1
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Donald V Perino, Sayeh Khalili: Redistributed bond pads in stacked integrated circuit die package. Rambus, Pennie & Edmonds, April 23, 2002: US06376904 (141 worldwide citation)

A semiconductor module having a first integrated circuit die having a planar surface. The first integrated circuit die has a first conductive pad disposed substantially on the planar surface and a redistributed conductive pad electrically connected to the first conductive pad. The redistributed cond ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Semiconductor module with imbedded heat spreader. Rambus, Pennie & Edmonds, September 10, 2002: US06449159 (117 worldwide citation)

The invention provides a semiconductor module comprising a heat spreader, at least two semiconductors thermally coupled to the heat spreader, and a plurality of electrically conductive leads electrically connected to the semiconductors. The leads may form part of a flexible circuit at least partiall ...


3
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Donald V Perino, Sayeh Khalili: Redistributed bond pads in stacked integrated circuit die package. Rambus, Pennie & Edmonds, February 4, 2003: US06514794 (46 worldwide citation)

A semiconductor module having a first integrated circuit die having a planar surface. The first integrated circuit die has a first conductive pad disposed substantially on the planar surface and a redistributed conductive pad electrically connected to the first conductive pad. The redistributed cond ...


4
Belgacem Haba Belgacem (Bel) Haba
Donald V Perino, Belgacem Haba, Sayeh Khalili: Multiple channel modules and bus systems using same. Rambus, Pennie & Edmonds, December 2, 2003: US06657871 (40 worldwide citation)

Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.


5
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Donald V Perino, Sayeh Khalili: Redistributed bond pads in stacked integrated circuit die package. Rambus, Pennie & Edmonds, September 12, 2002: US20020127775-A1

A semiconductor module having a first integrated circuit die having a planar surface. The first integrated circuit die has a first conductive pad disposed substantially on the planar surface and a redistributed conductive pad electrically connected to the first conductive pad. The redistributed cond ...


6
Belgacem Haba Belgacem (Bel) Haba
Donald V Perino, Belgacem Haba, Sayeh Khalili: Multiple channel modules and bus systems using same. Rambus, Pennie & Edmonds, January 9, 2003: US20030007337-A1

Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.


7
Robert E Jacobson: Method and instruments for performing a percutaneous lumbar diskectomy. Pennie & Edmonds, October 8, 1985: US04545374 (958 worldwide citation)

A method for percutaneously accessing the lumbar region of the spinal column by laterally inserting a cannula through the patient's side above the pelvic crest to contact a predetermined position in the lumbar region and passing objects such as medical instruments through the cannula. This method is ...


8
David G Wuchinich: Endoscopic electrosurgical apparatus. Valleylab, Pennie & Edmonds, August 2, 1994: US05334183 (826 worldwide citation)

This invention relates to a surgical apparatus having four general embodiments: (1) the use of an ultrasonic vibrator and a radio frequency generator to simultaneously cut and cauterize tissue, (2) the use of an ultrasonic vibrator to cut tissue coupled with the independent use of a radio frequency ...


9
Ni Ding, Michael N Helmus: Drug release stent coating process. Schneider, Pennie & Edmonds, November 17, 1998: US05837313 (772 worldwide citation)

A method of coating implantable open lattice metallic stent prosthesis is disclosed which includes sequentially applying a plurality of relatively thin outer layers of a coating composition comprising a solvent mixture of uncured polymeric silicone material and crosslinker and finely divided biologi ...


10
Charles Agee Atkins: System for the operation and management of one or more financial accounts through the use of a digital communication and computation system for exchange, investment and borrowing. Proprietary Financial Products, Pennie & Edmonds, July 1, 1997: US05644727 (741 worldwide citation)

A practical communication and computer based system and method for effecting exchange, investment and borrowing involves the use of digital communication and computation terminals distributed to users and service providers. Through the system described and its combined computer and communication ter ...