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Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Guilian Gao, Belgacem Haba, David Ovrutsky: Microelectronic assemblies having compliancy and methods therefor. Tessera Technologies Hungary Kft, Tessera, LERNER DAVID et al, June 26, 2008: US20080150121-A1

A method of making a microelectronic assembly includes providing a semiconductor wafer having contacts accessible at a first surface, forming compliant bumps over the first surface and depositing a sacrificial layer over the compliant bumps. The method includes grinding the sacrificial layer and the ...


2
Belgacem Haba Belgacem (Bel) Haba
Ilyas Mohammed, Belgacem Haba, Wael Zohni, Philip R Osborn: Semiconductor chip packages having cavities. Tessera, Tessera, LERNER DAVID et al, December 11, 2008: US20080303132-A1

Packaged microelectronic elements are provided which include a dielectric element, a cavity, a plurality of chip contacts and a plurality of package contacts, and microelectronic elements having a plurality of bond pads connected to the chip contacts.


3
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, David Ovrutsky, Charles Rosenstein, Belgacem Haba, Giles Humpston: Wafer-level fabrication of lidded chips with electrodeposited dielectric coating. Tessera Technologies Hungary Kft, Tessera, LERNER DAVID et al, May 1, 2008: US20080099900-A1

A method is provided for fabricating a unit including a semiconductor element such as a sensor unit, e.g., for optical imaging. A semiconductor element has plurality of conductive features exposed at the front surface and semiconductive or conductive material exposed at least one of the front and re ...


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Craig S Mitchell, Apolinar Alvarez: Substrate for a microelectronic package and method of fabricating thereof. Tessera, Tessera, LERNER DAVID et al, October 11, 2007: US20070235856-A1

Substrates having molded dielectric layers and methods of fabricating such substrates are disclosed. The substrates may advantageously be used in microelectronic assemblies having high routing density.


5
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Chang Myung Ryu, Kimitaka Endo, Christopher Paul Wade: Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layer. Tessera Interconnect Materials, Tessera, LERNER DAVID et al, February 25, 2010: US20100044860-A1

An interconnection element can include a substrate, e.g., a connection substrate, element of a package, circuit panel or microelectronic substrate, e.g., semiconductor chip, the substrate having a plurality of metal conductive elements such as conductive pads, contacts, bond pads, traces, or the lik ...


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Belgacem Haba Belgacem (Bel) Haba
Craig S Mitchell, Belgacem Haba: Micro lead frame packages and methods of manufacturing the same. Tessera, Tessera, LERNER DAVID et al, May 11, 2006: US20060099789-A1

Microelectronic packages include a microelectronic element and portions of a lead frame disposed beneath the microelectronic element. The lead frame may be laminated with a dielectric element and the resulting laminate may be punched to remove the bus bar included in the lead frame, thereby forming ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Teck Gyu Kang, Ilyas Mohammed, Ellis Chau: Microelectronic packages and methods therefor. Tessera, Tessera, LERNER DAVID et al, September 16, 2010: US20100232129-A1

A method of making a microelectronic assembly includes providing a microelectronic package having a substrate, a microelectronic element overlying the substrate and at least two conductive elements projecting from a surface of the substrate, the at least two conductive elements having surfaces remot ...


8
Belgacem Haba Belgacem (Bel) Haba
Chang Myung Ryu, Kimitaka Endo, Belgacem Haba, Yoichi Kubota: Microelectronic interconnect element with decreased conductor spacing. Tessera, Tessera, LERNER DAVID et al, January 14, 2010: US20100009554-A1

A microelectronic interconnect element can include a plurality of first metal lines and a plurality of second metal lines interleaved with the first metal lines. Each of the first and second metal lines has a surface extending within the same reference plane. The first metal lines have surfaces abov ...


9
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, David B Tuckerman, Giles Humpston, Richard Dewitt Crisp: Connection structures for microelectronic devices and methods for forming such structures. Tessera, Tessera, LERNER DAVID et al, February 16, 2006: US20060032670-A1

Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive posts. Each post extends from a bas ...


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Belgacem Haba Belgacem (Bel) Haba
Robert Burtzlaff, Belgacem Haba, Giles Humpston, David B Tuckerman, Michael Warner, Craig S Mitchell: Back-face and edge interconnects for lidded package. Tessera, Tessera, LERNER DAVID et al, May 3, 2007: US20070096295-A1

A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion of the front surface of the chip, the lid having a top surface facing upwardly away from the chip and ...