1
Jerrold L King, Jerry M Brooks: Semiconductor chip package. Micron Technology, Ormiston Korfanta Dunbar & Holland PLLC, October 14, 1997: US05677566 (281 worldwide citation)

A semiconductor chip package that includes discrete conductive leads in electrical contact with bond pads on a semiconductor chip. This chip/lead assembly is encapsulated within an encapsulating material and electrode bumps are formed through the encapsulating material to contact the conductive lead ...


2
Robin Gilchrist, Michael S Wilhoit: Area specific temperature control for electrode plates and chucks used in semiconductor processing equipment. Micron Technology, Ormiston Korfanta Dunbar & Holland PLLC, December 8, 1998: US05846375 (182 worldwide citation)

A temperature control system to selectively control the temperature of specific areas of the chuck or electrode plate upon which a wafer is mounted during plasma etching, chemical vapor deposition and other such temperature dependent processes for the purpose of ultimately controlling the temperatur ...


3
Ernest C Nichols, Brian D Brown, Timothy A Strodtbeck, Kevin A Larsen, Shelby K Moore, John S Molebash: Notch finder and combination wafer transfer machine. Micron Technology, Ormiston Korfanta Dunbar & Holland PLLC, June 2, 1998: US05759007 (9 worldwide citation)

The invention provides a manually operated machine for radially aligning one or more semiconductor wafers. The machine includes an elongated first "notch" roller for rotatably engaging the edge of the wafers, a gear train, and a hand crank for manually rotating the first roller in cooperation with t ...


4
Rich Fogal, Michael B Ball: Extended travel wire bonding machine. Micron Technology, Ormiston Korfanta Dunbar & Holland PLLC, September 29, 1998: US05813590 (5 worldwide citation)

An extended travel wire bonding machine that includes a first positioning table movable along an X axis in a first horizontal plane, a second positioning table movable along X and Y axes in a second horizontal plane, the second positioning table being supported on the first positioning table, and a ...


5
Reid K Stubbs, Willard B Walch deceased: Universal headgate. Powder River, Ormiston Korfanta Dunbar & Holland PLLC, May 6, 1997: US05626100 (3 worldwide citation)

A headgate that includes a pair of spaced apart stanchions operable to move from an open position to a closed position in which the animal is confined about its neck. A pair of opposing yokes, made of a durable resilient material such as rubber or plastic, are positioned along the stanchions to defi ...


6
Ernest C Nichols: Manual wafer lift. Micron Technology, Ormiston Korfanta Dunbar & Holland PLLC, May 6, 1997: US05626207 (1 worldwide citation)

A water lift for lifting a series of vertically oriented wafers arranged parallel to one another in a cassette. The wafer lift comprises a lift plate and an actuator mechanism for raising the lift plate. The lift plate has a contact surface for engaging the edge of each of the wafers. The a contact ...