1
David Sherrer
Dan A Steinberg, David W Sherrer: Optical waveguide switch. Jones Volentine, November 15, 2001: US20010041026-A1 (4 worldwide citation)

An optical switch includes a first wavedguide holding member and a second waveguide holding member disposed on a substrate. The first waveguide holding member moves relative to the second waveguide holding member. A movement guiding member guides the motion of the first waveguide holding member and ...


2
David Sherrer
Dan A Steinberg, David W Sherrer, Mindaugas F Dautartas, Donald E Leber: Optical waveguide devices and methods of fabricating the same. Jones Volentine Pllc, March 7, 2002: US20020028037-A1 (3 worldwide citation)

A first waveguide holding member has a first transverse surface region and a first optical waveguide having an end terminating at the first transverse surface region. A second waveguide holding member has a second transverse surface region which confronts the first transverse surface region of the f ...


3
David Sherrer
Dan A Steinberg, David W Sherrer: Optical waveguide switch. Jones Volentine, February 28, 2002: US20020025104-A1 (3 worldwide citation)

A first waveguide holding member has a principal surface which confronts the principal surface of a second waveguide holding member. Each principal surface has a stepped configuration defined by an upper surface region, a lower surface region and a transverse region which separates the upper and low ...


4
David Sherrer
Dan A Steinberg, David W Sherrer: Connector structure for integrated optic waveguide devices. Jones Volentine, November 15, 2001: US20010041029-A1

An optical interconnect includes a waveguide holder having a first side and a second side. The first side has a first depression and the second side has a second depression. The waveguide holder has an opening in which a plurality of waveguides are disposed


5
David Sherrer
David W Sherrer: Optical waveguide ferrule and method of making an optical waveguide ferrule. Jones Volentine Pllc, December 27, 2001: US20010055449-A1

A waveguide carrier is located within a carrier tube, and an optical waveguide extends lengthwise in a longitudinal direction within the waveguide carrier. The waveguide carrier is made up of a first carrier body having a first principal surface and a second carrier body having a second principal su ...


6
David Sherrer
Dan A Steinberg, Mindaugas F Dautartas, David W Sherrer: Method of fabricating optical filters. Jones Volentine, January 31, 2002: US20020012172-A1

A method of fabricating optical filter is disclosed. The method includes providing the substrate and selectively etching the substrate to form a plurality of freestanding layers. A plurality of dielectric layers is disposed over an outer surface of each of the freestanding layers. The resultant opti ...


7
David Sherrer
Dan A Steinberg, Mindaugas F Dautartas, David W Sherrer: Multi-level lithography masks. Jones Volentine, March 14, 2002: US20020031711-A1

A lithography multi-level mask includes a base layer with at least one mesa disposed over the base layer. The mesa has a first transmittance and the substrate has a second transmittance. The first transmittance is greater than or equal to the second transmittance. An image lithography method include ...


8
David Sherrer
Dan A Steinberg, David W Sherrer: Multi-level optical structure and method of manufacture. Jones Volentine, January 31, 2002: US20020012885-A1

A multi-level optical device includes a substrate having a baseline level. At least one feature is disposed at a level above the baseline level. At least one feature is disposed at a level below the baseline level, or in the feature above the baseline level is located at a distance apart from the fe ...


9
Sang Bom Kang, Sang In Lee: Method of and apparatus for forming a metal interconnection in the contact hole of a semiconductor device. Samsung Electronics, Jones Volentine, October 31, 2000: US06139700 (255 worldwide citation)

A method and an apparatus of fabricating a metal interconnection in a contact hole of a semiconductor device reduces contact resistance and improves step coverage. A contact hole is opened in an interlayer insulating film formed on a semiconductor substrate. A conductive layer used as an ohmic conta ...


10
Gun Ho Song, Si Chan Sung: Method of producing lead frame having uneven surfaces. Samsung Electronics, Jones Volentine L, March 6, 2001: US06197615 (225 worldwide citation)

A lead frame for manufacturing semiconductor device packages has inner leads, tie bars and a die pad that are formed with irregular dimples on their respective upper and lower surfaces. This improves the bonding strength between the lead frame and the molding compound as well as between the die pad ...