1
David Jon Hiner, Ronald Patrick Huemoeller, Sukianto Rusli: Method of manufacturing a semiconductor package. Amkor Technology, Gunnison McKay & Hodgson L, Serge J Hodgson, March 6, 2007: US07185426 (258 worldwide citation)

A semiconductor package including top-surface terminals for mounting another semiconductor package provides a three-dimensional circuit configuration that can provide removable connection of existing grid-array packages having a standard design. A semiconductor die is mounted on an electrically conn ...


2
Christopher Marc Scanlan, Ronald Patrick Huemoeller: Semiconductor package including a top-surface metal layer for implementing circuit features. Amkor Technology, Gunnison McKay & Hodgson L, Serge J Hodgson, December 15, 2009: US07633765 (220 worldwide citation)

A semiconductor package including a top-surface metal layer for implementing circuit features provides improvements in top-surface interconnect density, more flexible routing and mounting of top surface semiconductor packages, dies and passive components or a conformal shield cap implementation. The ...


3
Thomas P Glenn, Steven Webster, Tony Arellano: Wafer scale image sensor package fabrication method. Amkor Technology, Serge J Hodgson, Gunnison McKay & Hodgson L, January 7, 2003: US06503780 (177 worldwide citation)

To form an image sensor package, a series of shallow cuts are made in an interior surface of a window sheet having a plurality of windows. A window support layer is formed on an upper surface of a wafer having a plurality of image sensors. The interior surface of the window sheet is pressed into the ...


4
Thomas P Glenn, Steven Webster, Tony Arellano: Wafer scale image sensor package. Amkor Technology, Serge J Hodgson, Gunnison McKay & Hodgson L, June 18, 2002: US06407381 (174 worldwide citation)

An image sensor package includes an image sensor having bond pads and an active area on an upper surface of the image sensor. The image sensor package further includes a window support on the upper surface of the image sensor. The window support entirely encloses the upper surface including the acti ...


5
Bryan Kingsford, Stan McQueen, Woody Thrower: System for penetrating computer or computer network. Symantec Corporation, Serge J Hodgson, Gunnison McKay & Hodgson L, June 3, 2003: US06574737 (159 worldwide citation)

A computer network penetration test discovers vulnerabilities in the network using a number of scan modules. The scan modules perform their scanning of the network separately but in parallel. A scan engine controller oversees the data fed to and received from the scan modules, and controls the shari ...


6
Douglas Jay Mathews, Robert Joseph Hill, Michael Paul Gaynor, Ronald James Schoonejongen, John Armando Miranda, Christopher Marc Scanlan: Multi-chip semiconductor package with integral shield and antenna. Amkor Technology, Tyco Electronics Logistics, Serge J Hodgson, Gunnison McKay & Hodgson L, February 3, 2004: US06686649 (153 worldwide citation)

A transceiver package includes a substrate having an upper surface. An electronic component is mounted to the upper surface of the substrate. A shield encloses the electronic component and shields the electronic component from radiation. The transceiver package further includes an antenna and a diel ...


7
Thomas P Glenn, Steven Webster: Molded window array for image sensor packages. Amkor Technology, Serge J Hodgson, Gunnison McKay & Hodgson L, July 24, 2001: US06266197 (149 worldwide citation)

Image sensor packages are fabricated simultaneously to minimize the cost associated with each individual image sensor package. To fabricate the image sensor packages, windows are molded in molding compound to form a molded window array. A substrate includes a plurality of individual substrates integ ...


8
David Jon Hiner, Ronald Patrick Huemoeller, Sukianto Rusli: Semiconductor package including top-surface terminals for mounting another semiconductor package. Amkor Technology, Gunnison McKay & Hodgson L, Serge J Hodgson, March 2, 2010: US07671457 (146 worldwide citation)

A semiconductor package including top-surface terminals for mounting another semiconductor package provides a three-dimensional circuit configuration that can provide removable connection of existing grid-array packages having a standard design. A semiconductor die is mounted on an electrically conn ...


9
Donald Creig Humes: System and method for filtering data received by a computer system. Symantec Corporation, Serge J Hodgson, Gunnison McKay & Hodgson L, March 25, 2003: US06539430 (145 worldwide citation)

The present invention provides a system and method for restricting access to data received by a computer over a network by filtering certain data from the data received. In a preferred embodiment, the present invention provides a computer based method for filtering objectionable or target text data ...


10
Thomas P Glenn, Steven Webster, Roy Dale Hollaway: Flip chip image sensor package fabrication method. Amkor Technology, Serge J Hodgson, Gunnison McKay & Hodgson L, June 3, 2003: US06571466 (136 worldwide citation)

A method of fabricating a flip chip image sensor package includes forming an aperture in a substrate and mounting an image sensor to the substrate. The image sensor is mounted such that an active area of the image sensor is aligned with the aperture. A bead is formed around a periphery of the image ...