1
Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Resilient contact structures for interconnecting electronic devices. FormFactor, N Kenneth Burraston, Stuart L Markadeau, August 17, 2004: US06778406 (161 worldwide citation)

Resilient contact structures provide electrical interconnection between a semiconductor die and another electronic component. Multilayered packaging may be formed on the semiconductor die, and the resilient contact structures may be formed on portions of one or more of the layers. Heat dissipating s ...


2
Benjamin N Eldridge, Igor Y Khandros, David V Pedersen, Ralph G Whitten: Concurrent design and subsequent partitioning of product and test die. FormFactor, Stuart Merkadeau, N Kenneth Burraston, August 6, 2002: US06429029 (158 worldwide citation)

One embodiment of the present invention concerns a design methodology for generating a test die for a product die including the step of concurrently designing test circuitry and a product circuitry in a unified design. The test circuitry can be designed to provide a high degree of fault coverage for ...


3

4
Benjamin Niles Eldridge, Gary William Grube, Igor Yan Khandros, Gaetan L Mathieu: Resilient contact structures formed and then attached to a substrate. FormFactor, N Kenneth Burraston, June 5, 2007: US07225538 (129 worldwide citation)

Contact structures exhibiting resilience or compliance are formed. The contact structures may be formed on a sacrificial substrate. The contact structures are attached to an array of electrical connections on a substrate to form a contact assembly. The electrical connections on the substrate may be ...


5
Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Alec Madsen, Gaetan L Mathieu: Contact structures with blades having a wiping motion. FormFactor, N Kenneth Burraston, August 27, 2002: US06441315 (129 worldwide citation)

An apparatus providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such that the le ...


6
Gaetan L Mathieu: Method and system for compensating thermally induced motion of probe cards. FormFactor, N Kenneth Burraston, February 21, 2006: US07002363 (123 worldwide citation)

The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card ...


7
Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Probe card assembly. FormFactor, Stuart L Merkadeau, N Kenneth Burraston, September 23, 2003: US06624648 (122 worldwide citation)

A probe card assembly includes a probe card, a space transformer, and an interposer disposed between the space transformer and the probe card. Suitable mechanisms for adjusting the orientation of the space transformer without changing the orientation of the probe card, and for determining what adjus ...


8
Thomas H Dozier II, Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Interposer, socket and assembly for socketing an electronic component and method of making and using same. FormFactor, N Kenneth Burraston, Stuart L Merkadeau, December 30, 2003: US06669489 (117 worldwide citation)

Surface-mount, solder-down sockets permit electronic components such as semiconductor packages to be releasably mounted to a circuit board or other electronic component. In an embodiment, resilient contact structures extend through a support substrate, and solder-ball (or other suitable) contact str ...


9
Benjamin N Eldridge, Igor Y Khandros, David V Pedersen, Ralph G Whitten: Special contact points for accessing internal circuitry of an integrated circuit. FormFactor, N Kenneth Burraston, Stuart L Merkadeau, September 24, 2002: US06456099 (117 worldwide citation)

One embodiment of the present invention concerns an integrated circuit that includes bond pads and special contact pads or points. The bond pads are for interfacing the integrated circuit as a whole with an external circuit, and are to be bonded to a package or circuit board. The bond pads are dispo ...


10
Gaetan L Mathieu, Benjamin N Eldridge, Gary W Grube, Richard A Larder: Spring interconnect structures. FormFactor, Stuart L Merkadeau, N Kenneth Burraston, January 6, 2004: US06672875 (116 worldwide citation)

An interconnection element of a spring (body) including a first resilient element with a first contact region and a second contact region and a first securing region and a second resilient element, with a third contact region and a second securing region. The second resilient element is coupled to t ...