1
Shuji Nakamura, Steven DenBaars, Max Batres, Michael Coulter: Susceptor for MOCVD reactor. Cree, Koppel Patrick Heybl & Philpott, February 12, 2013: US08372204 (68 worldwide citation)

A susceptor for holding semiconductor wafers in an MOCVD reactor during growth of epitaxial layers on the wafers is disclosed. The susceptor comprises a base structure made of a material having low thermal conductivity at high temperature, and has one or more plate holes to house heat transfer plugs ...


2
John Durkee, Paul Kenneth Pickard: Troffer-style lighting fixture with specular reflector. Cree, Koppel Patrick Heybl & Philpott, December 9, 2014: US08905575 (65 worldwide citation)

An indirect troffer-style lighting fixture that is particularly well-suited for use with solid state light sources. An elongated heat sink with a mount surface for light sources runs longitudinally along the fixture. To facilitate heat dissipation, a portion of the heat sink is exposed to the ambien ...


3
Yifeng Wu, Marcia Moore, Tim Wisleder, Primit Parikh: Robust transistors with fluorine treatment. Cree, Koppel Patrick Heybl & Philpott, June 7, 2011: US07955918 (65 worldwide citation)

A semiconductor device, and particularly a high electron mobility transistor (HEMT), having a plurality of epitaxial layers and experiencing an operating (E) field. A negative ion region in the epitaxial layers to counter the operating (E) field. One method for fabricating a semiconductor device com ...


4
Roger Carignan, Clyde R Pratt: Marking template for installing a custom replacement device for resurfacing a femur and associated installation method. Kinamed, Koppel Patrick Heybl & Philpott, April 16, 2013: US08419741 (64 worldwide citation)

A replacement device for resurfacing a joint surface of a femur and a method of making and installing such a device is provided. The custom replacement device is designed to substantially fit the trochlear groove surface, of an individual femur, thereby creating a “customized” replacement device for ...


5
Randolph Cary Demuynck, Nicholas W Medendorp Jr: Standardized troffer fixture. Cree, Koppel Patrick Heybl & Philpott, June 9, 2015: US09052075 (41 worldwide citation)

A direct troffer-style fixture for solid state light sources and pan structures for use in these fixtures. The fixture comprises a door frame assembly that is attached to the pan. The pan housing is defined by a base and two angled side walls. End caps are attached to the side walls. End reflectors ...


6
Ashay Chitnis: Ohmic contacts to nitrogen polarity GaN. Cree, Koppel Patrick Heybl & Philpott, September 20, 2011: US08021904 (41 worldwide citation)

Contacting materials and methods for forming ohmic contact to the N-face polarity surfaces of Group-III nitride based semiconductor materials, and devices fabricated using the methods. One embodiment of a light emitting diode (LED) a Group-III nitride active epitaxial region between two Group-III ni ...


7
Ban P Loh, Nicholas W Medendorp Jr, Peter Andrews, Yankun Fu, Michael Laughner, Ronan Letoquin: Method of uniform phosphor chip coating and LED package fabricated using method. Cree, Koppel Patrick Heybl & Philpott, May 17, 2011: US07943952 (40 worldwide citation)

Methods for fabricating LED packages comprising providing an LED chip and covering at least part of it with a liquid medium. An optical element is provided and placed on the liquid medium. The optical element is allowed to settle to a desired level and the liquid medium is cured. LED packages are al ...


8
Eric J Tarsa, Michael Leung, Bernd Keller, Robert Underwood, Mark Youmans: System for and method for closed loop electrophoretic deposition of phosphor materials on semiconductor devices. Cree, Koppel Patrick Heybl & Philpott, October 22, 2013: US08563339 (27 worldwide citation)

One close loop system and method for electrophoretic deposition (EPD) of phosphor material on light emitting diodes (LEDs). The system comprises a deposition chamber sealed from ambient air. A mixture of phosphor material and solution is provided to the chamber with the mixture also being sealed fro ...


9
Thomas C Sloan, Bruce Quaal: Low profile extrusion. The Sloan Company, Koppel Patrick Heybl & Philpott, March 19, 2013: US08398262 (25 worldwide citation)

The present invention provides various embodiments for apparatuses and methods of manufacturing low profile housings for electronic and/or optoelectronic devices. Some embodiments provide low profile housings with a hollow casing comprising a first surface, second surface, and at least one lateral s ...


10
Christopher P Hussell, David T Emerson: Phosphor distribution in LED lamps using centrifugal force. Cree, Koppel Patrick Heybl & Philpott, May 1, 2012: US08167674 (24 worldwide citation)

A method of manufacturing an LED lamp is disclosed. The method includes admixing an uncured curable liquid resin and a phosphor, dispensing the uncured admixture on an LED chip, centrifuging the chip and the admixture to disperse the phosphor particles in the uncured resin, and curing the resin whil ...