1
Geoffrey Shippee: Shared receive path for simultaneous received signals. QUALCOMM Incorporated, Kam T Tam, Charles Brown, Thomas R Rouse, August 21, 2007: US07260416 (135 worldwide citation)

A method and apparatus are disclosed for a wireless communication device to simultaneously receive at least two signals. Two receiver portions are provided in the wireless communication device. A first receiver portion is configured to receive a first communication signal. A second receiver portion ...


2
Fwu Iuan Hshieh: Semiconductor cell array with high packing density. MagePower Semiconductor, Kam T Tam, December 21, 1999: US06005271 (88 worldwide citation)

A MOSFET (Metal Oxide Semiconductor Field Effect Transistors) cell array formed on a semiconductor substrate includes a major surface formed with a plurality of MOSFET cells. Each semiconductor cell in the cell array is geometrically configured with a base portion and a plurality of protruding porti ...


3
Raymond T Hsu, Ragulan Sinnarajah: Wireless local access network system detection and selection. Qualcomm Incorporated, Philip Wadsworth, Thien Nguyen, Kam T Tam, December 5, 2006: US07146130 (87 worldwide citation)

Method and apparatus for detection and selection of Wireless Local Area Network (WLAN) service. A cellular network may provide an advertisement for a WLAN, such as in an overhead signaling message. The advertisement may identify the Access Point(s) by an Extended Service Set Identifier (ESSID). The ...


4
Avneesh Agrawal: Soft handoff with interference cancellation in a wireless frequency hopping communication system. QUALCOMM Incorporated, Kam T Tam, Charles Brown, Thomas R Rouse, August 7, 2007: US07254158 (80 worldwide citation)

Techniques are provided to support soft handoff in a frequency hopping OFDMA system. Each sector concurrently supports “non-handoff” users and “soft-handoff” users. A non-handoff user communicates with only one sector, and a soft-handoff user communicates with multiple sectors simultaneously. Non-ha ...


5
Fwu Iuan Hshieh, Koon Chong So: Method of forming a semiconductor structure having reduced threshold voltage and high punch-through tolerance. MagePower Semiconductor, Kam T Tam, May 25, 1999: US05907776 (73 worldwide citation)

A power MOSFET (Metal Oxide Semiconductor Field Effect Transistor) device formed on a semiconductor substrate having a body region of a first conductivity type diffused in a semiconductor substrate with an epitaxial layer of a second conductivity type. There is also a source region of a second condu ...


6
Edward F Goldstein: Electrically conductive interconnection through a body of semiconductor material. Kam T Tam, June 18, 1996: US05528080 (69 worldwide citation)

Conductive feed-throughs formed by partially migrating conductive material in a body of semiconductor material are used to provide electrical interconnections between the semiconductor surfaces. In addition, the conductive feed-throughs furnish mechanical support and thermal dissipation paths for th ...


7
Amer Catovic, Oronzo Flore, Rajarshi Gupta, Parag A Agashe: Geographic-based measurement and logging of radio coverage related information by mobile devices. QUALCOMM Incorporated, Kam T Tam, March 4, 2014: US08666388 (52 worldwide citation)

Providing for automated wireless network signal analysis by mobile devices as a function of their geographic locations is described herein. By way of example, a wireless network can transmit a set of geographic data defining a geographic region to a mobile device. The mobile device can compare its c ...


8
Alkinoos Hector Vayanos, Francesco Grilli: Outer coding methods for broadcast/multicast content and related apparatus. QUALCOMM Incorporated, Kam T Tam, Robert A Young, Tom Rouse, January 8, 2008: US07318187 (52 worldwide citation)

Transmission techniques are provided that improve service continuity and reduce interruptions in delivery of content that can be caused by transitions that occur when the User Equipment (UE) moves from one cell to the other, or when the delivery of content changes from a Point-to-Point (PTP) connect ...


9
Edward F Goldstein: Electrically conductive interconnection through a body of semiconductor material. Kam T Tam, September 5, 1995: US05447871 (51 worldwide citation)

Methods and structures of an etched-back thermomigrated interconnection which provides means for electrically connecting coplanar surfaces of a body of semiconductor material while concurrently providing means of making mechanical, electrical, and thermal external connections to the body of semicond ...


10
Fwu Iuan Hshieh: Method of forming a semiconductor structure with uniform threshold voltage and punch-through tolerance. MagePower Semiconductor, Kam T Tam, April 18, 2000: US06051468 (46 worldwide citation)

A MOSFET (Metal Oxide Semiconductor Field Effect Transistors) structure is fabricated by first forming a plurality of trenches in a semiconductor substrate which includes a major surface. The trenches are then lined with insulating material and thereafter filled with conductive material. The process ...