1
Yan Ye, Pavel Ionov, Allen Zhao, Peter Chang Lin Hsieh, Diana Xiaobing Ma, Chun Yan, Jie Yuan: Method of etching patterned layers useful as masking during subsequent etching or for damascene structures. Applied Materials, Shirley L Church, June 27, 2000: US06080529 (264 worldwide citation)

A first embodiment of the present invention pertains to a method of patterning a semiconductor device conductive feature while permitting easy removal of any residual masking layer which remains after completion of the etching process. A multi-layered masking structure is used which includes a layer ...


2
Robert Robertson, Kam S Law, John M White: Method and apparatus for protection of conductive surfaces in a plasma processing reactor. Applied Materials, Shirley L Church, November 22, 1994: US05366585 (188 worldwide citation)

An apparatus and method for protecting conductive, typically metallic, walls (212) of a plasma process chamber (200) from accumulation of contaminants thereon and from reaction with a gas plasma and either deposition-gas plasma by-products. A ceramic barrier material (220-223), preferably of at leas ...


3
Woonza M Rhee, Richard A Berg: Glycosaminoglycan-synthetic polymer conjugates. Collagen Corporation, Kathi Rafayko, Shirley L Church, April 23, 1996: US05510418 (182 worldwide citation)

Pharmaceutically acceptable, nonimmunogenic compositions are formed by covalently binding glycosaminoglycans or derivatives thereof, to hydrophilic synthetic polymers via specific types of chemical bonds to provide biocompatible conjugates. Useful glycosaminoglycans include hyaluronic acid, the chon ...


4
Yu Huei Chang: Capacitive type touch panel. Sense Pad Tech, Shirley L Church Esq, January 4, 2011: US07864503 (158 worldwide citation)

A capacitive type touch panel includes: a transparent substrate; an array of first conductors formed on a surface of the transparent substrate; an array of second conductors formed on the surface of the transparent substrate; a plurality of conductive first bridging lines, each of which interconnect ...


5
Jeffrey E Yeung, George H Chu, Frank A DeLustro, Woonza M Rhee: Anti-adhesion films and compositions for medical use. Collagen Corporation, Laurie A Axford, Shirley L Church, Wilhelmus J Wytenburg, December 3, 1996: US05580923 (157 worldwide citation)

Anti-adhesion films useful for the prevention of surgical adhesions are disclosed. These films comprise substrate materials (such as collagen) and hetero-bifunctional anti-adhesion binding agents, wherein the substrate material is covalently linked to receptive tissue within the body of a patient vi ...


6
David Mui, Dragan Podlesnik, Wei Liu, Gene Lee, Nam Hun Kim, Jeff Chinn: Method for etching a trench having rounded top and bottom corners in a silicon substrate. Applied Materials, Shirley L Church, May 22, 2001: US06235643 (152 worldwide citation)

The present invention provides straight forward methods for plasma etching a trench having rounded top corners, or rounded bottom corners, or both in a silicon substrate. A first method for creating a rounded top corner on the etched silicon trench comprises etching both an overlying silicon oxide l ...


7
Chun Yan, Gary C Hsueh, Yan Ye, Diana Xiaobing Ma: Method for etching low k dielectrics. Applied Materials, Shirley L Church, Joseph Bach, April 15, 2003: US06547977 (146 worldwide citation)

The present disclosure pertains to a method for plasma etching of low k materials, particularly polymeric-based low k materials. Preferably the polymeric-based materials are organic-based materials. The method employs an etchant plasma where the major etchant species are generated from a halogen oth ...


8
Soo Young Choi, John M White, Qunhua Wang, Beom Soo Park: Method of controlling the film properties of PECVD-deposited thin films. Applied Materials, Shirley L Church, August 31, 2010: US07785672 (138 worldwide citation)

We have discovered methods of controlling a combination of PECVD deposition process parameters during deposition of thin films which provides improved control over surface standing wave effects which affect deposited film thickness uniformity and physical property uniformity. By minimizing surface s ...


9
Robert J Steger, Fred C Redeker: Apparatus and method for cleaning of semiconductor process chamber surfaces. Applied Materials, Shirley L Church, August 4, 1998: US05788799 (133 worldwide citation)

In accordance with the present invention, a temperature-controlled ceramic liner or barrier is used adjacent to process chamber surfaces during a plasma-comprising process, with the liner or barrier temperature being set to reduce the formation of deposits upon or to aid in the removal of deposits f ...


10
Yan Ye, Allen Zhao, Peter Chang Lin Hsieh, Diana Xiaobing Ma: Method for high temperature etching of patterned layers using an organic mask stack. Applied Materials, Shirley L Church, November 7, 2000: US06143476 (126 worldwide citation)

The present disclosure pertains to a method of patterning a semiconductor device feature which provides for the easy removal of any residual masking layer which remains after completion of a pattern etching process. The method provides for a multi-layered masking structure which includes a layer of ...