1
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Donald V Perino, Sayeh Khalili: Redistributed bond pads in stacked integrated circuit die package. Rambus, Pennie & Edmonds, April 23, 2002: US06376904 (139 worldwide citation)

A semiconductor module having a first integrated circuit die having a planar surface. The first integrated circuit die has a first conductive pad disposed substantially on the planar surface and a redistributed conductive pad electrically connected to the first conductive pad. The redistributed cond ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Semiconductor module with imbedded heat spreader. Rambus, Pennie & Edmonds, September 10, 2002: US06449159 (116 worldwide citation)

The invention provides a semiconductor module comprising a heat spreader, at least two semiconductors thermally coupled to the heat spreader, and a plurality of electrically conductive leads electrically connected to the semiconductors. The leads may form part of a flexible circuit at least partiall ...


3
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Donald V Perino, Sayeh Khalili: Redistributed bond pads in stacked integrated circuit die package. Rambus, Pennie & Edmonds, February 4, 2003: US06514794 (45 worldwide citation)

A semiconductor module having a first integrated circuit die having a planar surface. The first integrated circuit die has a first conductive pad disposed substantially on the planar surface and a redistributed conductive pad electrically connected to the first conductive pad. The redistributed cond ...


4
Belgacem Haba Belgacem (Bel) Haba
Donald V Perino, Belgacem Haba, Sayeh Khalili: Multiple channel modules and bus systems using same. Rambus, Pennie & Edmonds, December 2, 2003: US06657871 (38 worldwide citation)

Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.


5
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Donald V Perino, Sayeh Khalili: Redistributed bond pads in stacked integrated circuit die package. Rambus, Pennie & Edmonds, September 12, 2002: US20020127775-A1

A semiconductor module having a first integrated circuit die having a planar surface. The first integrated circuit die has a first conductive pad disposed substantially on the planar surface and a redistributed conductive pad electrically connected to the first conductive pad. The redistributed cond ...


6
Belgacem Haba Belgacem (Bel) Haba
Donald V Perino, Belgacem Haba, Sayeh Khalili: Multiple channel modules and bus systems using same. Rambus, Pennie & Edmonds, January 9, 2003: US20030007337-A1

Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.


7
Robert E Jacobson: Method and instruments for performing a percutaneous lumbar diskectomy. Pennie & Edmonds, October 8, 1985: US04545374 (901 worldwide citation)

A method for percutaneously accessing the lumbar region of the spinal column by laterally inserting a cannula through the patient's side above the pelvic crest to contact a predetermined position in the lumbar region and passing objects such as medical instruments through the cannula. This method is ...


8
David G Wuchinich: Endoscopic electrosurgical apparatus. Valleylab, Pennie & Edmonds, August 2, 1994: US05334183 (780 worldwide citation)

This invention relates to a surgical apparatus having four general embodiments: (1) the use of an ultrasonic vibrator and a radio frequency generator to simultaneously cut and cauterize tissue, (2) the use of an ultrasonic vibrator to cut tissue coupled with the independent use of a radio frequency ...


9
Ni Ding, Michael N Helmus: Drug release stent coating process. Schneider, Pennie & Edmonds, November 17, 1998: US05837313 (748 worldwide citation)

A method of coating implantable open lattice metallic stent prosthesis is disclosed which includes sequentially applying a plurality of relatively thin outer layers of a coating composition comprising a solvent mixture of uncured polymeric silicone material and crosslinker and finely divided biologi ...


10
Toru Baji, Yukio Nakano, Shiro Tanabe, Tetsuya Nakagawa, Hirotsugu Kojima: Multimedia bidirectional broadcast system. Hitachi, Pennie & Edmonds, June 25, 1991: US05027400 (738 worldwide citation)

A multimedia bidirectional broadcast system including a broadcast station and subscriber terminals. The broadcast station includes a main control unit having therein a data base control table in which program and commerical down load sequences are recorded depending on a setting effected by a subscr ...



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