1
Christopher G Angulas, Patrick T Flynn, Joseph Funari, Thomas E Kindl, Randy L Orr: Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders. Inernational Business Machines, Lawrence R Fraley, April 20, 1993: US05203075 (201 worldwide citation)

A method of bonding a flexible circuitized substrate to a circuitized substrate (e.g., printed circuit board) to interconnect selected circuitry of both substrates using solder. Solder paste is applied over conductive pads on the circuitized substrate and organic dewetting material (e.g., epoxy coat ...


2
Charles William Hall, Julian Dominick Rizzi, John Arthur Stubecki: Docking station for a portable computer providing rotational movement of the computers viewable screen in three different planes. International Business Machines Corporation, Lawrence R Fraley, May 12, 1998: US05751548 (194 worldwide citation)

A portable computer docking station that is capable of allowing rotational movement of the computer's viewable screen in at least three different planes, thereby facilitating viewing and other utilization (e.g., using a pen) of the screen within a motor vehicle. The docking station defined herein is ...


3
Chi S Chang, Joseph G Hoffarth, Voya R Markovich, Keith A Snyder, John P Wiley: High density circuit board and method of making same. International Business Machines Corporation, Lawrence R Fraley, March 2, 1993: US05191174 (179 worldwide citation)

A multilayered circuit board assembly which includes a plurality of layered subassemblies each having electrically conducting wiring and at least one through hole therein. A first of these subassemblies possesses a greater wiring dnesity than the others while a second subassembly possesses a lesser ...


4
David James Alcoe, Steven Wayne Anderson, Yifan Guo, Eric Arthur Johnson: Electronic package with strain relief means and method of making. International Business Machines Corporation, Lawrence R Fraley, March 2, 1999: US05877043 (176 worldwide citation)

An electronic package which includes a flexible substrate, stiffener and chip. The chip is bonded to the substrate, which was secured to the stiffener. Strain relief means are utilized at various locations in the package to prevent problems (e.g., tape "wrinkling") associated with relatively large d ...


5
Fletcher W Chapin, David W Dranchak, David E Engle, Richard R Hall, Thomas G Macek: High density connector. International Business Machines Corporation, Lawrence R Fraley, October 29, 1991: US05061192 (142 worldwide citation)

An electrical connector for interconnecting a pair of circuit members (e.g., circuit module and printed circuit board) which assures highly reliable yet separable connections for these members. The connector includes an electrically insulative (e.g., plastic) frame which defines an internal opening ...


6
Joseph G Ameen, Joseph Funari, David W Sissenstein Jr: Mutlilayered flexible circuit package. International Business Machines Corporation, Lawrence R Fraley, August 31, 1993: US05241454 (135 worldwide citation)

An electronic package which includes a rigid first substrate (e.g., ceramic) having a plurality of conductive pins spacedly located therein. These pins each include one end portion extending below an undersurface of the substrate for positioning and electrically coupling within a second substrate (e ...


7
James R Bentlage, David E Engle, Geoffrey R Mariner, John J Squires, John H Williams: Electronic package for high density applications. International Business Machines Corporation, Lawrence R Fraley, March 24, 1992: US05099393 (127 worldwide citation)

An electronic package including a first circuitized substrate (e.g., printed circuit board) and a flexible circuitized substrate wherein the flexible substrate is precisely aligned in removable manner relative to the first substrate. This is accomplished utilizing a retention member and associated f ...


8
John G Baumberger, James J Kershaw, James R Petrozello: Dual element electrical contact and connector assembly utilizing same. International Business Machines Corporation, Lawrence R Fraley, July 27, 1993: US05230632 (122 worldwide citation)

An electrical contact and connector assembly utilizing same wherein the contact includes a first, highly conductive element (e.g., oxygen-free copper) having a first modulus of elasticity and including a pair of contacting portions each of which is designed for engaging respective conductors on firs ...


9
Christopher G Angulas, Patrick T Flynn, Thomas E Kindl, Orr Randy L: Method of bonding flexible circuit to circuitized substrate to provide electrical connection therebetween. International Business Machines Corporation, Lawrence R Fraley, July 28, 1992: US05133495 (115 worldwide citation)

A method of bonding a flexible circuitized substrate to a circuitized substrate (e.g., printed circuit board) to interconnect selected circuitry of both substrates using solder. Solder paste is applied over conductive pads on the circuitized substrate and organic dewetting material (e.g., epoxy coat ...


10
Christopher G Angulas, Patrick T Flynn, Joseph Funari, Thomas E Kindl, Randy L Orr: Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different solders. International Business Machines Corporation, Lawrence R Fraley, November 16, 1993: US05261155 (113 worldwide citation)

A method of bonding a flexible circuitized substrate to a circuitized substrate (e.g., printed circuit board) to interconnect selected circuitry of both substrates using solder. Solder paste is applied over conductive pads on the circuitized substrate and organic dewetting material (e.g., epoxy coat ...