1
Charles W Eichelberger, James E Kohl: Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system. EPIC Technologies, Kevin P Radigan Esq, Heslin Rothenberg Farley & Mesiti P C, November 17, 2009: US07619901 (310 worldwide citation)

Circuit structures and methods of fabrication are provided for facilitating implementing a complete electronic system in a compact package. The circuit structure includes, in one embodiment, a chips-first multichip base layer with conductive structures extending therethrough. An interconnect layer i ...


2
Charles W Eichelberger, James E Kohl, Michael E Rickley: Electroless metal connection structures and methods. EPIC Technologies, Kevin P Radigan Esq, Heslin Rothenberg Farley & Mesiti P C, May 28, 2002: US06396148 (177 worldwide citation)

Chips first packaging structures and methods of fabrication are presented which employ electroless metallizations. An electroless barrier metal is disposed over and in electrical contact with at least one aluminum contact pad of the chips first integrated circuit. The electroless barrier metal is a ...


3
Marcos N Novaes, Gregory D Laib, Jeffrey S Lucash, Ronald T Goering, George Sohos: Method, system and program products for managing cluster configurations. International Business Machines Corporation, Lawrence D Cutter Esq, Kevin P Radigan Esq, Heslin Rothenberg Farley & Mesiti P C, January 25, 2005: US06847993 (140 worldwide citation)

Various components are provided to manage a clustered environment. These components include a System Registry that provides a global data storage; a Configuration manager that stores data locally on nodes of the clustered environment and globally within the System Registry; a Liveness component to p ...


4
Richard C Chu, Michael J Ellsworth Jr, Donald W Porter, Roger R Schmidt, Robert E Simons: Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack. International Business Machines Corporation, Lily Neff Esq, Kevin P Radigan Esq, Heslin Rothenberg Farley & Mesiti P C, June 10, 2008: US07385810 (126 worldwide citation)

Apparatus and method are provided for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover hingedly affixed to an air outlet side of the rack. The heat exchange assembly includes a support frame, an air-to-liquid heat exchanger, and first and ...


5
Charles W Eichelberger, James E Kohl: Compliant, solderable input/output bump structures. EPIC Technologies, Kevin P Radigan Esq, Heslin Rothenberg Farley & Mesiti P C, April 29, 2003: US06555908 (117 worldwide citation)

Structures and methods are provided for electrically interconnecting and absorbing stress between a first electrical structure and a second electrical structure. In one embodiment, non-conductive compliant bumps are disposed on at least one of the structures and a metal layer is provided over a surf ...


6
Charlene Ann Gebler, Barbara A Hall, Agnes Yee Ngai, Michael Patrick Vachon: Sharing reference data between multiple encoders parallel encoding a sequence of video frames. International Business Machines Corporation, William H Steinberg Esq, Kevin P Radigan Esq, Heslin Rothenberg Farley & Mesiti P C, March 12, 2002: US06356589 (115 worldwide citation)

A digital video encode system, method and computer program product are described wherein a picture is divided into multiple active areas that are parallel encoded using multiple encoders. The encoders associated with adjoining active areas of the picture are configured to exchange reference data to ...


7
Richard C Chu, Michael J Ellsworth Jr, Roger R Schmidt, Robert E Simons, Randy J Zoodsma: Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems. International Business Machines Corporation, Lily Neff Esq, Kevin P Radigan Esq, Heslin Rothenberg Farley & Mesiti P C, September 12, 2006: US07106590 (104 worldwide citation)

A cooling system is provided employing multiple coolant conditioning units (CCUs). Each CCU, which is coupled to a different, associated electronics rack of multiple electronics racks to be cooled, includes a heat exchanger, a first cooling loop with a control valve, and a second cooling loop. The f ...


8
James Lewis Levine, Michael Alan Schappert: Method and adapter for performing assistive motion data processing and/or button data processing external to a computer. International Business Machines Corporation, Marian Underweiser Esq, Kevin P Radigan Esq, Heslin Rothenberg Farley & Mesiti P C, November 18, 2003: US06650313 (103 worldwide citation)

Assistive motion data processing and/or button data processing is performed in an adapter on user inputted variable data produced by a pointing device prior to communication to a computer. This processing may include one or more of processing to filter coordinate deviations from a desired path cause ...


9
Richard C Chu, Michael J Ellsworth Jr, Roger R Schmidt, Robert E Simons: Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack. International Business Machines Corporation, Lily Neff Esq, Kevin P Radigan Esq, Heslin Rothenberg Farley & Mesiti P C, March 14, 2006: US07012807 (102 worldwide citation)

A thermal dissipation assembly and method, and a cooled multi-drawer electronics rack are provided having a first cooling loop and a second cooling loop. The first cooling loop is disposed substantially within an electronics drawer and positioned to extract heat from an electronics module within the ...


10
Richard C Chu, Michael J Ellsworth Jr, Robert E Simons: Electronic module with integral refrigerant evaporator assembly and control system therefore. International Business Machines Corporation, Andrew J Wojnicki Esq, Kevin P Radigan Esq, Heslin Rothenberg Farley & Mesiti P C, April 2, 2002: US06366462 (93 worldwide citation)

An electronic module is provided having an integrated refrigerant evaporator assembly coupled to a closed-cycle cooling system, as well as a method for controlling the system. The module and integrated assembly includes a plurality of integrated circuit chips arrayed on a substrate. The evaporator a ...