Ronald Boisvert, Stelian Grigoras, David Ha, Brian Harkness, Craig Yeakle: Etch-stop resins. Dow Corning Corporation, Sharon K Brady, August 2, 2005: US06924346 (12 worldwide citation)

Silicone resins comprising 5 to 50 mole % of (PhSiO3-x)/2(OH)x) units and 50 to 95 mole % (HSiO(3-x)/2(OH)x), where Ph is a phenyl group, x has a value of 0, 1 or 2 and wherein the cured silicone resin has a critical surface free energy of 30 dynes/cm or higher. These resins are useful as etch stop ...

Sanlin Hu, Eric Scott Moyer, Sheng Wang, David Lee Wyman: Silsesquioxane resin. Dow Corning Corporation, Sharon K Brady, December 1, 2009: US07625687 (9 worldwide citation)

This invention pertains to a silsesquioxane resin with improved lithographic properties (such as etch-resistance, transparency, resolution, sensitivity, focus latitude, line edge roughness, and adhesion) suitable as a photoresist; a method for in-corporating the fluorinated or non-fluorinated functi ...

Karmen Karen Asch, Brian Douglas Chapman, Loren Dean Durfee, Robert Michael Hensel, Timothy Paul Mitchell, James Steven Tonge, Paul Cornelius Van Dort, Loretta Ann Jones: Compositions having improved bath life. Dow Corning Corporation, Patricia M Scaduto, Sharon K Brady, May 27, 2008: US07378482 (8 worldwide citation)

A composition comprising (A) at least one compound having at least one aliphatic unsaturation; (B) at least one organohydrogensilicon compound containing at least one silicon-bonded hydrogen atom per molecule and (C) a platinum group metal-containing catalyst.

Michael L Bradford, Eric Scott Moyer, Sheng Wang, Craig Rollin Yeakle: Silsesquioxane resins. Dow Corning Corporation, Erika Takeuchi, Sharon K Brady, November 6, 2012: US08304161 (7 worldwide citation)

A silsesquioxane resin comprised of the units (Ph(CH2)rSiO(3-x)/2(OR′)x)m, (HSiO(3-x)/2(OR′)x)n′(MeSiO(3-x)/2(OR′)x)o′(RSiO(3-x)/2(OR′)x)p, (R1SiO(3-x)/2(OR′)x)q where Ph is a phenyl group, Me is a methyl group; R′ is hydrogen atom or a hydrocarbon group having from 1 to 4 carbon atoms; R is selecte ...

Zuchen Lin, Shizhong Zhang, Mark Fisher: Thermally conductive grease and methods and devices in which said grease is used. Dow Corning Corporation, Sharon K Brady, April 13, 2010: US07695817 (7 worldwide citation)

A thermally conductive grease includes (A) a polyorganosiloxane having a viscosity less than 50 cSt (mm2/s) at 25° C. and (B) a thermally conductive filler. The thermally conductive grease is useful as a thermal interface material for electronic devices.

Hugh Patrick Craig, David John James Lowrie: Adhesive and encapsulating material with fluxing properties. Dow Corning Corporation, Sharon K Brady, December 6, 2005: US06971163 (5 worldwide citation)

The attachment of an electrical component to an electrical termination on a component-carrying substrate by a solder bump technique of a thermally curable adhesive composition for encapsulating purposes is described which comprises a thermosetting polymer and a chemical cross-linking agent which has ...

Stephen Edward Cray, Robert Alan Ekeland, Peter Cheshire Hupfield, Sarah O Hare, David A Rich, Marc Thibaut: Silicone release coating compositions. Dow Corning Corporation, Alan Zombeck, Sharon K Brady, September 22, 2009: US07592412 (4 worldwide citation)

A release coating composition according to the present invention comprises an alkenyl functional polysiloxane (1), a silicon hydride functional polysiloxane (11) and a catalyst (111) comprising a platinum group metal. The alkenyl functional polysiloxane (1) is an alkenylterminated polysiloxane prepa ...

Gerald Kenneth Schalau II, Xavier Jean Paul Thomas, Victor Albert Raul, David Clayton Gantner, Katherine Lynn Ulman: Silicone adhesive for adhesion to wet surfaces. Dow Corning Corporation, Sharon K Brady, March 29, 2011: US07914645 (3 worldwide citation)

A silicone adhesive composition used for adhering a device or a substance to a wet surface contains (i) a silicone resin that is cohydrolysis product of a trialkyl hydrolyzable silane and an alkyl silicate in which the cohydrolysis product contains a plurality of silicon-bonded hydroxy groups; (ii) ...

Bianxiao Zhong: Siloxane resin coating. Dow Corning Corporation, Sharon K Brady, David M LaPrairie, November 23, 2010: US07838615 (3 worldwide citation)

A siloxane resin having the formula: (HSiO3/2)a(RSiO3/2)b(SiO4/2)c where R is Z, Z(CH2)n or ZO(CH2)n where Z is a phenyl or substituted phenyl group; n has a value of 1 to 6, a has value of 0.01 to 0.7, b has a value of 0.05 to 0.7, c has a value of 0.1 to 0.9 and a+b+c≈1. The siloxane resins are us ...

Peng Fei Fu, Eric Scott Moyer, Craig Rollin Yeakle: Method for forming anti-reflective coating. Dow Corning Corporation, Sharon K Brady, November 16, 2010: US07833696 (2 worldwide citation)

Silsesquioxane resins useful in forming the antireflective coating having the formula (PhSiO(3-x)/2(OH)x)mHSiO(3-x)/2(OH)x)n(MeSiO(3-x)/2(OH)x)p(RSiO(3-x)/2(OH)x)q where Ph is a phenyl group, Me is a methyl group, R is selected from ester groups and polyether groups, x has a value of 0, 1 or 2; m ha ...