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Michael P Dayton: Minimally invasive bioactivated endoprosthesis for vessel repair. John S Munday, Stephen G Stanton, September 12, 1995: US05449382 (381 worldwide citation)

A minimally invasive bioactivated endoprosthesis device for vessel repair. The device comprises a stent which is formed from metal or polymers into a predetermined shape which includes a plurality of holes patterned with a desired size, shape and number to provide a desired bending modulus. The sten ...


2
Michael P Dayton: Minimally invasive bioactivated endoprosthesis for vessel repair. Michael Peck Dayton, Kenneth Granke, John S Munday, Stephen G Stanton, November 26, 1996: US05578075 (262 worldwide citation)

A minimally invasive bioactivated endoprosthesis device for vessel repair. The device comprises a stent which is formed from metal or polymers into a predetermined shape which may include a plurality of holes patterned with a desired size, shape and number. The stent is then coated with a polymer or ...


3
Ravi Sundaresan, Yang Pan, James Yong Meng Lee, Ying Keung Leung, Yelehanka Ramachandramurthy Pradeep, Jia Zhen Zheng, Lap Chan, Elgin Quek: Method to form transistors with multiple threshold voltages (VT) using a combination of different work function gate materials. Chartered Semiconductor Manufacturing, George O Saile, Rosemary L S Pike, Stephen G Stanton, October 9, 2001: US06300177 (127 worldwide citation)

A method of forming a gate electrode, comprising the following steps. A semiconductor substrate having an overlying patterned layer exposing a portion of the substrate within active area and patterned layer opening. The patterned layer having exposed sidewalls. Internal spacers are formed over a por ...


4
Ling Sung Wang: Shallow trench isolation (STI) module to improve contact etch process window. Taiwan Semiconductor Manufacturing Company, George O Saile, Stephen B Ackerman, Stephen G Stanton, December 31, 2002: US06500728 (121 worldwide citation)

A method of fabricating a dual-oxide STI comprising the following steps. A structure having an STI opening formed therein is provided. An HDP silicon oxide layer portion is formed within the STI opening, partially filling the STI opening. A planarized HDP silicon-rich-oxide cap layer is formed upon ...


5
Chao Cheng Chen: Multiple etch method for forming residue free patterned hard mask layer. Taiwan Semiconductor Manufacturing Company, George O Saile, Stephen B Ackerman, Stephen G Stanton, August 21, 2001: US06277752 (114 worldwide citation)

A method for forming a patterned hard mask layer. There is first provided a substrate. There is then formed over the substrate a blanket hard mask layer formed of a hard mask material susceptible to etching within a first plasma etch method, where the first plasma etch method employs a first etchant ...


6
Wen Yu Ku, Fang Cheng Lu, Ting Pang Li, Cheng Chung Wang: N-type buried layer drive-in recipe to reduce pits over buried antimony layer. Taiwan Semiconductor Manufacturing Company, George O Saile, Stephen B Ackerman, Stephen G Stanton, September 3, 2002: US06444551 (95 worldwide citation)

A method of driving-in antimony into a wafer, including the following steps. A wafer is loaded into an annealing furnace/tool. The wafer having an area of implanted antimony ions. The wafer is annealed a first time at a first temperature in the presence of only a first nitrogen gas flow rate. The wa ...


7
John Sudijono, Liang Ch O Hsia, Liu Wu Ping: Copper recess formation using chemical process for fabricating barrier cap for lines and vias. Chartered Semiconductor Manufacturing, George O Saile, Rosemary L S Pike, Stephen G Stanton, March 16, 2004: US06706625 (93 worldwide citation)

A method of fabricating a planarized barrier cap layer over a metal structure comprising the following steps. A substrate having an opening formed therein is provided. The substrate having an upper surface. A planarized metal structure is formed within the opening. The planarized metal structure bei ...


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Allison J Jacobs, Scott Jacobs: Custom dental tray. John S Munday, Stephen G Stanton, April 1, 1997: US05616027 (73 worldwide citation)

A dual dental tray assembly is provided which includes a pliable resilient outer dental tray using a pre-formed thin inner tray of thermoplastic material that nests inside the pliable outer tray. The two are heated to between 145.degree.-160.degree. F. During this time the inner tray is more formabl ...


10
Allison J Jacobs, Scott Jacobs: Custom dental tray. John S Munday, Stephen G Stanton, October 8, 1996: US05562449 (72 worldwide citation)

A dual dental tray assembly is provided which includes a pliable resilient outer dental tray using a pre-formed thin inner tray of thermoplastic material that nests inside the pliable outer tray. The two are heated to between 145.degree.-160.degree. F. During this time the inner tray is more formabl ...



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