1
Donald A Whiteman: Probe tip terminating device providing an easily changeable feed-through termination. Agilent Technologies, Leslie P Gehman, June 18, 2002: US06407562 (95 worldwide citation)

A probe tip adapter with easily interchangeable termination. It includes an empty circuit substrate with which the user may construct a probe adapter circuit designed specifically for almost any measurement situation. Also, several standard termination circuits may be easily interchanged by the user ...


2
John M Baron: Method and apparatus for the removal of flash artifacts. Hewlett Packard Development Company, Leslie P Gehman, February 22, 2005: US06859565 (91 worldwide citation)

An image without use of a flash is taken, along with an image using a flash. A difference image is generated by subtracting the flash-less image from the flash image. A threshold is applied to the difference image such that only large differences in intensity remain in the difference image. This art ...


3
John M Baron: Method and apparatus for the removal of flash artifacts. Hewlett Packard Development Company, Leslie P Gehman, April 11, 2006: US07027662 (63 worldwide citation)

An image without use of a flash is taken, along with an image using a flash. A difference image is generated by subtracting the flash-less image from the flash image. A threshold is applied to the difference image such that only large differences in intensity remain in the difference image. This art ...


4
Les Gehman: Method and apparatus for the display of temporal distance data. Hewlett Packard Development Company, Leslie P Gehman, August 23, 2005: US06933860 (56 worldwide citation)

An electronic device is built including a memory, a processor, and a display. The processor is configured to calculate an array of estimated travel time data from a first location to a plurality of locations within a destination area from a set of situational parameters and a set of user parameters. ...


5
Bradley E Clements, Joseph M White: Method for the fabrication of electrical contacts. Hewlett Packard Development Company, Leslie P Gehman, September 30, 2003: US06627092 (33 worldwide citation)

A method for the fabrication of electrical contacts using metal forming, masking etching, and soldering techniques is presented. The method produces a plurality of specialized electrical contacts, capable of use in an interposer, or other device, including non-permanent or permanent electrical conne ...


6
Terrel L Morris, Christian L Belady: Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump. Hewlett Packard Development Company, Leslie P Gehman, June 17, 2003: US06580610 (25 worldwide citation)

An assembly comprising an integrated cooling system/liquid containment system/EMI shield/pump housing/heat sink is built atop a multi-chip module. The attached devices are cooled by a spray of fluid, effecting a phase change from liquid to gas at the point of evaporation. Condensing liquid accumulat ...


7
Terrel L Morris: Laminated 90-degree connector. Hewlett Packard Company, Leslie P Gehman, August 28, 2001: US06280201 (19 worldwide citation)

A connector for electrically and mechanically connecting two circuit boards at a substantially 90-degree angle. The 90-degree connector may include surface mount devices, connections for mechanically attaching to circuit boards, surface mount pads or pins for electrically connecting to the circuit b ...


8
Thomas W Chen: Individually adjustable back-bias technique. Hewlett Packard Development Company, Leslie P Gehman, February 22, 2005: US06858897 (19 worldwide citation)

An individual-well adaptive method of body bias control that mitigates the effects of D2D and WD process variations is shown. It is assumed that p-type transistors are grouped in sections. The bodies of all the p-type transistors within a section are connected to a single n-well. This section size c ...


9
Christian L Belady, Shaun L Harris, Gary Wayne Williams, Brent A Boudreaux: Stack up assembly. Hewlett Packard Development Company, Leslie P Gehman, November 9, 2004: US06816378 (17 worldwide citation)

A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled ...


10
Christian L Belady, Christopher C Womack: Cell thermal connector. Hewlett Packard Development Company, Leslie P Gehman, December 7, 2004: US06829142 (15 worldwide citation)

A variable gap thermal interface is coupled with a cold or hot plate, forming a low thermal resistance connection between an electronic device module containing at least one heat generating electronic device and a rack or other structure. The variable gap thermal interface and the cold or hot plate ...



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