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Hsiang-Wen Tseng
Rong Ming Ho, Hui Wen Fan, Wen Hsien Tseng, Yeo Wan Chiang, Chu Chien Lin, Bao Tsan Ko, Bor Hunn Huang, Hsi Hsin Shih, Joung Yei Chen: Nanopatterned templates from oriented degradable diblock copolymer thin films. Industrial Technology Research Institute, Lowe Hauptman Ham & Berner, December 15, 2009: US07632544 (47 worldwide citation)

A nanopatterned template for use in manufacturing nanoscale objects. The nanopatterned template contains a nanoporous thin film with a periodically ordered porous geomorphology which is made from a process comprising the steps of: (a) using a block copolymerization process to prepare a block copolym ...


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Young Suk Han, Sung Wook Kim, Suk Kil Yoon: Nitride semiconductor light emitting device and method for manufacturing the same. Samsung Electro-Mechanics, Lowe Hauptman Ham & Berner, January 15, 2008: US07319044 (258 worldwide citation)

A nitride semiconductor light emitting device includes a substrate, an n-type nitride semiconductor layer formed on the substrate and provided with an electrode region of a predetermined area adjacent to a center of one lateral side of the top surface of the substrate, an n-type electrode formed on ...


3
Chang Sung Sean Kim, Jong Pa Hong, Joong El Ghim: Chemical vapor deposition apparatus. Samsung LED, Lowe Hauptman Ham & Berner, July 6, 2010: US07749326 (211 worldwide citation)

Provided is a chemical vapor deposition apparatus including a reaction chamber; a susceptor that is provided in the reaction chamber and has a plurality of wafers mounted thereon; a rotation driving unit that rotates the susceptor; a gas inlet that is provided in the reaction chamber and introduces ...


4
Jing Cheng Lin, Jui Pin Hung: Wafer-level packaging mechanisms. Taiwan Semiconductor Manufacturing Company, Lowe Hauptman & Ham, April 22, 2014: US08703542 (162 worldwide citation)

The embodiments of mechanisms of wafer-level packaging (WLP) described above utilize a planarization stop layer to determine an end-point of the removal of excess molding compound prior to formation of redistribution lines (RDLs). Such mechanisms of WLP are used to implement fan-out and multi-chip p ...


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Clement Hsingjen Wann, Chih Sheng Chang, Yi Tang Lin, Ming Feng Shieh, Ting Chu Ko, Chung Hsien Chen: System and methods for converting planar design to FinFET design. Taiwan Semiconductor Manufacturing Company, Lowe Hauptman & Ham, August 26, 2014: US08816444 (155 worldwide citation)

A method for generating a layout for a device having FinFETs from a first layout for a device having planar transistors is disclosed. The planar layout is analyzed and corresponding FinFET structures are generated in a matching fashion. The resulting FinFET structures are then optimized. Dummy patte ...


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Myungchul Kim, Sungwon Kang, Hammash Deema Ahmad Mohammad: Method and system for setting routing path considering hidden node and carrier sense interference, and recording medium thereof. KAIST, Lowe Hauptman Ham & Berner, October 30, 2012: US08300538 (148 worldwide citation)

A method of setting a routing path for transmitting a packet from a source node to a destination node in a wireless multi-hop network including plural nodes and plural links for connecting two nodes with each other. The method includes calculating carrier sense interference weights representing carr ...


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Shichao Ge: LED and LED lamp. Mane Lou, Lowe Hauptman Ham & Berner, March 3, 2009: US07497596 (145 worldwide citation)

This invention relates to a light emitting diode (LED) and a LED lamp consisted of LEDs. The LED comprises at least one LED chip. The LED is mounted on a high heat conductivity base and is connected to an applied power supply through a circuit board. The LED chip also has a transparent medium layer ...


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Ming Chieh Huang, Chan Hong Chern, David Barry Scott: Method and apparatus for energy harvest from ambient sources. Taiwan Semiconductor Manufacturing Company, Lowe Hauptman Ham & Berner, April 30, 2013: US08432071 (142 worldwide citation)

An energy harvesting system includes a plurality of transducers. The transducers are configured to generate direct current (DC) voltages from a plurality of ambient energy sources. A sensor control circuit has a plurality of sensors configured to detect the DC signals from the plurality of transduce ...


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Cheng Hsien Wu, Chih Hsin Ko, Clement Hsingjen Wann: Contact structure of semiconductor device. Taiwan Semiconductor Manufacturing Company, Lowe Hauptman & Ham, May 6, 2014: US08716765 (136 worldwide citation)

A contact structure for a semiconductor device includes a substrate comprising a major surface and a cavity. A bottom surface of the cavity is lower than the major surface. The contact structure also includes a strained material in the cavity, and a lattice constant of the strained material is diffe ...


10
Tae Woo Jung: Method for forming trench and method for fabricating semiconductor device using the same. Hynix Semiconductor, Lowe Hauptman Ham & Berner, July 19, 2011: US07981806 (123 worldwide citation)

A method for forming a trench includes providing a substrate, and forming the trench in the substrate using a gas containing chlorine (Cl2) gas as a main etch gas and SiFX gas as an additive gas, wherein a sidewall of the trench has a substantially vertical profile by virtue of reaction of the Cl2 g ...