1
Mark K Kennedy: Behavior blocking utilizing positive behavior system and method. Symantec Corporation, McKay and Hodgson, Serge J Hodgson, Sean P Lewis, July 10, 2012: US08220055 (124 worldwide citation)

A method includes decreasing a suspicion of a negative action by an application if the application has previously performed a positive action. The positive action is an action that is never or rarely taken by malicious code. In one example, the positive action is use of a user interface element by t ...


2
William J Gauvin: Method and apparatus for securing documents using a position dependent file system. Symantec Corporation, McKay and Hodgson, Serge J Hodgson, Sean P Lewis, November 13, 2012: US08312064 (123 worldwide citation)

Access to information or a document is secured by a central global positioning authority that evaluates access requests in accordance with predefined policies. One component of an access request includes location information regarding at least one of the requesting entity and location of the request ...


3
Jin Seong Kim, Dong Joo Park, Kwang Ho Kim, Ye Sul Ahn: Semiconductor device and fabricating method thereof. Amkor Technology, McKay and Hodgson, Serge J Hodgson, September 3, 2013: US08525318 (93 worldwide citation)

Disclosed are a semiconductor device capable of efficiently radiating heat of a semiconductor die and a method of fabricating the same. The semiconductor device efficiently radiates the heat by preventing an encapsulant from reaching the semiconductor die by an encapsulant dam so that an upper surfa ...


4
Neil Edward McKeown: Method and apparatus to efficiently verify inventory. Intuit, McKay and Hodgson, Philip McKay, Sean P Lewis, January 1, 2013: US08346630 (83 worldwide citation)

A method and apparatus to efficiently verify inventory includes a process for verifying inventory in sub-sets using trigger parameters whereby priority status triggers are defined which indicate that an inventory item is particularly susceptible to inaccuracies/discrepancies between physical invento ...


5
Jin Young Kim, Doo Hyun Park, Seung Jae Lee: Wafer level fan out package. Amkor Technology, McKay and Hodgson, Serge J Hodgson, October 8, 2013: US08552556 (39 worldwide citation)

A wafer level fan out package includes a semiconductor die having a first surface, a second surface, and a third surface. A stiffener is disposed on the third surface of the semiconductor die. A conductive via passes through the stiffener. First and second electrically conductive patterns electrical ...


6
Ronald Patrick Huemoeller, Sukianto Rusli, David Jon Hiner: Buildup dielectric layer having metallization pattern semiconductor package fabrication method. Amkor Technology, McKay and Hodgson, Serge J Hodgson, January 1, 2013: US08341835 (32 worldwide citation)

A method of manufacturing a semiconductor package includes mounting and electrically connecting a semiconductor die to a substrate. The semiconductor die and the substrate are encapsulated to form an encapsulation. Via holes are laser-ablated through the encapsulation and conductive material is depo ...


7
Christopher John Berry, Ronald Patrick Huemoeller, David Jon Hiner: Direct-write wafer level chip scale package. Amkor Technology, McKay and Hodgson, Serge J Hodgson, May 29, 2012: US08188584 (31 worldwide citation)

A method and structure provides a Direct Write Wafer Level Chip Scale Package (DWWLCSP) that utilizes permanent layers/coatings and direct write techniques to pattern these layers/coatings, thereby avoiding the use of photoimagable materials and photo-etching processes.


8
Heinz Thummel: Floating side rail clamp weapon accessory mount adaptor. Laser Devices, McKay and Hodgson, Phillip McKay, March 12, 2013: US08393105 (27 worldwide citation)

A floating side rail clamp weapon accessory mount adaptor includes a stationary side rail clamp, a floating side rail clamp, and a leaf spring system that replaces prior art biasing plates. The floating side rail clamp moves as a single unit under evenly increasing influence provided by the leaf spr ...


9
Jong Sik Paek, Eun Sook Sohn, In Bae Park, Won Chul Do, Glenn A Rinne: Semiconductor device and manufacturing method thereof. Amkor Technology, McKay and Hodgson, Serge J Hodgson, January 29, 2013: US08362612 (24 worldwide citation)

A semiconductor device and a manufacturing method thereof are disclosed. A first insulation layer is formed on a semiconductor die, a redistribution layer electrically connected to a bond pad is formed on the first insulation layer, and a second insulation layer covers the redistribution layer. The ...


10
Christopher Peterson, Joseph H Chen: Heuristic detection malicious code blacklist updating and protection system and method. Symantec Corporation, McKay and Hodgson, Serge J Hodgson, Sean P Lewis, July 17, 2012: US08225405 (24 worldwide citation)

Unknown malicious code is heuristically detected on a host computer system. A virus signature for the malicious code is created locally on the host computer system. A blacklist on the host computer system is updated with the virus signature for the heuristically detected malicious code. Accordingly, ...