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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Yoichi Kubota: Manufacture of mountable capped chips. Tessera, Lerner David Litenberg Krumholz & Mentlik, December 9, 2008: US07462932 (11 worldwide citation)

A wafer or a portion of a wafer including capped chips such as surface acoustic wave (SAW) chips is provided with terminals by applying a terminal-bearing element such as a dielectric element with terminals and leads thereon, or a lead frame, so that the terminal-bearing element covers the caps, and ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Yoichi Kubota: Ball grid array with bumps. Tessera, Lerner David Litenberg Krumholz & Mentlik, November 11, 2004: US20040222518-A1

A semiconductor chip assembly includes a chip carrier having a dielectric layer and electrically-conductive terminals in the form of projecting bumps formed integrally with traces on the dielectric layer. The bumps have convex surfaces and desirably are hollow and deformable. The convex bottom ends ...


3
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz: Method of making assemblies having stacked semiconductor chips. Tessera, Lerner David Litenberg Krumholz & Mentlik, October 20, 2005: US20050233496-A1

A stacked microelectronic assembly comprises a flexible sheet having an obverse surface and a reverse surface and including at least a first panel and a second panel. The second panel and the first panel are adjacent to each other, the second panel including terminals on the reverse surface for moun ...


4
Belgacem Haba Belgacem (Bel) Haba
Bruce M McWilliams, Giles Humpston, Belgacem Haba, David B Tuckerman: Structure and method of making sealed capped chips. Tessera, Lerner David Litenberg Krumholz & Mentlik, April 21, 2005: US20050082653-A1

A method of making a plurality of sealed assemblies is provided which includes a) assembling a first element to a second element so that a bottom surface of the first element faces downwardly toward a front surface of the second element and a top surface of the first element faces upwardly away from ...


5
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba: Stacked microelectronic assemblies with central contacts. Tessera, Lerner David Litenberg Krumholz & Mentlik, June 2, 2005: US20050116358-A1

A stacked microelectronic assembly includes a dielectric element and a first and second microelectronic element stacked one on top of the other with the first microelectronic element underlying at least a portion of the second microelectronic element. The first microelectronic element and the second ...


6
Belgacem Haba Belgacem (Bel) Haba
John W Smith, Belgacem Haba: Semiconductor chip package with interconnect structure. Tessera, Lerner David Litenberg Krumholz & Mentlik, April 22, 2004: US20040077129-A1

An active microelectronic element such as a semiconductor chip or wafer is bonded to an interconnect element having substantially the same coefficient of thermal expansion as the active element using small, rigid bonds, desirably made by a solid-phase bonding technique, which accommodate numerous cl ...


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Belgacem Haba Belgacem (Bel) Haba
Robert Burtzlaff, Belgacem Haba, Giles Humpston, David B Tuckerman, Michael Warner, Craig S Mitchell: Back-face and edge interconnects for lidded package. Tessera, Lerner David Litenberg Krumholz & Mentlik, April 28, 2005: US20050087861-A1

A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion of the front surface of the chip, the lid having a top surface facing upwardly away from the chip and ...


8
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, John W Smith: Vapor phase connection techniques. Tessera, Lerner David Litenberg Krumholz & Mentlik, April 22, 2004: US20040075991-A1

Electrical connections are made between a pair of elements disposed on opposite side of the hole extending through a dielectric layer by evaporating a conductive material such as a metal having high vapor pressure within the hole while maintaining the hole in a substantially sealed condition. The pr ...


9
Belgacem Haba Belgacem (Bel) Haba
David B Tuckerman, Richard Dewitt Crisp, Belgacem Haba, Giles Humpston, Jae M Park: Package element and packaged chip having severable electrically conductive ties. Tessera, Lerner David Litenberg Krumholz & Mentlik, June 30, 2005: US20050139984-A1

According to one aspect of the invention, a capped chip is provided which includes a chip having a front surface, a back surface opposite the front surface and a plurality of bond pads exposed at at least one of the front and back surfaces. A cap is joined to the chip, the cap overlying one of the f ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Konstantine Karavakis: Method of making components with releasable leads. Tessera, Lerner David Litenberg Krumholz & Mentlik, November 4, 2004: US20040217003-A1

A connection component for making connections to a microelectronic element is made by providing leads on a surface of a polymeric layer and etching the polymeric layer to partially detach the leads from the polymeric layer, leaving a portion of each lead releasably connected to the polymeric layer b ...



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