1
John R Pastore, Victor K Nomi, Howard P Wilson: Pad array semiconductor device with thermal conductor and process for making the same. Motorola, Patricia S Goddard, February 8, 1994: US05285352 (340 worldwide citation)

A pad array semiconductor device (35) includes a thermal conductor (28) integrated into a circuitized substrate (14). A semiconductor die (12) is mounted on the substrate overlying the thermal conductor to establish a thermal path away from the die. The thermal conductor may also be covered or surro ...


2
James J Casto: Leadless semiconductor device and method for making the same. Motorola, Patricia S Goddard, December 15, 1992: US05172214 (287 worldwide citation)

A semiconductor device having a thin package profile is leadless, thereby minimizing necessary mounting space on a substrate. In one form, a semiconductor device has a semiconductor die electrically coupled to a plurality of conductive leads. Each lead has a first portion, a second portion, and an i ...


3
Michael B McShane, Paul T Lin: Semiconductor device having dual electrical contact sites. Motorola, Patricia S Goddard, October 20, 1992: US05157480 (274 worldwide citation)

A semiconductor device having both bottom-side contacts and peripheral contacts provides surface mounting options. In one form, a semiconductor device die is positioned at a die receiving area of a leadframe. The leadframe also has a plurality of leads, each lead having a first and a second contact ...


4
Paul T Lin, Michael B McShane: Method for attaching conductive traces to plural, stacked, encapsulated semiconductor die using a removable transfer film. Motorola, Patricia S Goddard, December 28, 1993: US05273938 (273 worldwide citation)

A low cost manufacturing method is used to fabricate a small multichip semiconductor device (30). In one embodiment, a pattern of conductive traces (13) is formed on a film of transfer material (12). A first semiconductor die (15) is interconnected to the traces and a resin body (20) is formed aroun ...


5
Leo M Higgins III: Shielded electronic component assembly and method for making the same. Motorola, Patricia S Goddard, June 17, 1997: US05639989 (266 worldwide citation)

Electronic components are shielded from electromagnetic interference (EMI) by one or more conformal layers filled with selected filler particulars for attenuate specific EMI frequencies or a general range of frequencies. Shielding is accomplished through the use of a single general purpose shielding ...


6
Paul T Lin: Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery. Motorola, Patricia S Goddard, November 2, 1993: US05258648 (217 worldwide citation)

A composite flip chip semiconductor device (10) permits burn-in testing and rework to be performed on the device while also enhancing electrical, thermal, and mechanical device performance. The device includes a semiconductor die (12) having a plurality of bonding pads (14). Also included in the com ...


7
Frank Djennas, Isaac T Poku, Robert Yarosh: Semiconductor device having x-shaped die support member and method for making the same. Motorola, Patricia S Goddard, June 13, 1995: US05424576 (197 worldwide citation)

A semiconductor device (10) includes a lead frame (12) having tie bars (16). In one form of the invention, the tie bars are used to support a semiconductor die (20) to alleviate package cracking problems caused by stress and to provide a universal lead frame which is suitable for use with many diffe ...


8
James W Sloan, Timothy J Mennitt, John P Warren: Semiconductor device with test-only leads. Motorola, Patricia S Goddard, October 5, 1993: US05250841 (193 worldwide citation)

A semiconductor device (10) includes test-only leads (20) and operational leads (18). Operational leads (18) provide access to portions of a semiconductor die (12) needed for device operation. Test-only leads (20) provide access to portions of die (12) which are not needed for device operation, but ...


9
Paul T Lin, Michael B McShane: Liquid encapsulated ball grid array semiconductor device with fine pitch wire bonding. Motorola, Patricia S Goddard, November 21, 1995: US05468999 (187 worldwide citation)

A ball grid array semiconductor device (10) includes a package substrate (14 or 16) having a plurality of conductive traces (18), bond posts (20), and conductive vias (22). A semiconductor die (12) is mounted to the package substrate. Orthogonal wire bonds (28) are used to electrically connect stagg ...


10
Paul T Lin: Shielded liquid encapsulated semiconductor device and method for making the same. Motorola, Patricia S Goddard, July 25, 1995: US05436203 (182 worldwide citation)

A semiconductor (30) is shielded from electromagnetic interference by a combination of a reference plane (22) of a circuitized substrate (12) and two different encapsulants. The first encapsulant (38) is an electrically insulative encapsulant which mechanically protects a semiconductor die (32). The ...