1
Donald J Redwine: Method of interconnect in an integrated circuit. Texas Instruments Incorporated, William W Holloway, Rich Donaldson, Leo Heiting, April 23, 1996: US05510298 (237 worldwide citation)

An integrated circuit interconnect structure is provided, along with a method of forming the integrated circuit interconnect structure. A semiconductor material layer has an elongate trench formed therein. A conducting region is disposed in the trench. An insulator region overlies the conducting reg ...


2
Osaomi Enomoto, Yoichi Miyai, Yoshihiro Ogata, Yoshinobu Yoneoka: Two-step sinter method utilized in conjunction with memory cell replacement by redundancies. Texas Instruments Incorporated, Rich Donaldson, Leo Heiting, Richard B Havill, May 7, 1996: US05514628 (41 worldwide citation)

A process is disclosed herein for increasing yield in a semiconductor circuity having redundant circuitry for replacing defective normal circuitry in the semiconductor integrated circuit. In the first step, an insufficient sinter operation (50) is carried out in a hydrogen atmosphere at a temperatur ...


3
Eugene G Dierschke: High-radiance emitters with integral microlens. Texas Instruments Incorporated, Gary Honeycutt, Rich Donaldson, Mel Sharp, July 21, 1981: US04279690 (38 worldwide citation)

This invention deals with the fabrication of radiation emitting diodes having a small diameter shaped integral microlens formed by etching. Initially an oxide layer is deposited on the backside of the processed slice; then a ring pattern is opened in the oxide. An etch is used to form a ring groove ...


4
Arthur M Wilson, David W Laks, Stephen M Davis: Process for etching sloped vias in polyimide insulators. Texas Instruments Incorporated, Mel Sharp, Rich Donaldson, Gary Honeycutt, January 18, 1983: US04369090 (29 worldwide citation)

A method for the fabrication of a cured polyamic acid film having apertures therein selectively etched to provide sidewalls sloped at a controlled angle. Such films are used in the fabrication of integrated circuits having two or more levels of metallization, to provide electrical insulation between ...


5
James R Peterson, Edward M Majors: Apparatus and method of forming aluminum balls for ball bonding. Texas Instruments Incorporated, Thomas W Demond, Rich Donaldson, Mel Sharp, June 7, 1983: US04387283 (27 worldwide citation)

An apparatus and method of forming aluminum balls utilized for ball bonding. The aluminum balls are formed in a moist argon atmosphere by applying an electrical potential across a spark gap causing a spark to occur which causes the end of the aluminum wire to melt, forming an aluminum ball.


6
Scott E Smith, Duy Loan T Le, Michael Ho: Write per bit with write mask information carried on the data path past the input data latch. Texas Instruments Incorporated, Rich Donaldson, Leo Heiting, William W Holloway, April 23, 1996: US05511025 (21 worldwide citation)

A dynamic random access memory part 30 provides a write per bit feature by locating the respective write mask information latches 118 adjacent the respective local I/O buffers 116. The write mask information thus passes through the data latch 108 and across the data path to the local I/O buffer 116 ...


7
David H Bradshaw: Method and apparatus for synchronizing and calibrating a receiver to a pulse width modulation transmitter. Texas Instruments Incorporated, Gary C Honeycutt, Rich Donaldson, Mel Sharp, April 27, 1982: US04327441 (20 worldwide citation)

An improvement in a communication system is disclosed having a transmitter which transmits a pulse width modulated control signal having a synchronizing pulse, a reference pulse, and at least one control function pulse encoded therein. At least one receiver receives the transmitted control signal an ...


8
Ernest J Russell: Leadframe-over-chip having off-chip conducting leads for increased bond pad connectivity. Texas Instruments Incorporated, William W Holloway, Rich Donaldson, Leo Heiting, August 13, 1996: US05545920 (17 worldwide citation)

A hybrid leadframe-over-chip (LOC) semiconductor package is generally comprised of bonding finger elements located over a surface of a semiconductor component and electrically coupled, by means of conducting wires, to the bonding pads located on the surface. In addition, at least one bonding finger ...


9
Roger D Norwood, Brian L Brown: Interface level programmability. Texas Instruments Incorporated, Richard Havill, Rich Donaldson, Leo Heiting, September 17, 1996: US05557219 (14 worldwide citation)

A system of interface circuits (15, 20-1 through 20-N) includes a mode sensing circuit (15) and one or more output circuits (20-1 through 20-N). The mode sensing circuit is arranged for producing control signals (on leads 22, 24) in response to an input signal (on lead 21). The output circuit (34-1) ...


10
Ernest J Russell: Integrated circuit lead frame for coupling to non-neighboring bond pads. Texas Instruments Incorporated, William W Holloway, Rich Donaldson, Leo Heiting, July 9, 1996: US05534729 (14 worldwide citation)

The present invention provides a modular electronic component (10) wherein a sequence: of leads (26) of a lead frame (12) differs from a sequence of bonding pads (16) on an integrated circuit (14). When lead frame (12) is placed adjacent integrated circuit (14), first and second power buses (22) and ...