1
Belgacem Haba Belgacem (Bel) Haba
Haba Belgacem: Semiconductor module with serial bus connection to multiple dies. Rambus, Morgan Lewis & Bockius, December 21, 2004: US06833984 (111 worldwide citation)

A semiconductor module is provided which includes a beat spreader, at least two semiconductors thermally coupled to the heat spreader, and a plurality of electrically conductive leads electrically connected to the semiconductors. At least one of the electrically conductive leads is common to both of ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Memory module. Rambus, Morgan Lewis & Bockius, April 13, 2004: US06721189 (23 worldwide citation)

The memory module includes a substantially rigid first circuit board having at least one memory chip disposed thereon. The memory module also includes a substantially rigid second circuit board having an array of electrical contact points disposed on a planar surface thereof. A flexible connector el ...


3
Belgacem Haba Belgacem (Bel) Haba
Thomas F Fox, Sayeh Khalili, Belgacem Haba, David Nguyen, Richard Warmke, Xingchao Yuan: Stacked semiconductor module. Rambus, Morgan Lewis & Bockius, April 13, 2004: US06720643 (20 worldwide citation)

The semiconductor module is provided that includes a semiconductor housing and a plurality of integrated circuit dies positioned within the housing. The semiconductor module also includes a programmable memory device positioned within the housing and electrically coupled to the plurality of integrat ...


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Memory module. Rambus, Morgan Lewis & Bockius, March 14, 2006: US07012812 (10 worldwide citation)

The memory module includes a substantially rigid first circuit board having at least one memory chip disposed thereon. The memory module also includes a substantially rigid second circuit board having an array of electrical contact points disposed on a planar surface thereof. A flexible connector el ...


5
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Semiconductor stacked die devices and methods of forming semiconductor stacked die devices. Rambus, Morgan Lewis & Bockius, July 18, 2006: US07078790 (7 worldwide citation)

Semiconductor devices and methods of forming semiconductor devices are described. In one embodiment, at least one conductive structure is formed within a plurality of semiconductor substrates. At least portions of one of the conductive structures have oppositely facing, exposed outer surfaces. Indiv ...


6
Belgacem Haba Belgacem (Bel) Haba
Haba Belgacem: Semiconductor module. Rambus, Morgan Lewis & Bockius, October 17, 2006: US07122889 (6 worldwide citation)

The semiconductor module includes a substrate, at least one semiconductor, and electrical contacts. The substrate includes a base layer having a substantially planar base layer first surface opposing a substantially planar base layer second surface. The base layer first surface is exposed to atmosph ...


7
Belgacem Haba Belgacem (Bel) Haba
Thomas F Fox, Sayeh Khalili, Belgacem Haba, David Nguyen, Richard Warmke, Xingchao Yuan: Stacked semiconductor module. Rambus, Morgan Lewis & Bockius, May 2, 2006: US07037757 (5 worldwide citation)

The semiconductor module is provided that includes a semiconductor housing and a plurality of integrated circuit dice positioned within the housing. The semiconductor module also includes a programmable memory device positioned within the housing and electrically coupled to the plurality of integrat ...


8
Belgacem Haba Belgacem (Bel) Haba
Ravindranath T Kollipara, David Nguyen, Belgacem Haba: Clock routing in multiple channel modules and bus systems. Rambus, Morgan Lewis & Bockius, April 11, 2006: US07027307 (3 worldwide citation)

An apparatus is provided, which includes a memory interface circuit, a clock signal generating circuit, and a plurality of memory circuits. The memory circuits are operatively coupled and arranged in an order on a plurality of memory modules, such that the memory module positioned at the beginning o ...


9
Belgacem Haba Belgacem (Bel) Haba
Thomas F Fox, Sayeh Khalili, Belgacem Haba, David Nguyen, Richard Warmke, Xingchao Yuan: Stacked semiconductor module. Rambus, Morgan Lewis & Bockius, October 23, 2007: US07285443 (2 worldwide citation)

The semiconductor module is provided that includes a semiconductor housing and a plurality of integrated circuit dice positioned within the housing. The semiconductor module also includes a programmable memory device positioned within the housing and electrically coupled to the plurality of integrat ...


10
Belgacem Haba Belgacem (Bel) Haba
Ravindranath T Kollipara, David Nguyen, Belgacem Haba: Clock routing in multiple channel modules and bus systems and method for routing the same. Rambus, Morgan Lewis & Bockius, November 1, 2011: US08050042 (1 worldwide citation)

The terminating module and method include integrated circuits and a termination circuit which receive clock signals from the integrated circuit. The integrated circuit includes at least one memory integrated circuit mounted on a printed circuit board. An electrical connector is configured to couple ...



Click the thumbnails below to visualize the patent trend.