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Guillermo L Romero, Joe L Martinez Jr: Method for coupling a power lead to a bond pad in an electronic module. Motorola, Rennie WIlliam Dover, August 13, 1996: US05544412 (185 worldwide citation)

An electronic module and a method for coupling a power lead (32) to a bond pad (28) on a semiconductor die (17) within the electronic module. A clip support (13) having a slot (27) is coupled to a baseplate (11) via an isolation structure (14). The semiconductor die (17) is coupled to the baseplate ...


2
Scott R Novis, William E Carns, Karen E Jachimowicz: Portable electronic device with transceiver and visual image display. Motorola, Rennie William Dover, February 2, 1999: US05867795 (179 worldwide citation)

A portable electronic device (10) including a virtual image display (20) positioned within a housing (11) or a remote unit (30), capable of providing an image of information contained on a smart card (18) as well as transactions processed in response to data transmitted by a two-way voice transceive ...


3
Alberto J Reyes, Daniel J Snyder, Sleiman N Chamoun, Karen S Ramondetta: Method of selecting device threshold voltages for high speed and low power. Motorola, Rennie William Dover, June 30, 1998: US05774367 (156 worldwide citation)

A method of selecting device (14-16, 18-24, 28-30) threshold voltages for high speed and low overall power involves identifying (42) the critical paths by predetermined timing criteria. All transistors have an initial, typically high, threshold voltage (40). Transistors outside the critical paths ke ...


4
Francine Y Robb, Stephen P Robb: Fabricating dual gate thin film transistors. Motorola, Joe E Barbee, Rennie William Dover, November 30, 1993: US05266515 (153 worldwide citation)

A method for fabricating a dual gate thin film transistor using a power MOSFET process having a first gate area (22) made from a monocrystalline silicon. A dielectric layer (25) is formed over the monocrystalline silicon. A first gate electrode (58) contacts the first gate area (22). A thin film tra ...


5
Denise M Ommen, Chi Taou Tsai, John Baird: Semiconductor package capable of spreading heat. Motorola, Rennie William Dover, March 14, 1995: US05397917 (127 worldwide citation)

A package (10, 37, 39) capable of spreading heat from a semiconductor die (25). The package (10, 37) includes a heat spreader (11) having a thickness of approximately 0.2 millimeters and a plurality of heat spreader clearance holes (16). The heat spreader (11) is coated with an adhesive material (17 ...


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Mavin C Swapp: Method for testing integrated devices. Motorola, Rennie William Dover, April 1, 1997: US05617035 (109 worldwide citation)

An integrated device test system (10, 40) having AC and DC measurement modes of operation comprises a drive circuit (11, 41), a programmable measurement unit (12) and a switch (18). The drive circuit (11, 41) may be a current mode drive circuit (11) or a voltage mode drive circuit (41). The drive ci ...


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Theodore G Tessier, John W Stafford, David A Jandzinski: Three dimensional semiconductor package having flexible appendages. Motorola, Kevin B Jackson, Rennie William Dover, Robert D Atkins, August 4, 1998: US05789815 (99 worldwide citation)

A three dimensional packaging approach reduces the overall footprint for interconnecting multiple semiconductor die. An three-dimensional folded module (10) produces a final package having a footprint size reduced by an approximate factor of four when compared to conventional electronic packaging. T ...


10
Brent W Quist: Method for shaping a pulse width and circuit therefor. Motorola, Rennie William Dover, Robert D Atkins, Lanny L Parker, April 6, 1999: US05892380 (97 worldwide citation)

A phase-frequency detector (12) is configured for operating at a high frequency. A transition of a clock signal (REF CLK) is detected by a first latch (52) and a signal UP is generated. A transition of a feedback signal (FBK) is detected by a second latch (56) and a signal DOWN is generated. An logi ...