1
Robert B Levy, Fred W Verdi: Electronic game having intelligent game pieces. AT&T Bell Laboratories, R B Levy, March 2, 1993: US05190285 (145 worldwide citation)

An electronic game (10) is provided with at least one, and preferably a plurality, of intelligent game pieces (14,14' ) which each contain a re-programamble memory device (30,70). The memory device (30,70) in each of the game pieces (14 and 14', respectively), stores characteristics of an activity t ...


2
David Schoenthaler, Thaddeus Wojcik: Method and apparatus for dispensing viscous materials. AT&T Technologies, R B Levy, November 11, 1986: US04622239 (107 worldwide citation)

An apparatus (28) for dispensing solder paste into openings (26-26) in a stencil (24) comprises a housing (30) having a piston (60) slidably mounted therein. A manifold (70), having a successively increasing cross-sectional area, is attached to a side wall (42) of the housing for admitting a viscous ...


3
Rajarshi Ray: Method and apparatus for inspecting articles. AT&T Technologies, R B Levy, August 25, 1987: US04688939 (69 worldwide citation)

Automated inspection of solder bumps (18--18) on a major surface (14) of a chip carrier (10) is accomplished by placing the chip carrier on a platform (22) beneath a ring light (28) which is in registration with a television camera (30). Light from the ring light, which is directed at an angle towar ...


4
Hibbert A Duncan, Francis J Ehret, Sherwin R Kahn, Karen H Kinney, Peter D Parry: Method for automatically identifying semiconductor wafers. AT&T Technologies, M M de Picciotto, R B Levy, April 29, 1986: US04585931 (58 worldwide citation)

A technique for automatically identifying a semiconductor wafer (30) having bar code identification indicia (32) on the front surface (31) thereof. Reading of the code is achieved by rotating the wafer about an axis (34) perpendicular to its front surface (31); directing a beam of radiant energy (37 ...


5
Albert D Correnti, James Potechin: Method and apparatus for handling semiconductor wafers. AT&T Technologies, M M de Picciotto, R B Levy, January 28, 1986: US04566726 (53 worldwide citation)

A semiconductor wafer pickup device (26) making use of vacuum and Bernoulli effect in order to hold the wafer (11) against the device and to minimize wafer contamination. The wafer pickup device comprises a centrally located Bernoulli orifice (32) and a plurality of peripherally located small tubula ...


6
Byoung S Kim: Method and apparatus for sensing tactile forces. AT&T Technologies, R B Levy, December 3, 1985: US04555954 (41 worldwide citation)

A tactile sensor (100) comprises a printed circuit board (102) having a plurality of spaced apart, electrically conductive foils (104) thereon, each coupled to a decoder (106) which selectively applies a voltage individually thereto. The foils are separated from each other by each of a plurality of ...


7
Paul A Keenan: Method for calibrating a SCARA robot. American Telephone and Telegraph Company, R B Levy, February 16, 1988: US04725965 (31 worldwide citation)

A technique is provided for calibrating a SCARA type robot (10) comprised of a first rotatable link (20) and a second link (32), rotatably connected at one end to the first link, and carrying a tool (40) at the other end thereof. The calibration technique relies on the fact that SCARA robots are con ...


8
Herbert A Lord: Method for reducing temperature variations across a semiconductor wafer during heating. AT&T Technologies, R B Levy, December 24, 1985: US04560420 (31 worldwide citation)

Temperature variations across the surface of a semiconductor wafer (12), having at least one major surface thereof exposed to a source of radiant heat energy (18), are reduced by positioning a reflective ring (30, 30', 30" or 30'") proximate the wafer edge (28). The reflective ring (30, 30', 30" or ...


9
Charles D Hechtman: High frequency test fixture. AT&T Technologies, M M dePicciotto, R B Levy, March 4, 1986: US04574236 (29 worldwide citation)

A high frequency test fixture (90) comprises a plurality of double-sided spring-loaded backdriving pins (99) positioned between a circuit board under test (41) and a stripline board (91) connected to an electronic tester. The double-sided backdriving pins (99) are located within through holes (98) o ...


10
Bruno Bosacchi, Robert C Oehrle: Method and apparatus for nondestructively determining the characteristics of a multilayer thin film structure. AT&T Technologies, R B Levy, November 25, 1986: US04625114 (28 worldwide citation)

Nondestructive characterization of each of the layers (d.sub.n) of a multilayer thin film structure (25) is obtained by directing a first beam of radiation (40) into an optical coupler (37) having a base (38) in contact with the surface of the structure (25). The angle of the beam entering the coupl ...