1
Bin Zhao, Prahalad K Vasudev, Valery M Dubin, Yosef Shacham Diamand, Chiu H Ting: Selective electroless copper deposited interconnect plugs for ULSI applications. Sematech, Kidd & Booth, October 7, 1997: US05674787 (425 worldwide citation)

A method or utilizing electroless copper deposition to selectively form encapsulated copper plugs to connect conductive regions on a semiconductor. A via opening in an inter-level dielectric (ILD) provides a path for connecting two conductive regions separated by the ILD. Once the underlying metal l ...


2
Anil K Pant, Joseph R Breivogel, Douglas W Young, Rahul Jairath, Erik H Engdahl: Sensors for a linear polisher. Lam Research Corporation, Kidd & Booth, June 9, 1998: US05762536 (73 worldwide citation)

A technique for utilizing sensors to monitor the polishing of a semiconductor wafer when a linear polisher is utilized to polish the wafer. The sensors are distributed along the surface or are coupled to openings along the surface to monitor the on-going polishing process. The sensed information fro ...


3
Anil K Pant, Douglas W Young, Anthony S Meyer, Konstantin Volodarsky, David E Weldon: Control of chemical-mechanical polishing rate across a substrate surface. Ontrak Systems, Kidd & Booth, September 1, 1998: US05800248 (70 worldwide citation)

A technique for controlling a polishing rate across a substrate surface when performing CMP, in order to obtain uniform polishing of the substrate surface. A support housing which underlies a polishing pad includes a plurality of openings for dispensing a pressurized fluid. The openings are arranged ...


4
Anthony S Meyer, Thomas G Mallon, Bradley Withers, Douglas W Young: Technique for improving within-wafer non-uniformity of material removal for performing CMP. Lam Research Corporation, Kidd & Booth, March 3, 1998: US05722877 (67 worldwide citation)

A platen ring for use with a platen on a linear polisher, in which the platen ring is used to reduce fluctuation of the belt/pad assembly as it encounters the platen. The platen ring is disposed around the platen so that a fluctuation of the belt/pad assembly is dampened before the belt/pad assembly ...


5
Patrick Maupin, Tom Martin: System for transmitting and receiving combination of compressed digital information and embedded strobe bit between computer and external device through parallel printer port of computer. Video Associates Labs, Kidd & Booth L, July 29, 1997: US05652917 (56 worldwide citation)

A unique combination of software and hardware provides any computer with a system for high speed digital data communications using the computer's standard parallel printer port. The disclosed embodiment of the invention allows any computer with a standard parallel printer port to play or record digi ...


6
James A Moore: Self isolating high frequency saturable reactor. Sematech, Kidd & Booth, June 23, 1998: US05770982 (52 worldwide citation)

The present invention discloses a saturable reactor and a method for decoupling the interwinding capacitance from the frequency limitations of the reactor so that the equivalent electrical circuit of the saturable reactor comprises a variable inductor. The saturable reactor comprises a plurality of ...


7
Janos Farkas, Rahul Jairath, Matt Stell, Sing Mo Tzeng: Method of using additives with silica-based slurries to enhance selectivity in metal CMP. Sematech, Intel Corporation, National Semiconductor, Digital Equipment, Kidd & Booth, March 25, 1997: US05614444 (49 worldwide citation)

A method of using additives with silica-based slurries to enhance metal selectivity in polishing metallic materials utilizing a chemical-mechanical polishing (CMP) process. Additives are used with silica-based slurries to passivate a dielectric surface, such as a silicon dioxide (SiO.sub.2) surface, ...


8
Michael Tucker: System for extracting targets from radar signatures. Fastman, Kidd & Booth L, March 18, 1997: US05612700 (26 worldwide citation)

The present invention discloses a system for extracting targets from radar signatures. Disclosed is a unique combination of Wavelet technology and neural networks using fractal geometry techniques that estimates the Fractal Dimension of a target even in the presence of high background noise.


9
Anil K Pant, Douglas W Young, Joseph R Breivogel, Konstantin Volodarski, Leon Volfovski: Method and apparatus for aligning and tensioning a pad/belt used in linear planarization for chemical mechanical polishing. Lam Research Corporation, Kidd & Booth, February 16, 1999: US05871390 (22 worldwide citation)

The present invention describes an apparatus and method for aligning a pad/belt on a roller for use in chemical mechanical polishing using linear planarization. The present invention comprises an alignment sensor that senses the alignment of the pad/belt. The present invention additionally comprises ...


10
Bin Zhao, Prahalad K Vasudev: Electric field initiated electroless metal deposition. Sematech, Kidd & Booth, August 26, 1997: US05660706 (16 worldwide citation)

A technique for utilizing an electric field to initiate electroless deposition of a material to form layers and/or structures on a semiconductor wafer. The wafer is disposed between a positive electrode and a negative electrode and disposed so that its deposition surface faces the positive electrode ...