1
David Sherrer
David W Sherrer, Noel A Heiks: Optoelectronic component comprising an encapsulant. Nuvotronics, Sherr & Vaughn PLLC, August 24, 2010: US07781727 (237 worldwide citation)

Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.


2
David Sherrer
David W Sherrer, Jean Marc Rollin: Coaxial transmission line microstructures and methods of formation thereof. Nuvotronics, Sherr & Vaughn PLLC, March 1, 2011: US07898356 (52 worldwide citation)

Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have p ...


3
David Sherrer
David W Sherrer, Larry J Rasnake, John J Fisher: Device package and methods for the fabrication and testing thereof. Nuvotronics, Sherr & Vaughn PLLC, November 11, 2008: US07449784 (36 worldwide citation)

Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the ...


4
David Sherrer
William D Houck, David W Sherrer: Three-dimensional microstructures having an embedded support member with an aperture therein and method of formation thereof. Nuvotronics PLLC, Sherr & Vaughn PLLC, February 2, 2010: US07656256 (36 worldwide citation)

Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagne ...


5
David Sherrer
David W Sherrer, John J Fisher: Coaxial waveguide microstructure having conductive and insulation materials defining voids therein. Nuvotronics, Sherr & Vaughn PLLC, May 24, 2011: US07948335 (34 worldwide citation)

Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor ...


6
David Sherrer
David W Sherrer, Christopher A Nichols, Shifang Zhou: Three-dimensional microstructures having an embedded and mechanically locked support member and method of formation thereof. Nuvotornics, Sherr & Vaughn PLLC, January 19, 2010: US07649432 (33 worldwide citation)

Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are mechanically locked to one another. The microstructures find use, for example, in coaxial transmission lines for ...


7
David Sherrer
David W Sherrer, William D Houck: Three-dimensional microstructures and methods of formation thereof. Nuvotronics, Sherr & Vaughn PLLC, October 4, 2011: US08031037 (31 worldwide citation)

Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagne ...


8
David Sherrer
David W Sherrer, Larry J Rasnake, John J Fisher: Device package and methods for the fabrication and testing thereof. Nuvotronics, Sherr & Vaughn PLLC, February 15, 2011: US07888793 (7 worldwide citation)

Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the ...


9
David Sherrer
David W Sherrer, John J Fisher: Coaxial waveguide microstructures having an active and methods of formation thereof. Rohm and Haas Electronic Materials, Sherr & Vaughn Pllc, March 5, 2009: US20090058569-A1

Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor ...


10
David Sherrer
Jean Marc Rollin, David W Sherrer: Integrated electronic components and methods of formation thereof. Sherr & Vaughn Pllc, November 25, 2010: US20100296252-A1

Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromag ...