steve Gratton, May 10, 2001: US20010000944-A1

A field emission display includes an array of emitter sites, a grid for controlling electron emission from the emitter sites, and a display screen. The field emission display also includes a control circuit for controlling the grid for preventing emission to grid. The control circuit includes a high ...


10
David R Hembree, Salman Akram: Test carrier with decoupling capacitors for testing semiconductor components. Stephen A Gratton, The Law Office Of Steve Gratton, May 24, 2001: US20010001542-A1

A test carrier for testing a semiconductor component includes at least one decoupling capacitor for reducing parasitic inductance and noise in test signals transmitted to the component. The carrier includes a base, an interconnect for making temporary electrical connections with the component, and a ...